Thermal systems must directly interface with data center heat sources to extract and exhaust heat. Thermal Interface Materials (TIMs) act in this capacity, quickly absorbing and transferring heat from a heat source to the cooling system or ambient environment. Air gaps and pockets are thermal blockers or insulators. TIMs reduce the air gaps and pockets between a heat source, like a processor, and its cooling solution, like a heat sink, vapor chamber, or cold plate, to maximize cooling efficiency and capacity. Proper thermal interface materials lessen the thermal resistance between the heat source and cooling solution, enabling more efficient and effective cooling.
3M offers light weight, high efficiency TIM solutions for faster assembly, improved device reliability, and extended electronic component lifespan. TIMs like 3M™ Thermally Conductive Acrylic Interface Pads and tapes are ideal for designs with smaller spacing requirements or larger format challenges. These materials can increase server rack component lifetimes up to double by reducing the temperature by -10⁰C.
For data center applications that are air cooled, optimizing the use and distribution of cooled air and management of hot exhaust air improves data center energy efficiency and thermal system performance. Air blockers made of SOLIMIDE® polyimide foam block high temperature exhaust from sensitive environments. Air leak sealing and air gap fillers prevent the loss of cool air, remove design pockets that trap cool or hot air, and connect internal airflow pathways. Air baffle assemblies commonly feature flame rated FR V-0 electrically insulating materials that are thermoformed or folded into airflow management channels that alter the flow of air inside the server to most efficiently direct cold air to heat source dissipators like heat sinks. Engineered Material solutions maximize air cooling system efficiency and thermal performance by optimizing the management of hot and cold air within a server.