Semiconductor
Advanced Engineered Materials for Semiconductors
High-performance plasma, chemical etching equipment, deposition equipment and automated test equipment demands levels of precision that can only be achieved with advanced engineered material solutions that Boyd supplies. Pure, stable, and ultraclean materials help maintain contaminant-free production and test environment required for high quality, reliable semiconductors. Thermal interface materials (TIMs) optimize heat transfer and protect semiconductor components during fabrication and testing to ensure accurate operation and higher chip yield.
Other engineered solutions including acoustic insulation, electrical isolation, environmental sealing, labeling, and EMI/RF shielding are applied around the process chamber to protect supporting equipment such as exhaust lines, power and RF systems, sensors, and enclosures. These materials manage noise, prevent electrical and electromagnetic interference, maintain environmental isolation, and ensure clear identification and compliance. Together, they enhance system protection, reduce unplanned downtime, and maintain long‑term process reliability.
Lower Total Cost of Ownership
Integrated solutions minimize or remove waste, maintenance costs, and downtime.
Global Resources, Regional Support
Respond quickly to geopolitical changes, strategy shifts in region sourcing, near-shoring or global manufacturing moves with Boyd’s supply chain flexibility and replicated, scalable, global manufacturing.
Accelerate Time to Market
Customer-first service with market leading speed and responsiveness combined with decades of semiconductor design expertise and robust, proprietary modeling tools enable Boyd to iterate designs quickly and accelerate speed to market.
Why Boyd for Semiconductor Thermal Interface Materials
Boyd combines innovation with a strong partner ecosystem to deliver one of the industry’s broadest portfolios of thermal interface solutions, giving customers more TIM options than any single‑source supplier. This technology depth enables customized solutions for demanding applications. In semiconductor fabrication, test, and advanced packaging environments, precisely engineered TIMs are essential for managing increasing power densities, reducing thermal resistance, and maintaining temperature stability to protect sensitive devices and equipment.
Boyd further accelerates time to market through engineering agility, rapid prototyping, fast sample turnaround, and accelerated test data delivery. A global manufacturing footprint across Asia, North America, and Europe ensures scalable production, supply chain resilience, and risk mitigation.
Designed for Inside-the-Chamber Applications
Boyd supports semiconductor customers with proven expertise, especially in etching applications that demand reliable inside‑the‑chamber material performance. We provide precision die‑cutting and converting, cleanroom manufacturing and assembly, and materials validated for aggressive etch environments. Through close customer collaboration, Boyd helps improve the longevity of consumables, enhance system reliability, and reduce unplanned downtime.
Thermal Interface Material Solutions for Inside the Chamber Semiconductor Applications
Boyd delivers a comprehensive portfolio of Thermal Interface Materials (TIMs), including gap fillers, electrically isolating and conductive TIMs, and thermal greases. Qualified up to C1 and supported by cleanroom converting and assembly, these materials perform reliably in demanding inside‑the‑chamber semiconductor applications.
Silicone and Non-Silicone TIMs for Semiconductor Equipment
Semiconductor process environments are increasingly chemically aggressive, pushing traditional silicone-based TIMs beyond their limits. Boyd provides both silicone and advanced non-silicone TIMs engineered to perform in these rigorous conditions. Our non-silicone TIMs offer superior chemical resistance without sacrificing thermal performance in etch applications, while silicone TIMs provide reliable thermal performance in less aggressive environments. By selecting the right material for each application, Boyd helps maintain optimal heat transfer, protect sensitive components, and ensure consistent process reliability.
SOLIMIDE® Acoustic Insulation for Semiconductor Equipment
SOLIMIDE® foams provide effective acoustic insulation and inherent fire resistance for demanding semiconductor environments where precision and reliability are critical. Their lightweight structure and high-temperature stability make them ideal for power amplifiers and other heat- and noise-generating equipment. By reducing noise transmission while maintaining thermal integrity, SOLIMIDE® improves system reliability and overall equipment performance.
Reliable UL‑Certified Labels for Semiconductor Applications
Boyd delivers UL‑certified labeling solutions built for the rigorous demands of semiconductor manufacturing. These regulatory labels are designed to meet rigorous demands in harsh chemicals, high temperatures, and cleanroom conditions while maintaining long‑term legibility and adhesion. Through precision converting and certified materials, Boyd ensures reliable product identification, safety compliance, and traceability across fabrication, assembly, and testing.
O‑Ring Sealing Solutions for Semiconductor Chamber Exhaust Lines
FKM o‑rings play a critical role in sealing exhaust lines within semiconductor process chambers, where they must perform reliably under high temperatures, aggressive chemistries, and vacuum conditions. Properly specified elastomers help maintain system integrity by preventing leaks, containing by-products, and maintaining stable chamber pressure. By resisting chemical breakdown and minimizing particulate generation, high‑performance O‑rings extend component life, improve process consistency, and reduce unplanned maintenance in demanding exhaust environments.
Semiconductor Test Thermal Forcing Systems
Liquid-free thermal systems leverage innovative phase change technologies to provide a temperature forcing range from -55°C to 250°C for semiconductor testing in multiple stages throughout the manufacturing cycle. Phase change technologies enable quieter, portable test solutions with fast stabilization, superior power handling, and precision control. Easy-to-integrate thermal forcing systems in the industry’s smallest footprint can be used in your test environment, or into production automated test equipment. Thermal forcing systems accommodate a wide range of device sizes and types, whether socketed or soldered down. Applications include DUT level thermal management, thermal stream replacement, temperature forcing, handler integrations, ATE test, bench testing, system level testing, high reliability testing, and OEM integrations.
Semiconductor Burn-In and Test Sockets
Logic and memory burn-in and test sockets feature innovative contact technology that gives more reliable electrical and mechanical interconnect. Contact design is optimized to minimize damage to the solder ball with lowest possible actuation force. Contacts open to allow package insertion for 0.5mm pitch and above. Several contact technologies, both through- hole and compression mount, are used for finer pitch packages < 0.5mm. Platform design gives ultimate flexibility in base sockets than can be used for different package sizes leveraging an adapter customized for specific customers’ packages. Changing an adapter to the socket is faster and lower cost than providing new sockets for each package size. Modifying base designs allows us to help customers choose the smallest socket footprint to maximize burn-in board capacity and through-put.
Direct to Chip Cooling Systems
Comprehensive direct to chip cooling solutions range from air cooling to high efficiency liquid cooling and innovative immersion cooling development that maximize thermal density and enable higher processing power in the most compact format. Cool switch chips up to 2200 watts (W), GPUs up to 750W, and IGBTs up to 6KW now with continued research and development from Boyd to push power density and compute performance boundaries to the next level.
Boyd’s Chip Cooling Technologies
Leveraging high performance fans and blowers with remote heat pipe-heat sink assemblies, extreme air cooling can easily be routed to cool entire blades and racks in cloud applications while maximizing server density and using existing facility plumbing for efficient performance upgrades in current infrastructure. Liquid loops and liquid cold plates cooled by coolant distribution units (CDUs) or other liquid cooling systems provide highest performance direct to chip liquid cooling for advanced GPUs, CPUs, and switch chips. Custom skyline liquid cold plates create the most efficient thermal interface between liquid systems and the processors, customized to maximize thermal efficiency for each system installation. This maximizes full system performance and environmental sustainability while enabling higher processing density and longer semiconductor lifetimes for marketable performance differentiation.
Faster Processing Speeds and More Processing Power
Cooler chips mean faster semiconductor processing. With Boyd’s overlapping thermal technology portfolio of liquid, two phase, and air-cooling innovations, we’re able to recommend and blend the right fit for each application.
Increase Power Density and Pack More I/O in Smaller Sizes
Create additional design space or smaller semiconductor solutions with Boyd’s high efficiency liquid cooling systems and thermal insulation for higher performance in a smaller footprint.
Increase Reliability and Quality
Keep semiconductors and equipment in their optimal operating temperature range to extend lifetimes and improve reliability.
ATE Liquid Cooling Systems and Insulation
Semiconductor automated test equipment (ATE) operates at high speed and power, requiring advanced liquid cooling systems. Boyd’s innovative liquid cooling systems optimize each step in testing a semiconductor for ultimate quality control with maximum test cycle efficiency for trusted reliability and fastest speed to market. Liquid cold plates driven by efficient liquid cooling systems and chillers with particulate-free, non-toxic SOLIMIDE® Foam thermal insulation keep fluid lines cold so wafers and chips are tested at safe temperatures in pure environments. Optimized thermal management and insulation protects sensitive components from excessive heat loads and contaminants while decreasing thermal cycle test times.
Decrease Test Times
Boyd’s highly efficient, reliable, and sustainable liquid cooling systems decrease test times, maximize temperature forcing range, or decrease chip operation temperature for faster processing and better uptimes.
Related Products & Resources
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