Logic Sockets
Logic sockets shape the semiconductor industry landscape that accommodate nearly every Integrated circuit (IC) package. They facilitate burn-in testing to ensure robust integrated circuit performance and reliability, enabling real-world operating conditions simulation to detect defects early in the design and manufacturing process.
Swift Responsiveness
Quick response to product availability, quote, and technical support inquiries ensure prompt assistance and efficient service.
Reduced Lead Times
Enable rapid design iterations with Boyd’s decades of interconnect, thermal, and design expertise and robust, proprietary modeling tools, which result in shorter lead times.
Diverse Socket Range
Meet diverse and variable requirements with Boyd’s wide array of sockets.
Optimize Demanding Test Cycles
Withstand harsh reliability test environments with robust socket designs.
Efficient Socket Family Iteration
Swiftly iterate socket designs within product families enhancing efficiency and streamlining development processes.
Logic Sockets: Bridging the Gap Between ICs and Testing
Logic sockets play a crucial role in electronic testing and reliability assessment. These versatile components facilitate seamless connections between integrated circuits (ICs) and test equipment, allow for quick insertion and extraction of IC packages during critical stages such as HTOL, LTOL, THB, HAST, PTC, ESD, and Latch Up. Whether it’s functional testing, programming, or burn-in procedures, logic sockets ensure robustness and reliability across various industries.Have a Question?
Logic Sockets: Roles in Burn-In & Reliability Testing
Logic sockets fulfill crucial roles not only in production burn-in applications but in a broader spectrum of reliability tests. While production burn-in demands higher socket volumes, reliability tests present diverse scenarios where logic sockets play an integral role to ensure integrated circuit (IC) durability and longevity.
Navigating Burn-In Strategies: Logic Sockets’ Versatility
For logic sockets, certain applications need 100% production burn-in, such as critical mission operations, automotive systems, specific medical devices, and aerospace and defense electronics. However, even amidst the strict regimen of 100% burn-in, some applications strategically transition to sample lot burn-in. This shift aims to boost efficiency while maintaining reliability standards, showcasing the adaptability and versatility of logic sockets in meeting the ever-evolving needs of the electronics industry.Elevating Semiconductor Testing: Boyd’s Quality Commitment
In semiconductor production, reliability and characterization testing sockets undergo stringent evaluations, emphasizing meticulous assessments, persistent efforts to enhance stability, and an unyielding dedication to maintaining unwavering quality standards. Boyd’s test sockets proactively identify potential vulnerabilities, consistently striving for advancement and ensuring adherence to the most rigorous benchmarks of quality and reliability throughout their entire operational lifecycle, from initial evaluation to prolonged usage.
Elevating Excellence: Boyd’s Dynamic Approach in the Reliability Segment
Boyd’s logic business focuses on critical capabilities to succeed and expand within the reliability segment. This entails developing family socket designs that can rapidly evolve to meet changing needs. Boyd prioritizes rapid responses to inquiries for product availability, quotes, and technical support, ensuring timely product delivery with lead times of 4 to 6 weeks and demonstrating a commitment to exceptional customer service. Our diverse product range effectively meets varied customer requirements and industry demands.Innovating Durability: Boyd’s Cutting-Edge Logic Burn-In Sockets
Boyd excels in the reliability testing segment with our highly reliable logic Burn-In Sockets, which leverage groundbreaking contact technology for robust electrical and mechanical connections. With decades of semiconductor expertise, we innovate continuously to develop cutting-edge contact solutions, ensuring precise testing while safeguarding semiconductor components. Our sockets boast a lifetime rating, enduring up to 10,000 insertions and withdrawals, demonstrating their durability and sustained performance in reliability testing.
QFN Sockets
| Package Type | Series | Pitch | Max Pkg Size | Max Array | Socket Style | Mounting Style | Contact Type |
|---|---|---|---|---|---|---|---|
| QFN | 716 | 0.35 / 1.27 | 12x14 | Open Top | Compression | Spring Probe | |
| QFN | 717 | 0.35 / 1.27 | 14x16 | Open Top | Compression | Spring Probe | |
| QFN | 776P | 0.65 / 1.27 | 10x10 | 18x18 | Open Top | Through Hole | Buckle Beam |
| QFN | 790 | 0.4 / 0.8 | 12X12 | 27X27 | Open Top | Through Hole | Cantiliver |
QFP Sockets
| Package Type | Series | Pitch (mm) | Max Pkg Size (mm) | Pin Count | Max Array | Socket Style | Mounting Style | Contact Type |
|---|---|---|---|---|---|---|---|---|
| QFP | 3000 | 0.4 - 0.8 | 28 x 28 | 32 - 208 | 52x52 | Open Top | Through | Single Beam - Cantiliver |
| QFP | 680, 680H, 680HA | 0.4 - 0.8 | 28 x 28 | 48 - 176 | 44x44 | Open Top | Through | Top Loaded Dual Beam - Cantilever |
| QFP | CQF | 0.4 - 0.8 | 24 x 24 | 64 - 176 | Open Top | Through | Side Loaded Dual Beam - Cantilever |
* ePad Pins are available in each series.
XSOP Sockets
| Package Type | Series | Pitch (mm) | Pin Count - Range | Socket Style | Mounting Style | Contact Type |
|---|---|---|---|---|---|---|
| SOP / SOIC | 652 | 1.27 | 8-44 | Open Top | Through Hole | Cantilever |
| SSOP | 656 | 0.5 - 0.8 | 8-60 | Open Top | Through Hole | Cantilever |
| TSSOP | 676 | 0.65 | 8-20 | Open Top | Through Hole | Cantilever |
| TSOP II | 696 | 0.5 - 0.8 | 54-86 | Open Top | Through Hole | Cantilever |
| TSOP I | 648 | 0.5 - 0.55 | 28-56 | Open Top | Through Hole | Cantilever |
* 652, 656 & 676 sockets are available with ePad Pins. Check with Product Manager.
** 652 & 656 Select Sockets available with Dual Beam Contacts. Check with Product Manager.
CSP FBGA BGA Logic Socket Line-Up
| Package Type | Series | Pitch | Max Pkg Size | Max Array | Socket Style | Mounting Style | Contact Type |
|---|---|---|---|---|---|---|---|
| FBGA / CSP | 715P | 0.35 - 1.27 | 12x14 | Consut PM | Open Top | Compression | Spring Probe |
| FBGA / CSP | 718P | 0.35 - 1.27 | 14x16 | Consut PM | Clamshell | Compression | Spring Probe |
| FBGA / CSP | 772 | 0.4 | 11x11 | 34x34 | Open Top | Compression | Buckle Beam |
| FBGA / CSP | 773 | 0.4 | 11x11 | 22x22 | Open Top | Compression | Buckle Beam |
| FBGA / CSP | 774 | 0.5 | 16x16 | 30x30 | Open Top | Compression | Buckle Beam |
| FBGA / CSP | 775 | 0.5 | 16x16 | 30x30 (300 IO max) | Open Top | Compression | Buckle Beam |
| FBGA / CSP | 776 | 0.5 / 0.65 | 16x16 | 24x24 | Open Top | Through Hole | Buckle Beam |
| FBGA / CSP | 892 | 0.4 - 1.0 | 16x16 | 30x30 | Clamshell | Compression | Buckle Beam |
| FBGA / CSP | 777 | 0.75 / 0.8 | 15x15 | Open Top | Through Hole | Pinch | |
| BGA | CBG-XXX | 0.65 / 1.27 | Consult PM | Consut PM | Open Top | Through Hole | Pinch |
| BGA | FBGA-XXX | 0.65 / 1.27 | Consult PM | Consut PM | Open Top | Through Hole | Pinch |
| FBGA / BGA | Q118 / Q318 | 0.4 / 1.27 | 18x18 | Consut PM | Clamshell | Compression | Spring Probe |
| FBGA / BGA | Q323 | 0.4 / 1.27 | 23x23 | Consut PM | Clamshell | Compression | Spring Probe |
| FBGA / BGA / LGA | 859 | 0.8 / 1.0 | 35x35 | Consut PM | Clamshell | Compression | Buckle Beam / Spring Probe |
| FBGA / BGA | Q340 | 0.4 / 1.27 | 40x40 | Consut PM | Clamshell | Compression | Spring Probe |
| FBGA / BGA / LGA | 861 | 0.8 / 1.0 | 45x45 | Consut PM | Clamshell | Compression | Buckle Beam / Spring Probe |
| FBGA / BGA / LGA | 863 | 0.8 / 1.0 | 55x55 | Consut PM | Clamshell | Compression | Buckle Beam / Spring Probe |
| FBGA / BGA / LGA | 869 | 0.8 / 1.0 | 65x65 | Consut PM | Clamshell | Compression | Buckle Beam / Spring Probe |
Have questions? We’re ready to help!