Conduction cooling solutions rely on direct contact with materials with high thermal conductivity to effectively transfer heat. Conduction solutions can be simple like thermal interface materials, often a film or silicone pad embedded with high conductivity filler, or they can be more complex solutions like a lightweight aluminum chassis with an encapsulated graphite core.
In addition to a broad portfolio of traditional conduction solutions, Boyd Corporation is the world leader in creating advanced conduction solutions utilizing encapsulated graphite to combine lightweight, highly thermally conductive graphite into either machinable or flexible formats in our k-Core® product line.