Thermal Control UnitsThermal Control Units (TCUs) are an integral part of semiconductor testing. They ensure controlled temperature throughout testing processes. TCUs enable engineers to craft and sustain specific thermal profiles to facilitate a thorough characterization of semiconductor devices under diverse temperature conditions.
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What is a Thermal Control Unit?A Thermal Control Unit (TCU) is a specialized device engineered to manage and maintain the temperature of semiconductor components during testing processes. TCUs continuously sense, adjust, and maintain temperatures within a semiconductor testing environment to ensure reliable and repeatable test outcomes.
What Does a Thermal Control Unit Do?A Thermal Control Unit (TCU) manages and regulates the temperature for a semiconductor device under test (DUT) to enable controlled testing at various temperatures and streamline the characterization of semiconductor devices across varying operating conditions. This precise temperature control is imperative throughout semiconductor testing processes to maintain stable and reliable test results while evaluating the performance of semiconductor devices.
How Does a Thermal Control Unit Work?
Thermal Control Units (TCUs) operate within a closed feedback loop, swiftly and accurately adjusting parameters to maintain the specified target temperature. TCUs employ temperature sensors, such as thermocouples or resistance temperature detectors (RTDs), for continuous temperature monitoring within the testing environment. Most TCUs integrate safety features, serving as safeguards against potential overheating or other temperature-related issues to ensure the safety of both equipment and the semiconductor devices undergoing testing.
Thermal Control Unit ChallengesEnsuring consistent temperature profiles from the first to last semiconductor devices presents significant challenges. For example, certain semiconductor tests demand swift temperature cycling, subjecting TCUs and their heating/cooling systems to considerable stress. Other tests involve intricate temperature profiles with exacting ramp rates and dwell times, highlighting the importance of tight operational control to uphold the precision of temperature measurements and control.
How Does Boyd Address Thermal Control Unit Challenges?Boyd’s deep expertise in the semiconductor industry empowers us to address TCU challenges with innovative thermal test system technologies. Our systems are meticulously tailored to meet the rigorous demands of semiconductor testing at multiple stages throughout the manufacturing cycle to ensure precise temperature control and uniformity, rapid temperature cycling, and compatibility with complex temperature profiles. We prioritize reliability, safety, and energy efficiency in our TCU designs, offering semiconductor manufacturers effective tools to conquer temperature-related challenges.
Why Use Boyd’s Test Control Units?
Adaptable DesignsBoyd’s liquid-free thermal systems harness pioneering phase-change technologies, delivering an expansive temperature forcing range from -55°C to 250°C and enable quieter, portable test solutions with fast stabilization, superior power handling, and precision control. Our TCUs are adaptable to a broad spectrum of device sizes and types, whether socketed or soldered down, and seamlessly integrate into the industry’s most compact footprint within your test environment or production automated test equipment.
Scalable Systems for Accelerated Time to MarketBoyd’s thermal control units are scalable from the initial research and design phase through full production runs. Our TCUs enable streamlined testing and validation at every step in the design cycle, reducing your overall time to market.
Non Condensing TCU HeadsOur proprietary design prevents chilled thermal control unit heads from condensing ambient moisture. Boyd’s design keeps devices under test dry even in the coldest test conditions.
Boyd TCUs Pair with Test SocketsBoyd’s TCUs pair with test sockets to elevate test result accuracy and enable early detection of potential temperature-related issues. This integration provides a versatile and highly effective solution for semiconductor testing that drives chip innovation by ensuring the durability and performance of semiconductor devices across a broad spectrum of applications.
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