Immersion cooling is a thermal management solution where high heat flux components such as CPUs and GPUS are submerged in a tank of thermally conductive dielectric liquid and heat is transferred using a boiler plate.
High capacity cooling enables higher electronic density compared to other cooling technologies
Eliminates complex systems by eliminating fans, air ducting, baffles, pumps, and manifolds.
Eliminate active components like fans and blowers with passive immersion cooling
Liquid immersion cooling systems include a boiler plate attached to a heat source that is immersed in a dielectric fluid that begins to boil when it comes in contact with the plate. The bubbles that boil up in the fluid bring the heat to the surface and reject the heat from the system where it condenses at a heat exchanger or coil.
Immersion Cooling Boiler Plates
Boyd’s Immersion Cooling Boiler Plates are extremely high performance, differentiated with a boiling enhancement surface (BEC) optimized with high wicking and boiling capacity to ensure consistent fluid flow to the surface.
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