Encapsulated Graphite Heat Spreaders

Boyd designs compact and ultra-thin heat spreaders integrating multiple technologies for optimized, cost-efficient heat spreading and dissipation. The more advanced Boyd heat spreaders include our encapsulated graphite which utilizes thermal annealed pyrolytic graphite encased in a thermally conductive alloy such as copper or aluminum. These solutions are light weight, passive and can be manufactured in complex geometries.

Encapsulated Graphite Chassis & Enclosures

By utilizing thermally conductive metal joining and encapsulated graphite heat spreaders, Boyd manufactures compact, lightweight chassis and enclosures ideal for high power applications with limited space. These enclosures are popular for space and aircraft systems as they add structural integrity and environment protection as well as improved cooling without adding weight. Enclosures can be further optimized with the addition of sealing and protective materials or mechanical additions such as fins or ducting.

Graphite Films & Pads

High heat spreading capabilities with high heat resistance in low profiles.

Heat Spreaders and Conductive Chassis Optimize Heat Transfer in Your Thermal Solution

Heat spreaders are an ideal solution for rapidly and evenly distributing high density heat loads. Heat spreaders are often used to increase heat distribution to additional surface area like heat sinks or heat exchangers, which improves the overall thermal performance of the assembly.

Integrated into Complex Assemblies or Geometries

Heat spreaders can also be integrated into complex assemblies or geometries for high performance chassis or enclosures where internal volume is at a premium. Boyd Corporation’s k-Core® technology creates extremely lightweight heat spreaders utilizing encapsulated graphite.

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High Performance Thermal Ground Plane

Through precise control over the Coefficient of Thermal Expansion (CTE) of our k-Core® products we create high performance Thermal Ground Plane (TGP) products. With a matching CTE, Thermal Ground Plane solutions significantly reduce thermal resistance at the die level and prevent shear between surfaces during thermal cycling. Customers can install our CTE matched products directly to their die, whether it’s silicon, silicon carbide (SiC), aluminum silicon carbide (AlSiC), gallium nitride (GaN) or any other material.

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