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Two Phase Cooling
Two Phase Cooling

Boyd’s expertise in two-phase cooling spanning over 50 years enables us to create some of the most reliable thermal management solutions that can last upwards of 20 years. Our expertise in innovating, designing, and manufacturing high quality heat pipe assemblies, vapor chamber assemblies, and thermosiphons leverage the passive heat transport of two-phase cooling systems enable us to cool some of the most demanding applications.

Heat Pipes & Heat Pipe Assemblies
heat pipe assemblies

Boyd has consistently been on the forefront of heat pipe technology and continues to push the boundaries of the technology today. As electronics have become smaller and more powerful, heat pipe technology has become much more necessary to safely and reliably dissipate higher, more condensed heat loads.

Heat Pipes & Heat Pipe Assemblies
Vapor Chamber Assemblies
vapor chamber assembly with copper base

When embedded heat pipes cannot offer enough design flexibility or heat spreading, vapor chambers are a good next step. Vapor chambers can be integrated as the base of the heat sink for better, more uniform heat spreading to optimize heat sink performance.

Vapor Chambers & Vapor Chamber Assemblies
Thermosiphons
Thermosiphons

Thermosiphons offer more cost-efficient two phase cooling than heat pipes or vapor chambers, but as they are wickless, they need a consistent gravitational pull to operate.

Thermosiphons
Immersion Cooling
Immersion cooling boiler plate

Industries like Enterprise Electronics continue to push for more processing power and energy storage to the point that even liquid cooling is becoming insufficient. In order to enable such high power densities, innovative systems designers are turning to immersion cooling, where part or all of the board is submerged in dielectric fluids.

Immersion Cooling
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Innovative Two Phase Cooling Solutions that Meet the Most Stringent Requirements

For over 50 years Boyd has pioneered the development and commercialization of two phase cooling, playing an integral role in the advancement and use of heat pipes, vapor chambers, and thermosiphons. Boyd’s world-class engineering, manufacturing, and testing capabilities enable innovative solutions that can meet the most stringent requirements, from the challenges of medical applications to the rigors of space and maritime devices.

Two Phase Enhanced Air Cooling for Power Electronics

Decades of Experience in Research and Development

With decades of experience, dedicated resources for research and development, and design centers specially equipped for the development of two phase solutions, Boyd is uniquely positioned to tackle any thermal challenge. From simple embedded heat pipes to extraordinary two phase thermal systems utilizing multiple advanced technologies and materials, Boyd offers the full range of integrated solutions.

Boyd is one of the few global organizations with dedicated resources to every aspect of heat pipe design and production, from R&D for new designs and materials to high volume production of fully integrated heat pipe assemblies. Heat pipe capabilities also include loop and high temperature heat pipe design and manufacture. Boyd manufactures its own heat pipes to maintain strict quality standards. Our engineering teams have been running heat pipe and loop heat pipe life testing on a variety of material systems and heat rejection conditions for over 40 years. This ensures our heat pipes’ longevity and reliability, including over 300,000 hours of continuous, ongoing life testing on copper-water-sintered powder heat pipe systems. Other material systems and heat rejection conditions include copper-water with different wick structures, copper-methanol, aluminum-ammonia, inconel-sodium, natural convection, forced convection, and liquid cooling.

Boyd has taken this concept further in the development of specialized air cooled heat sinks that incorporate vapor chambers in the fins as well as the base. Attached to the vapor chamber blades are high density rolled and louvered fins, resulting in an isothermal, high surface area air cooled heat sink for high performance cooling. Vapor Chambers can be manufactured with a variety of materials and working fluids. This includes our Ultra-Thin Copper-Water and Stainless Steel Vapor Chambers for high density cooling in applications such as PEM fuel cells and low profile consumer and mobile electronics.

To improve heat transfer from the heat source to the liquid, evaporators or boiler plates are installed in lieu of a heat sink or liquid cold plate. These boiler plates provide additional surface area to boil local liquid, which captures heat from the device and carries it away as the boiled bubbles rise away from the board. As a global pioneer in liquid and two phase cooling, Boyd has developed and manufactures boiler plates using techniques refined from our decades of experience with two phase components. Boiler plates utilize a variety of construction types and geometries, and Boyd continues to research and develop flexible, integrated solutions.

For additional cost savings, Boyd offers advanced engineering and streamlined manufacturing that enables one shot brazing. Boyd has also developed loop thermosiphon solutions that offer passive liquid cooling for more reliable high-power cooling.

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