Processor Cooling

What is a Processor?

A processor, also known as a central processing unit (CPU), is the primary semiconductor hardware component of a computer system. It executes instructions fetched from the computer’s memory and interprets them to perform tasks such as running software applications, handling user inputs, and managing system resources. Processors are designed with different architectures, clock speeds, and features to meet various computational needs, from simple tasks to complex computations.

What is Processor Cooling and Why Does it Matter?

Processor cooling includes the methods and technologies that dissipate heat generated by processors or other semiconductor components. As the processor executes instructions and performs calculations, electrical resistance generates heat in the circuits. Excessive heat degrades processor performance and if not properly managed, leads to overheating, potential damage, and shortened lifetimes. Effective processor cooling is essential, especially in high-performance computing scenarios. Processor cooling maintains stable and efficient semiconductor performance, prevents performance throttling, and mitigates potential hardware damage.

Why Boyd?

Reduce energy consumption, lower operational costs, and optimize hardware utilization with efficient cooling solutions.
Enable high-performance computing that supports demanding workloads while maintaining peak performance under various operating conditions by providing precise temperature control.
Enhance system stability by preventing excessive heat buildup on semiconductor components, minimizing the risk of premature wear and potential failures that can also lead to system instability, crashes, and hardware damage.
Enable innovative and compact device designs, allowing for sleeker and more powerful electronic products.

Improve safety and reliability by reducing the risk of catastrophic hardware failures and ensuring the safe operation of electronic devices.

Extend the lifespans for semiconductor components, reducing the need for frequent replacements.

Enterprise Solutions

Delve into the breadth of Boyd’s solution portfolio for data centers, hyperscale computing, and other rack-based solutions in our interactive 3D tool.

Enterprise Solutions 3D

Processor Cooling Examples

Many computer processors and other chips use enhanced air cooling with advanced heat sink configurations, directed airflow, and better fan technologies to dissipate heat. High-performance CPUs and GPUs demand higher performance cooling. Liquid cooling systems with coolant distribution units (CDUs) enable centralized control and optimized cooling performance for higher performance computing devices. Direct-to-chip cooling optimizes the interface between the liquid system cold plate and the chip package to enhance heat transfer efficiency and allow precise temperature control.

The Boyd Difference for Processor Cooling

Thermal Management

Boyd has a strong heritage of developing, designing, and optimizing forward-thinking, reliable high-performance cooling solutions that enable processor innovation. Our thermal management contribution to processor evolution dates back to the early 1980’s from extreme air cooling to today’s liquid cooling systems and cutting-edge pumped two-phase cooling for next-generation processors. Our commitment to engineering and manufacturing innovation enables us to optimize cost-efficient cooling solutions tailored to handle the rigorous demands of high-performance processors.

Boyd’s Chip Cooling Technologies

Boyd’s overlapping technology portfolio enables liquid, immersion, two-phase, and air-cooling innovation to co-exist. Maximize server density with existing facility plumbing to efficiently upgrade cloud performance in the current infrastructure with our high-performance remote heat pipe-heat sink assemblies that cool entire blades and racks. Liquid loops and liquid cold plates with coolant distribution units (CDUs) create a complete liquid cooling system for the most efficient high performance thermal system. Boyd’s optimized liquid systems enable the highest performance direct-to-chip cooling for advanced GPUs, CPUs, and switch chips.

Decades of Experience in Research and Development

Boyd offers a full range of integrated solutions from simple embedded heat pipes to extraordinary two-phase thermal systems utilizing multiple advanced technologies and materials. With decades of experience, dedicated resources for research and development, and design centers specially equipped for the development of thermal solutions, we are uniquely positioned to tackle any cooling challenge.

Integrated Processor Cooling Solution

Enable the most efficient thermal interface between air or liquid systems and processors with Boyd’s high density, remote heat pipe heat sink assemblies, liquid cooling loops, and highly customized liquid cold plates. Maximize thermal efficiency for each system installation, full system performance, and environmental sustainability while enabling higher processing density and longer semiconductor lifetimes for marketable performance differentiation with our custom thermal solutions.

Direct-to-chip Cooling Systems

Maximize power density and enable higher processing power in the most compact format with our comprehensive direct-to-chip cooling solutions ranging from extreme air cooling to high-efficiency liquid cooling and innovative immersion cooling development.

Boyd’s Innovative Liquid Cooling for High-performance Chips

Push the boundaries of Moore’s law with Boyd’s advanced liquid cooling technology that combines two-phase cooling and liquid cooling systems. Pumped two-phase systems, or evaporative liquid cooling, leverages the benefits of both technologies. Our world-class engineering, manufacturing, and testing capabilities enable innovative cooling solutions to meet the most stringent requirements of high-performance chips.

Benefits of Processor Cooling

Reduce energy consumption, lower operational costs, and optimize hardware utilization with efficient cooling solutions.

Enhance system stability with cooler processors, which are less likely to experience crashes, and data corruption caused by overheating.

Maintain optimal performance under various operating conditions by providing precise temperature control.

Reduce heat stress by preventing excessive heat buildup on semiconductor components, minimizing the risk of premature wear and potential failures.

Enable innovative and compact device designs, allowing for sleeker and more powerful electronic products.

Minimize the risk of processors reaching dangerously high temperatures leading to system instability, crashes, and hardware damage.

Improve safety and reliability by reducing the risk of catastrophic hardware failures and ensuring the safe operation of electronic devices.

Extend the semiconductor components lifespans, reducing the need for frequent replacements.

Reduce the reliance on cooling mechanisms like fans by effectively managing heat while enhancing overall system efficiency.

Enable high-performance computing that supports demanding workloads while maintaining peak performance.

Processor Cooling Challenges

Innovative cooling solutions requirement: As processors become more powerful they generate more heat in smaller areas, demanding innovative cooling solutions to manage heat density.

Scaling in Data Centers: Efficient infrastructure and cooling management strategies are required to cool at scale in data centers with thousands of processors.

Miniaturization: Smaller chip sizes limit the space available for traditional cooling methods.

Cooling System Size: More powerful processors often require larger and more complex cooling solutions impacting device size and form factor.

Innovative Materials: Exploring new materials with enhanced thermal properties presents challenges in terms of availability, cost, and manufacturing processes.

Uniform Cooling: Achieving uniform cooling across the entire chip surface can be challenging due to varying heat generation levels of different parts of the chip.

Closing

500K+ liquid cold plates installed in the field with zero leaks for safe direct liquid cooling interfaces

30 billion + field hours with zero leaks in liquid cooling systems to reliably maximize performance

20+ years of thermal design expertise and robust, proprietary modeling tools to iterate designs quickly and accelerate speed to market

Have questions? We’re ready to help!