Processing and data storage needs will continue to increase exponentially as organizations and individuals further demand digitalization, greater functionality, increased speed and service, better connectivity, and more electronification globally. To support this global trend, data centers and enterprise applications need to be larger, more efficient, and operating 24/7 with improved processing and storage efficiency. This will, in turn, generate greater thermal density and higher heat loads as never seen before in Enterprise Technologies. Data Centers will need to adapt their thermal management strategy quickly to accommodate the fast changing landscape and increased heat. Liquid Cooling Systems and CDUs will play a big part in these new strategies.
With decades of innovation expertise, experience, and supplier partnerships, coupled with the unique approach of integrating multiple technologies into a streamlined product, Boyd Corporation will continue to stay at the forefront of innovation and improved manufacturing that offers unsurpassed reliability and performance while lowering overall costs to the data center operator. If you are looking to solve current issues or tackle new challenges for the next generation, start by contacting Boyd Corporation to learn more about engineered materials, thermal solutions, customizations, and improved processes for Cloud, Enterprise & 5G Applications.