Cloud data center installations are growing fast with accelerated adoption of artificial intelligence and the Internet of Things (IoT) integrating smart functionality and connectivity across most industries. Preference for convenience, flexibility, speed, mobility and responsiveness is driving device performance and functionality that creates vast amounts of data to transmit and store. Cloud compute stores, processes, networks and analyzes all of this data and digital functionality. Consumer trends and innovation have made cloud compute increasingly intrinsic to how businesses operate, and consumers’ run their lives. Cloud powers modern society.
Extend Air Cooling Innovation and Safely Transition to Liquid
Boyd’s overlapping technology portfolio enables liquid, immersion, two phase, and air cooling innovation to co-exist; recommending and blending the right technologies for each custom application, extending the performance boundaries of traditional air cooling systems and assuring a safe migration to liquid cooling systems when appropriate.
Iterate Designs Quickly and Accelerate Speed to Market
Customer-first service with market leading speed and responsiveness combined with decades of thermal design expertise and robust, proprietary modeling tools enable Boyd to iterate designs quickly and accelerate speed to market.
Lower Total Cost of Data Center Ownership
Integrated solutions minimize or remove waste, maintenance costs and downtime for an overall lower total cost of data center ownership.
Responsive Global Localization
Boyd moves with our customers as their regional needs evolve in response to geopolitical changes, strategy shifts in region sourcing, near-shoring or global manufacturing moves.
Increase Efficiency and Reliability
Boyd’s cloud solutions cool, seal and protect some of the most demanding data centers in the world with solutions that help customers increase performance efficiency, optimize resource utilization, maximize energy recovery, and increase reliability across all systems levels.
In-Rack Liquid Cooling
Liquid cooling systems integrated within a server rack are designed to manage heat within a chassis across a series of heat sources or servers. Compact, lower profile, high performance, thermally dense liquid systems open additional space in existing chassis designs, making room for more compute and power density achievable in the same space. In-rack coolant distribution units (CDUs) or liquid cooling loops can tie into existing facility water cooling systems, integrating cooling down to the blade or chip level with liquid cold plates featuring custom skylines for maximum interface between heat sources and the liquid system. Quick disconnects with swivel fittings make service easy to access and fast.
Chassis Liquid Cooling
Liquid cooling systems integrated within a series of chassis are designed to manage higher heat loads across multiple server racks. In-row coolant distribution units (CDUs) can be fully self-contained or connect into installed facility liquid systems with intelligent instrumentation that optimizes energy use, senses flow, pressure, temperature and leak detection for variable peak performance and preventive protection meaning cloud systems get the exact, optimal, on demand cooling performance the system needs when it needs it.
Integrated Silicon and Processor Cooling
Silicon, CPUs and GPUs continually push the boundary for maximum processor power, limited by what is thermally achievable. Greater thermal density enables higher processing power, creating a marketable competitive advantage. Boyd’s overlapping technology portfolio enables liquid, immersion, two phase, and air cooling innovation to co-exist; recommending and blending the right technologies for each custom application, extending the performance boundaries of traditional air cooling systems and assuring a safe migration to liquid cooling systems when appropriate. High density, remote heat pipe heat sink assemblies, liquid cooling loops, and highly customized liquid cold plates with custom skylines create the most efficient thermal interface between air or liquid systems and the processors. With experience in designing optimal thermal solutions for all major silicon brands, Boyd’s greatest value to server and data center designers is our partnership to custom design processor cooling solutions specific to their unique installations of these standard chips. Our Silicon, CPU and GPU thermal solutions are not one-size-fits all but customized to maximize thermal efficiency for each unique system installation, maximizing full system capabilities and creating performance differentiation.
Data Storage Dampers and Server Sealing
Improve cloud data center system performance and reliability with greater read-write accuracy and speed as well as protection against data center operational environments. Boyd’s solutions dampen vibration and absorb shock from both mechanical and acoustic sources like system operation, sound, and traditional air cooling systems with many moving parts operating at high rotational speeds. We are the world’s foremost expert in managing enterprise noise, vibration and harshness as well as hard disk drive damping. Server chassis must also be sealed and shielded against water or dust ingress, electromagnetic interference, LED crosstalk, and spark voltage for operational peak performance and system uptime.