Thermally Conductive Gap Fillers are soft, malleable interface materials with high thermal conductivity for applications with large gaps between heat sources and cooling surfaces, varying component heights, high tolerance stack-up variability, and uneven or rough surfaces. Gap fillers dampen vibration and reduce component stress or warping in challenging environments. Boyd’s Transtherm® Gap Fillers are gel-like materials that fall into three groups: Silicone Gap Fillers, Silicone-Free Gap Fillers, and Putty-type Gap Fillers.