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Semiconductor Burn-In and Test Sockets

Semiconductor Burn-In and Test Sockets

Improve semiconductor reliability and in line test efficiency using highly reliable burn-in and test sockets that employ innovative contact technologies. Platform Sockets to full custom designs are available to meet your technical requirements and maximize board density.

Semiconductor Burn-In and Test Sockets
Semiconductor Test Thermal Forcing Systems

Semiconductor Test Thermal Forcing Systems

Extreme temperature forcing range from liquid-free phase change technology enables quiet, portable thermal control in your test environment or into production automated test equipment in the industry’s smallest footprint.

Semiconductor Test Thermal Forcing Systems
ATE Liquid Cooling Systems and Insulation

ATE Liquid Cooling Systems and Insulation

Accelerate time to market and improve trusted reliability with high performance liquid cooling systems and particulate-free insulation systems that speed up test cycle times and maintain pure test environments.

ATE Liquid Cooling Systems and Insulation
Direct to Chip Cooling Systems

Direct to Chip Cooling Systems

Maximize thermal density with innovative liquid, air, and two-phase cooling technologies. Compact direct to chip cooling customized to maximize performance in each application. Cool up to 2200W now, continued research and development to push power density and compute performance boundaries to the next level.

Direct to Chip Cooling Systems
Advanced Engineered Materials for Semiconductors

Advanced Engineered Materials for Semiconductors

Innovative material science maintains purity, stability, and speed in semiconductor fabrication and testing cycles to accelerate time to market with higher reliability.

Advanced Engineered Materials for Semiconductors
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Decrease Test Times

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Increase Power Density

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More Processing Power

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Accelerate Time to Market

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Faster Processing Speeds

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Increase Reliability and Quality

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Faster Cycling Times

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More I/O in Smaller Sizes

Semiconductor Burn-In and Test Sockets

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Logic and memory burn-in and test sockets feature innovative contact technology that gives more reliable electrical and mechanical interconnect. Contact design is optimized to minimize damage to the solder ball with lowest possible actuation force. Contacts open to allow package insertion for 0.5mm pitch and above. Several contact technologies, both through- hole and compression mount, are used for finer pitch packages < 0.5mm. Platform design gives ultimate flexibility in base sockets than can be used for different package sizes leveraging an adapter customized for specific customers’ packages. Changing an adapter to the socket is faster and lower cost than providing new sockets for each package size. Modifying base designs allows us to help customers choose the smallest socket footprint to maximize burn-in board capacity and through-put.

Semiconductor Test Thermal Forcing Systems

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Liquid-free thermal systems leverage innovative phase change technologies to provide a temperature forcing range from -55°C to 250°C for semiconductor testing in multiple stages throughout the manufacturing cycle. Phase change technologies enable quieter, portable test solutions with fast stabilization, superior power handling, and precision control. Easy-to-integrate thermal forcing systems in the industry’s smallest footprint can be used in your test environment, or into production automated test equipment. Thermal forcing systems accommodate a wide range of device sizes and types, whether socketed or soldered down. Applications include DUT level thermal management, thermal stream replacement, temperature forcing, handler integrations, ATE test, bench testing, system level testing, high reliability testing, and OEM integrations.

ATE Liquid Cooling Systems and Insulation

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Semiconductor automated test equipment (ATE) operates at high speed and power, requiring advanced liquid cooling systems. Boyd’s innovative liquid cooling systems optimize each step in testing a semiconductor for ultimate quality control with maximum test cycle efficiency for trusted reliability and fastest speed to market. Liquid cold plates driven by efficient liquid cooling systems and chillers with particulate-free, non-toxic SOLIMIDE® Foam thermal insulation keep fluid lines cold so wafers and chips are tested at safe temperatures in pure environments. Optimized thermal management and insulation protects sensitive components from excessive heat loads and contaminants while decreasing thermal cycle test times.

Direct to Chip Cooling Systems

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Comprehensive direct to chip cooling solutions range from air cooling to high efficiency liquid cooling and innovative immersion cooling development that maximize thermal density and enable higher processing power in the most compact format. Cool switch chips up to 2200 watts (W), GPUs up to 750W, and IGBTs up to 6KW now with continued research and development from Boyd to push power density and compute performance boundaries to the next level.

Leveraging high performance fans and blowers with remote heat pipe-heat sink advanced assemblies, extreme air cooling can easily be routed to cool entire blades and racks in cloud applications while maximizing server density and using existing facility plumbing for efficient performance upgrades in current infrastructure. Liquid loops and liquid cold plates cooled by coolant distribution units (CDUs) or other liquid cooling systems provide highest performance direct to chip liquid cooling for advanced GPUs, CPUs, and switch chips. Custom skyline liquid cold plates create the most efficient thermal interface between liquid systems and the processors, customized to maximize thermal efficiency for each system installation. This maximizes full system performance and environmental sustainability while enabling higher processing density and longer semiconductor lifetimes for marketable performance differentiation.

Advanced Engineered Materials for Semiconductors

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Sophisticated fabrication and automated test equipment streamlines quality assurance during production and requires levels of precision that can only be achieved with high performance engineered material solutions. Pure, stable, and ultraclean materials help maintain a contaminant-free production and test environment required for high quality, reliable semiconductors. Vibration mitigation, environmental sealing, thermal insulation, electrical isolation, high temperature bonding, FFKM o-rings, and EMI and RF shielding protect semiconductors during fabrication and testing to ensure accuracy and increase semiconductor chip yield.

Why Boyd for Semiconductor Solutions

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Boyd’s highly efficient, reliable, and sustainable liquid cooling systems decrease test times, maximize temperature forcing range, or decrease chip operation temperature for faster processing and better uptimes.

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Create additional design space or smaller semiconductor solutions with Boyd’s high efficiency liquid cooling systems and thermal insulation for higher performance in a smaller footprint.

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Boyd’s overlapping thermal technology portfolio enables liquid, two phase, and air cooling innovation to co-exist, enabling us to recommend and blend the right fit for each application.

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Customer-first service with market leading speed and responsiveness combined with decades of semiconductor design expertise and robust, proprietary modeling tools enable Boyd to iterate designs quickly and accelerate speed to market.

Have Questions?

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Integrated solutions minimize or remove waste, maintenance costs, and downtime for an overall lower total cost of ownership.

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Respond quickly to geopolitical changes, strategy shifts in region sourcing, near-shoring or global manufacturing moves with Boyd’s supply chain flexibility and replicated, scalable, global manufacturing.

Have questions? We're ready to help!