Boyd continues to innovate encapsulated graphite assemblies to create passive, lightweight, reliable, and highly thermally conductive solutions. Thermal busses integrated with k-Core® to combine the lightweight benefits of graphite with the strength of copper or aluminum and offer increased thermal conductivity compared to the enveloping material.
By utilizing flexible materials like copper foil, aluminum foil, or polyimide film, to contain and support graphite sheets, thermal straps with k-Core® offer both performance and physical flexibility in your thermal management solution.
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