Silicon, CPU, and GPU Cooling
Silicon, CPUs, and GPUs are the foundation of successful enterprise and cloud computing installations. Apply high-performance thermal management from a wide variety of technologies to maximize processing power.
Liquid Cold Plates
3DVCs
Thermosiphons
Blade and Storage Protection
Protect blades and data storage against data center environments with engineered materials. Leverage dampeners minimize mechanical and acoustic vibration to improve read-write accuracy and data integrity. Seal and shield against ingress, electromagnetic interference, and spark voltage to maximize system uptime.
Air Management
NVH Solutions
EMI Materials
Racks and Chassis
Server racks and rack chassis are the framework for enterprise and cloud computing installations. Racks can be optimized for air or liquid cooling systems with advanced blower trays or integrated liquid cooling and high-performance coolant distribution units (CDUs). With instrumentation and intelligent software, systems can quickly respond to varying processor loads and optimize cooling and power usage for on-demand cooling.
Cooling Distribution Units (CDUs)
Information and Labeling
Electrical Insulators
Design for Manufacture
Leverage Boyd’s global engineering team and their enterprise experience to design computing solutions that help you gain a competitive advantage.
Manufacturing Capabilities
Design Engineering
Cloud Data Center
Cloud data center installations are growing fast with accelerated adoption of artificial intelligence and the Internet of Things (IoT) integrating smart functionality and connectivity across most industries. Preference for convenience, flexibility, speed, mobility and responsiveness is driving device performance and functionality that creates vast amounts of data to transmit and store. Cloud compute stores, processes, networks and analyzes all of this data and digital functionality. Consumer trends and innovation have made cloud compute increasingly intrinsic to how businesses operate, and consumers’ run their lives. Cloud powers modern society.
Lower Total Cost of Data Center Ownership
Integrated solutions minimize or remove waste, maintenance costs and downtime for an overall lower total cost of data center ownership.
Iterate Designs Quickly and Accelerate Speed to Market
Customer-first service with market leading speed and responsiveness combined with decades of thermal design expertise and robust, proprietary modeling tools enable Boyd to iterate designs quickly and accelerate speed to market.
Enterprise Solutions
How to Cool a Data Center with an In-rack Liquid Cooling System?
(View transcript)
In-Rack Liquid Cooling
Liquid cooling systems integrated within a server rack are designed to manage heat within a chassis across a series of heat sources or servers. Compact, lower profile, high performance, thermally dense liquid systems open additional space in existing chassis designs, making room for more compute and power density achievable in the same space. In-rack coolant distribution units (CDUs) or liquid cooling loops can tie into existing facility water cooling systems, integrating cooling down to the blade or chip level with liquid cold plates featuring custom skylines for maximum interface between heat sources and the liquid system. Quick disconnects with swivel fittings make service easy to access and fast.
Increase Compute Density in the Same Footprint
Low profile liquid cooling systems offer higher performance in a smaller footprint and create additional design space with optimized thermal density.
Responsive Global Localization
Boyd moves with our customers as their regional needs evolve in response to geopolitical changes, strategy shifts in region sourcing, near-shoring or global manufacturing moves.
Chassis Liquid Cooling
Liquid cooling systems integrated within a series of chassis are designed to manage higher heat loads across multiple server racks. In-row coolant distribution units (CDUs) can be fully self-contained or connect into installed facility liquid systems with intelligent instrumentation that optimizes energy use, senses flow, pressure, temperature and leak detection for variable peak performance and preventive protection meaning cloud systems get the exact, optimal, on demand cooling performance the system needs when it needs it.
Extreme Air Cooling
Those looking to push the boundaries of air cooling and delay the transition to liquid cooling rely on Boyd’s extreme air cooling system innovation. Extreme air cooling systems help hyperscale compute designers maximize compute density by leveraging highly efficient two-phase cooling technologies that rapidly absorb and transport heat away from heat sources to remote regions within the server or chassis to access more design space for larger heat sinks and better access to air flow. High pressure fans and blowers enable denser systems and heat sink fins for more extreme cooling with the added benefit of operating with less noise and tonal vibration than traditional fans, resulting in improved hard drive performance and quieter, safer data centers.
Extend Air Cooling Innovation and Safely Transition to Liquid
Boyd’s overlapping technology portfolio enables liquid, immersion, two phase, and air cooling innovation to co-exist; recommending and blending the right technologies for each custom application, extending the performance boundaries of traditional air cooling systems and assuring a safe migration to liquid cooling systems when appropriate.
Increase Efficiency and Reliability
Boyd’s cloud solutions cool, seal and protect some of the most demanding data centers in the world with solutions that help customers increase performance efficiency, optimize resource utilization, maximize energy recovery, and increase reliability across all systems levels.
Maximize Air Cooling Efficiency
Improve data center energy efficiency and thermal system performance by optimizing cooled air use and hot air exhaust in air cooled systems. FR V-0 Air blockers made of SOLIMIDE® polyimide foam block air and insulate noise with unique differentiated characteristics like high temperature resistance, flame resistance, non-toxicity, extreme low density and weight. Air leak seals and air gap fillers prevent cool air loss, remove design pockets that trap cool or hot air, and connect internal airflow pathways. Air baffle assemblies commonly feature flame rated FR V-0 electrically insulating materials that are thermoformed or folded into airflow management channels, ducting, and to manage flow bypass, altering airflow inside the server to most efficiently direct cold air to heat sinks.
Sealing and Shielding Cloud Data Centers
Boyd air ducting and air flow management solutions, like thermoformed baffles, are used to improve traditional air cooled system efficiency. Prevent device or assembly overheating or premature failure from lost or decreased airflow velocity that reduces heat sink efficiency with FR-V0 rated electrically-insulating air flow baffles. Boyd offers several additional air blocking, air shielding, gasket, and air diverter material options optimized for sealing force and compression force deflection to optimize cool air use in an enclosure, including Boyd’s high performance polyimide foam SOLIMIDE®, nitrile, EPDM, polyurethane, and silicone foams. Enclosure, housing, and environmental seals are a critical need and constant challenge for enterprise systems to protect against dust and water ingress or other contaminants. Boyd foam and mesh air filters protect sensitive components from particle and dust build up that hinders performance and may cause failures. These leak-sealing foams and gaskets prevent air leakage and optimize airflow, enabling the cooling system to operate at peak performance.
Create Safer Data Centers
Boyd’s solutions consider the full data center environment, offering quiet solutions that reduce environmental noise pollution for safer data center operations.
How to Cool and Protect a Data Center?
(View transcript)
Two Phase Enhanced Air Cooling for Power Electronics
(View transcript)
Data Center Noise and Vibration Mitigation
In addition to environmental contaminants, noise and vibration, electricity, and complex internal electronic components can reduce reliability and system integrity, increasing maintenance fees and system downtime. Boyd’s comprehensive protecting solutions improve data center, networking and connectivity system performance and maximize uptime by mitigating noise and vibration propagation, improving electronic signal integrity, improving electrical shock protection and fire safety by blocking spark voltage inside an enclosure V-0 flame rated dielectric insulators.
Insulating UL Labels and Overlays
Enterprise computing systems incorporate a surplus of components and subsystems that require clear identification to preserve peak functionality and performance. Boyd’s custom warning labels, regulatory graphics, complex graphic overlays, system information labels, flame retardant cable management solutions, and serialized identification labels aid in the organization of any size data center facility from world class hyperscale computing centers to smaller edge computing sites. Informational and dielectric overlays designed and printed on UL-rated electrically-insulating raw materials aid in UL testing, approval, and traceability. Improve traceability of your hardware by manufacturing and assembling with Boyd UL 969 compliant warning and regulatory labels. Increase the organization of Input/output network cables, wires, and hoses for liquid cooling systems with Boyd’s comprehensive hook and loop cable management systems.
Integrated Silicon and Processor Cooling
Silicon, CPUs, and GPUs continually push the boundary for maximum processor power, limited by what is thermally achievable. Greater thermal density enables higher processing power, creating a marketable competitive advantage. Boyd’s overlapping technology portfolio enables liquid, immersion, two phase, and air cooling innovation to co-exist; recommending and blending the right technologies for each custom application, extending the performance boundaries of traditional air cooling systems and assuring a safe migration to liquid cooling systems when appropriate.
Full Spectrum of Chip Cooling Technologies
High density, remote heat pipe heat sink assemblies, liquid cooling loops, and highly customized liquid cold plates with custom skylines create the most efficient thermal interface between air or liquid systems and the processors. With experience in designing optimal thermal solutions for all major silicon brands, Boyd’s greatest value to server and data center designers is our partnership to custom design processor cooling solutions specific to their unique installations of these standard chips. Our Silicon, CPU and GPU thermal solutions are not one-size-fits all but customized to maximize thermal efficiency for each unique system installation, maximizing full system capabilities and creating performance differentiation.
Data Storage Dampers and Server Sealing
Improve cloud data center system performance and reliability with greater read-write accuracy and speed as well as protection against data center operational environments. Boyd’s solutions dampen vibration and absorb shock from both mechanical and acoustic sources like system operation, sound, and traditional air cooling systems with many moving parts operating at high rotational speeds. We are the world’s foremost expert in managing enterprise noise, vibration and harshness as well as hard disk drive damping. Server chassis must also be sealed and shielded against water or dust ingress, electromagnetic interference, LED crosstalk, and spark voltage for operational peak performance and system uptime.
Related Products & Resources
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