Semiconductor

Logic and memory burn-in and test sockets feature innovative contact technology that gives more reliable electrical and mechanical interconnect. Contact design is optimized to minimize damage to the solder ball with lowest possible actuation force. Contacts open to allow package insertion for 0.5mm pitch and above. Several contact technologies, both through- hole and compression mount, are used for finer pitch packages < 0.5mm. Platform design gives ultimate flexibility in base sockets than can be used for different package sizes leveraging an adapter customized for specific customers’ packages. Changing an adapter to the socket is faster and lower cost than providing new sockets for each package size. Modifying base designs allows us to help customers choose the smallest socket footprint to maximize burn-in board capacity and through-put.

Liquid-free thermal systems leverage innovative phase change technologies to provide a temperature forcing range from -55°C to 250°C for semiconductor testing in multiple stages throughout the manufacturing cycle. Phase change technologies enable quieter, portable test solutions with fast stabilization, superior power handling, and precision control. Easy-to-integrate thermal forcing systems in the industry’s smallest footprint can be used in your test environment, or into production automated test equipment. Thermal forcing systems accommodate a wide range of device sizes and types, whether socketed or soldered down. Applications include DUT level thermal management, thermal stream replacement, temperature forcing, handler integrations, ATE test, bench testing, system level testing, high reliability testing, and OEM integrations.

Semiconductor automated test equipment (ATE) operates at high speed and power, requiring advanced liquid cooling systems. Boyd’s innovative liquid cooling systems optimize each step in testing a semiconductor for ultimate quality control with maximum test cycle efficiency for trusted reliability and fastest speed to market. Liquid cold plates driven by efficient liquid cooling systems and chillers with particulate-free, non-toxic SOLIMIDE® Foam thermal insulation keep fluid lines cold so wafers and chips are tested at safe temperatures in pure environments. Optimized thermal management and insulation protects sensitive components from excessive heat loads and contaminants while decreasing thermal cycle test times.

Comprehensive direct to chip cooling solutions range from air cooling to high efficiency liquid cooling and innovative immersion cooling development that maximize thermal density and enable higher processing power in the most compact format. Cool switch chips up to 2200 watts (W), GPUs up to 750W, and IGBTs up to 6KW now with continued research and development from Boyd to push power density and compute performance boundaries to the next level.

Leveraging high performance fans and blowers with remote heat pipe-heat sink advanced assemblies, extreme air cooling can easily be routed to cool entire blades and racks in cloud applications while maximizing server density and using existing facility plumbing for efficient performance upgrades in current infrastructure. Liquid loops and liquid cold plates cooled by coolant distribution units (CDUs) or other liquid cooling systems provide highest performance direct to chip liquid cooling for advanced GPUs, CPUs, and switch chips. Custom skyline liquid cold plates create the most efficient thermal interface between liquid systems and the processors, customized to maximize thermal efficiency for each system installation. This maximizes full system performance and environmental sustainability while enabling higher processing density and longer semiconductor lifetimes for marketable performance differentiation.

Sophisticated fabrication and automated test equipment streamlines quality assurance during production and requires levels of precision that can only be achieved with high performance engineered material solutions. Pure, stable, and ultraclean materials help maintain a contaminant-free production and test environment required for high quality, reliable semiconductors. Vibration mitigation, environmental sealing, thermal insulation, electrical isolation, high temperature bonding, FFKM o-rings, and EMI and RF shielding protect semiconductors during fabrication and testing to ensure accuracy and increase semiconductor chip yield.