Find product data here! Online purchases moving to BoydDirect
To improve your web experience, Boyd is consolidating and redesigning our ShopAavid Online Storefront. Product data previously found on ShopAavid is now available in the page links below on boydcorp.com. We are working hard to make products purchasable online from our new webstore, BoydDirect. In the meantime, please find the product you’re interested in using the quick links below and request a quote. We’ll be glad to quote you a specific product.
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Low cost heat sinks designed for cooling semiconductor devices on printed circuit boards.
Standard configurations for common semiconductor devices.
Available in raw bar, cut to length, or machined to specifications. Hundreds of optimized profiles.
Epoxied, soldered, or brazed fins in an extruded or cast base in order to achieve a higher fin aspect ratio and fin density.
Improve heat sink performance with the addition of an impinged axial fan.
Increase air flow with axial fans specialized for thermal management applications.
Increase air flow against high air flow resistances like dense fin arrangements to improve heat transfer.
The Hi-Contact™ pressed tube geometry enables lower thermal resistance between fluid flow and mounted surfaces.
Low thermal resistance for removing high power loads.
Enable high heat dissipation between fluid flows.
Complete liquid cooling systems using liquid for heat transfer and ambient air for dissipation.
Thermally conductive adhesive tapes act as both a thermal and mechanical joint, ideal for creating complex layered assemblies.
Epoxies and glues that provide both thermal conductivity and strong adhesion and can be used where no mounting holes are available.
Compliant thermally conductive materials designed to accomodate variations in surfaces.
Rubber pads that often come with tear resistance for more rugged applications.
Low cost thermal insulators designed for easy application and improved heat conductance.
Thermally conductive compounds with high wet-out and thin bondlines that eliminates air in the interface area.
Available in a range of base materials to provide a variety of dielectric and thermally conductive attributes.
Enhance air cooling solutions with the high capacity and speed heat transfer of heat pipes.
Increase the efficiency of heat sinks with vapor chamber heat spreading.
Utilize passive and fast two phase heat transfer to dissipate high heat loads.
Securely attach discrete devices to heat sinks.
All the hardware for through hole mounting in a single kit.
Learn more about how Boyd uses a variety of technologies to use conduction, convection, radiation, and insulation to help manage system temperatures.
SLearn more about how the variety of services and capabilities that Boyd utilizes to design and fabricate comprehensive, cost effective solutions for our customers.
Have questions? We're ready to help!