Cloud Data Center

Cloud Data Center

Durable, innovative AI and data center cooling systems for next-level thermal performance: CDUs, liquid loops, and cold plates. Leverage Boyd’s leak-free heritage, scalable production capacity, redundant global manufacturing, and agile design to mass production ramp.

Cooling Distribution Units

Liquid Cooling Loop Icon

Liquid Cooling Loops

Liquid Cold Plates

Extreme Air Cooling

Cloud Data Center

Cooling Distribution Units

Maximize data center cooling and AI cooling efficiency and performance with Boyd’s CDUs, backed by our redundant global manufacturing capacity and scale.

Meet Demanding Ramp and Scale

Push System Performance

Trusted Reliability

Next Level Functionality and Versatility

Liquid Cooling Loops

Liquid Cooling Loops

Combine direct liquid cooling cold plates with fittings and tubes to empower advanced GPUs and processors that drive artificial intelligence systems.

Trusted Manufacturing Capacity

Leak-Free Operation

Maximize Service Efficiency with Hot Swapping

Next Level Cooling Performance


Liquid Cooling Loops
Liquid Cold Plates

Liquid Cold Plates

Cool artificial intelligence semiconductors with high performance liquid cold plates, redundantly manufactured across three continents.

Leak-Free Operation

CPU, GPU, and Network Cooling

Exceptional Cooling Performance

Highly Customizable

Liquid Cold Plates
Extreme Air Cooling

Extreme Air Cooling

Leverage the speed and low temperature differential of extreme air-cooling solutions powered by two-phase technologies. Utilize advanced fin structures to optimize available volume for cooling. Maximize the efficiency of your air cooled system with these technologies:



Advanced Heat Sinks

Extreme Air Cooling
Racks and Chassis

Racks and Chassis Protection

Server racks and rack chassis are the framework for enterprise and cloud computing installations. Protect technicians and equipment with electrical insulation. Enhance air systems with flow management solutions. Inform users with Human Machine Interface (HMI) solutions.

Air Management

HMI, Information and Labeling

Electrical Insulators

Racks and Chassis
Blade and Storage Protection

Blade and Storage Protection

Protect blades and data storage against data center environments with engineered materials. Data center cooling systems utilize dampeners to minimize mechanical and acoustic vibration improving read-write accuracy and data integrity. Seal and shield against ingress, electromagnetic interference, and spark voltage to maximize data center cooling systems uptime.

Air Management

HMI, Graphics, and Labels

NVH Solutions

EMI Materials

Blade and Storage Protection

Cloud Data Center Cooling

Trusted, High Capacity Production

Leak-Free Performance

Redundant, Global Manufacturing

Agile Ramp and Scale Production

Boyd Data Center Cooling: Coolant Distribution Units

Cool data centers and artificial intelligence with Boyd’s Coolant Distribution Units that offer next level functionality and versatility. Configured for in-rack or in-row, sidecar installations. Available as liquid to liquid or liquid to air technologies to advance performance in new data center installations or retrofitted upgrades. Benefit from Boyd’s globally redundant, trusted manufacturing capacity, reliable CDU heritage spanning four decades, ability to ramp and scale with agility to meet demanding schedules, and CDU performance that pushes systems boundaries.

Data Center Cooling Systems: Liquid Cooling Loops

Simplify cooling AI servers with Boyd’s next level performance, leak-free liquid cooling loops that efficiently combine durable liquid cold plates, tubing, and quick disconnects into a single, easy-to-install unit. Leverage our decades of trusted manufacturing expertise, global capacity to quickly and reliably scale with your AI or data center buildout schedules, and design to maximize service efficiency.

Boyd Data Center Cooling: Liquid Cold Plates

Bring exceptional, leak-free cooling performance right to the chip with Boyd’s high reliability liquid cold plates. Designed and manufactured with durability in mind to prevent leaks and protect valuable data center and AI hardware. Boyd cold plates are optimized as reference designs for key GPU, CPU, and networking applications, or highly customizable for unique heat sources.


Lower Total Cost of Data Center Ownership

Integrated solutions minimize or remove waste, maintenance costs and downtime for an overall lower total cost of data center ownership.

Iterate Designs Quickly and Accelerate Speed to Market

Customer-first service with market leading speed and responsiveness combined with decades of thermal design expertise and robust, proprietary modeling tools enable Boyd to iterate designs quickly and accelerate speed to market.

Cloud Data Center Cooling and Artificial Intelligence Systems

Cloud data center installations are growing fast with accelerated adoption of artificial intelligence and the integration of smart functionality and connectivity across most industries. Preference for convenience, flexibility, speed, mobility and responsiveness is driving device performance and functionality that creates vast amounts of data to transmit and store. Cloud compute stores, processes, networks and analyzes all this data and digital functionality. Consumer trends and innovation have made cloud compute increasingly intrinsic to how businesses operate, and consumers run their lives. Cloud powers modern society.

Cloud Data Center Cooling Solutions
Enterprise Solutions 3D

Enterprise Solutions

Delve into the breadth of Boyd’s solution portfolio for data centers, hyperscale computing, and other rack-based solutions in our interactive 3D tool.

Data Center Cooling Systems | Cool Cutting-Edge Artificial Intelligence

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How to Cool a Data Center with an In-rack Liquid Cooling System?

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Data Center Cooling Systems: In-Rack Liquid Cooling

Data center cooling systems leverage liquid cooling systems integrated within a server rack to efficiently manage heat within a chassis across a series of heat sources or servers. Compact, lower profile, high performance, thermally dense liquid systems open additional space in existing chassis designs, making room for more compute and power density achievable in the same space. Advanced data center cooling systems enable In-rack coolant distribution units (CDUs) or liquid cooling loops to tie into existing facility water cooling systems, integrating cooling down to the blade or chip level with liquid cold plates featuring custom skylines for maximum interface between heat sources and the liquid system. Quick disconnects with swivel fittings make service easy to access and fast.

Increase Compute Density in the Same Footprint

Low profile liquid cooling systems offer higher performance in a smaller footprint and create additional design space with optimized thermal density.

Responsive Global Localization

Boyd moves with our customers as their regional needs evolve in response to geopolitical changes, strategy shifts in region sourcing, near-shoring or global manufacturing moves.

Data Center Cooling Systems: Chassis Liquid Cooling

Data center cooling systems utilize liquid cooling systems integrated within a series of chassis to manage higher heat loads across multiple server racks. In-row coolant distribution units (CDUs) can be fully self-contained or connect into installed facility liquid systems with intelligent instrumentation that optimizes energy use, senses flow, pressure, temperature and leak detection for variable peak performance and preventive protection meaning cloud systems get the exact, optimal, on demand cooling performance the system needs when it needs it.

Data Center Cooling Systems: Extreme Air Cooling

Push the boundaries of air cooling and delay the transition to liquid cooling with Boyd’s data center cooling systems enabling extreme air-cooling innovation. These systems help hyperscale compute designers maximize compute density by leveraging highly efficient two-phase cooling technologies that rapidly absorb and transport heat away from heat sources to remote regions within the server or chassis to access more design space for larger heat sinks and better access to air flow. High pressure fans and blowers enable denser systems and heat sink fins for more extreme cooling with the added benefit of operating with less noise and tonal vibration than traditional fans, resulting in improved hard drive performance and quieter, safer data centers.

Extend Air Cooling Innovation and Safely Transition to Liquid

Boyd’s overlapping technology portfolio enables liquid, immersion, two phase, and air-cooling innovation to co-exist; recommending and blending the right technologies for each custom application, extending the performance boundaries of traditional air-cooling systems and assuring a safe migration to liquid cooling systems when appropriate.

Increase Efficiency and Reliability

Boyd’s data center cooling systems cool, seal and protect some of the most demanding data centers in the world with solutions that help customers increase performance efficiency, optimize resource utilization, maximize energy recovery, and increase reliability across all systems levels.

Maximize Air Cooling Efficiency

Enhance data center energy efficiency and thermal system performance by optimizing cooled air use and hot air exhaust in air cooled systems with innovative data center cooling systems. FR V-0 Air blockers made of SOLIMIDE® polyimide foam block air and insulate noise with unique differentiated characteristics like high temperature resistance, flame resistance, non-toxicity, extreme low density and weight. Air leak seals and air gap fillers prevent cool air loss, remove design pockets that trap cool or hot air, and connect internal airflow pathways. Air baffle assemblies commonly feature flame rated FR V-0 electrically insulating materials that are thermoformed or folded into airflow management channels and ducting which manage flow bypass, altering airflow inside the server to efficiently direct cold air to heat sinks.

Sealing and Shielding Cloud Data Centers

Boyd’s data center cooling systems enable air ducting and air flow management solutions, like thermoformed baffles, improving traditional air-cooled system efficiency. Prevent device or assembly overheating or premature failure from lost or decreased airflow velocity that reduces heat sink efficiency with FR-V0 rated electrically insulating air flow baffles. Boyd offers several additional air blocking, air shielding, gasket, and air diverter material options optimized for sealing force and compression force deflection to optimize cool air use in an enclosure, including Boyd’s high performance polyimide foam SOLIMIDE®, nitrile, EPDM, polyurethane, and silicone foams. Enclosure, housing, and environmental seals are a critical need and constant challenge for enterprise systems to protect against dust and water ingress or other contaminants. Boyd foam and mesh air filters protect sensitive components from particle and dust build up that hinders performance and may cause failures. These leak-sealing foams and gaskets prevent air leakage and optimize airflow, enabling the data center cooling systems to operate at peak performance.

Create Safer Data Centers

Boyd’s solutions consider the full data center environment, offering quiet solutions that reduce environmental noise pollution for safer data center operations.

Data Center Thermal Management and Engineering Solutions

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Two Phase Enhanced Air Cooling for Power Electronics

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Data Center Noise and Vibration Mitigation

In addition to environmental contaminants, noise and vibration, electricity, and complex internal electronic components can reduce reliability and system integrity, increasing maintenance fees and system downtime. Boyd’s comprehensive protecting solutions improve data center, networking and connectivity system performance and maximize uptime by mitigating noise and vibration propagation, improving electronic signal integrity, improving electrical shock protection and fire safety by blocking spark voltage inside an enclosure V-0 flame rated dielectric insulators.

Insulating UL Labels and Overlays

Enterprise computing systems incorporate a surplus of components and subsystems that require clear identification to preserve peak functionality and performance. Boyd’s custom warning labels, regulatory graphics, complex graphic overlays, system information labels, flame retardant cable management solutions, and serialized identification labels aid in the organization of any size data center facility from world class hyperscale computing centers to smaller edge computing sites. Informational and dielectric overlays designed and printed on UL-rated electrically-insulating raw materials aid in UL testing, approval, and traceability. Improve traceability of your hardware by manufacturing and assembling with Boyd UL 969 compliant warning and regulatory labels. Increase the organization of Input/output network cables, wires, and hoses for liquid cooling systems with Boyd’s comprehensive hook and loop cable management systems.

Data Center Cooling Integrated Silicon and Processor Cooling

Silicon, CPUs, and GPUs continually push the boundary for maximum processor power, limited by what is thermally achievable. Boyd’s data center cooling systems offer greater thermal density enabling higher processing power, creating a marketable competitive advantage. Our overlapping technology portfolio enables liquid, immersion, two phase, and air cooling innovation to co-exist; recommending and blending the right technologies for each custom application, extending the performance boundaries of traditional air cooling systems and assuring a safe migration to liquid cooling systems when appropriate.

Thermal Management Introduction

Full Spectrum of Chip Cooling Technologies

High density, remote heat pipe heat sink assemblies, liquid cooling loops, and highly customized liquid cold plates with custom skylines create efficient thermal interface between air or liquid systems and the processors. With experience in designing optimal thermal solutions for all major silicon brands, Boyd’s greatest value to server and data center designers is our partnership to custom design processor cooling solutions specific to their unique installations of these standard chips. Our Silicon, CPU and GPU thermal solutions are not one-size-fits all but customized to maximize thermal efficiency for each unique system installation, maximizing full system capabilities and creating performance differentiation.

Data Storage Dampers and Server Sealing

Improve cloud data center system performance and reliability with greater read-write accuracy and speed as well as protection against data center operational environments. Boyd’s solutions dampen vibration and absorb shock from both mechanical and acoustic sources like system operation, sound, and traditional air cooling systems with many moving parts operating at high rotational speeds. We are experts in managing enterprise noise, vibration and harshness as well as hard disk drive damping. Server chassis must also be sealed and shielded against water or dust ingress, electromagnetic interference, LED crosstalk, and spark voltage for operational peak performance and system uptime.

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