Boyd Corporation has been the leading innovator in Enterprise cooling and engineered material solutions since data centers first started to emerge and evolve. Boyd utilizes these decades of expertise to develop advanced thermal solutions and systems to stay ahead of rapidly rising processing power, thermal density, and heat loads. This includes forward thinking liquid cooling innovation and system components such as Coolant Distribution Units (CDUs). This article covers CDU technology for improved liquid cooling systems and integrated solutions that help OEMs increase compute density in the same footprint, iterate designs quickly and accelerate speed to market, increase efficiency and reliability, and lower total cost of data center ownership with a scalable thermal management plan that outpaces processing power and application requirements.
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