Boyd air ducting and air flow management solutions, like thermoformed baffles, are used to improve traditional air cooled system efficiency. Prevent device or assembly overheating or premature failure from lost or decreased airflow velocity that reduces heat sink efficiency with FR-V0 rated electrically-insulating air flow baffles. Boyd offers several additional air blocking, air shielding, gasket, and air diverter material options optimized for sealing force and compression force deflection to optimize cool air use in an enclosure, including Boyd's high performance polyimide foam SOLIMIDE (R), nitrile, EPDM, polyurethane, and silicone foams. Enclosure, housing, and environmental seals are a critical need and constant challenge for enterprise systems to protect against dust and water ingress or other contaminants. Boyd foam and mesh air filters protect sensitive components from particle and dust build up that hinders performance and may cause failures. These leak-sealing foams and gaskets prevent air leakage and optimize airflow, enabling the cooling system to operate at peak performance.
In addition to environmental contaminants, noise and vibration, electricity, and complex internal electronic components can reduce reliability and system integrity, increasing maintenance fees and system downtime. Boyd’s comprehensive protecting solutions improve data center, networking and connectivity system performance and maximize uptime by mitigating noise and vibration propagation, improving electronic signal integrity, improving electrical shock protection and fire safety by blocking spark voltage inside an enclosure V-0 flame rated dielectric insulators.
Enterprise computing systems incorporate a surplus of components and sysbsystems that require clear identification to preserve peak functionality and performance. Boyd’s custom warning labels, regulatory graphics, complex graphic overlays, system information labels, flame retardant cable management solutions, and serialized identification labels aid in the organization of any size data center facility from world class hyperscale computing centers to smaller edge computing sites. Informational and dielectric overlays designed and printed on UL-rated electrically-insulating raw materials aid in UL testing, approval, and traceability. Improve traceability of your hardware by manufacturing and assembling with Boyd UL 969 compliant warning and regulatory labels. Increase the organization of Input/output network cables, wires, and hoses for liquid cooling systems with Boyd’s comprehensive hook and loop cable management systems.