Liquid Cooling Systems & Components

High Performance Liquid Cooling Systems & Components


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High Performance Liquid Cooling Systems & Components

As electronic devices become more powerful, the Internet of Things (IoT) further integrates compute and smart device functionality into new and different applications. As power density continually increases, liquid cooling has become prevalent across most industries as it is the most compact and efficient method for cooling high density heat loads. Liquid cooled thermal management solutions leverage higher heat capacity of liquid as compared to air or solid conduction to transfer and dissipate high heat loads. Liquid absorbs and transports heat at a high rate, enabling high performance cooling solutions that cannot be solved by traditional air solutions.

Boyd offers high reliability liquid server cooling system solutions at the system, enclosure, device, or component level ranging from complex liquid cooled systems that integrate multiple technologies to cool some of the largest, most demanding data centers in the world to small off-the-shelf cold plates for testing purposes. Boyd liquid cooling solutions help customers increase performance efficiency, optimize resource utilization, maximize energy recovery, and increase reliability across all system levels to minimize or remove waste, maintenance costs and downtime for an overall lower total cost of thermal system ownership. Boyd’s liquid cooling systems and components have been in the field across a variety of applications for decades - providing us with years of reliability data to drive continuous improvement in system design and test procedures. Boyd is the only liquid cooling system manufacturer in the world to offer 100% in-line thermal testing for high reliability, worry-free, leak-free liquid solutions.

Learn about Boyd's solutions in the sections below:

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Market-leading advancements in liquid cooling technology and R&D are the foundation for Boyd’s high performance, high reliability coolant distribution unit (CDU) technology with integrated smart features. In-Row CDUs for larger cooling systems or In-Rack CDUs for integrated server cooling systems can operate fully self-contained or tie into existing facility water cooling systems depending on data center configurations, space and needs. Liquid cooling solutions can fully integrate from the chassis to the blade down to the component or chip level for high efficiency, integrated solutions.

Liquid cooling system CDUs manage heat loads much more efficiently than traditional data center air cooling systems, resulting in denser thermal systems with smaller dimensions that operate quieter and enable higher power density, more available space in existing design footprints, and safer, more sustainable data center environments. Integrated intelligent systems with smart instrumentation controls for flow, pressure, and temperature, pump-assisted assemblies for single and two phase flow, and blind mate quick disconnects optimize resource demand, minimize water and energy use, maximize safety and reliability, and optimize service and maintenance speed for data center operator lowest total cost of ownership. Boyd's design engineering expertise and decades of reliability data combined with our wide range of manufacturing capabilities and a robust technology roadmap enables us to anticipate data center cooling needs and fabricate optimized, integrated, intelligent CDUs as a one-stop-shop.

  • CDU Components
Liquid Cooling Loops
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Liquid Cooling Loops consist of a combination of cold plates coupled together with fittings and tube that connect to the liquid system that houses a pump. This combination offers the right performance to achieve adequate cooling of high-power electronics. Often these loops are terminated with quick disconnect (QD) fluid couplings that allow for full hot swap ability between electrical modules in Enterprise Electronics. All the materials used in each loop have been validated based upon the chemical compatibility of the materials and process coolant to offer maximum reliability.

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Chillers precisely control operating temperature and cool below ambient temperature. They can be designed as stand-alone systems or designed for full integration within a larger system. By optimizing components in the cooling loop, chillers can meet a wide range of sub-ambient cooling requirements, including extreme low temperatures or cooling very large heat loads.

Boyd chillers are designed for flexibility with a wide variety of available pumps, controllers, and additional safety and monitoring features that enable you to tailor your chiller to your specific application. Chillers customized to your performance and dimensional needs help you optimize operating costs, resource utilization and maintenance time and fees.

Low Temperature Chillers can cool as low as -80°C with temperature stability as tight as ±0.5°C (±0.9°F).

High Capacity Chillers are capable of cooling capacity of 21 kW or 50 kW and temperature stability of ±0.5°C (±0.9°F) or ±1.0°C (±1.8°F).

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Heat exchangers (HeX) are an effective method to transfer heat out of a liquid cooling system, either to another liquid system (Liquid to Liquid) or an air system (Liquid to Air). Heat Exchangers are a critical component of a liquid cooling system rejecting exhaust heat transferred from the heat source out of the liquid cooling system. By providing high surface areas for liquid paths to reject or absorb heat, liquid heat exchangers improve the efficiency of a complete liquid cooling system.

Boyd engineering teams combine decades of expertise with hundreds of design options for custom and semi-custom heat exchangers including a wide range of fin options, heat pipes and other enhancements, an extensive selection of fluids, oils, and coolants, and a wide range of fabrication methods to design and manufacture liquid heat exchangers to enhance any system.

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Liquid cold plates are a critical component of a liquid cooled system, bringing coolant directly to the device that needs to be cooled, strategically designed to optimize the interface between a heat source and the liquid cooling system. Boyd has the broadest range of liquid cold plate design, manufacturing technologies, configurations and trusted market performance in the industry.

Our global capabilities and broad experience enable us to develop and produce more efficient and compact liquid cold plates for extremely high heat loads, optimized to your specific performance and configuration needs, while still maintaining design flexibility to help you maximize thermal system efficiency and reduce total operating costs. Cold plate options are designed for varying heat loads from simple copper tube in aluminum bases to custom cold plates with highly machined internal geometries to maximize turbulent flow and external geometries with custom skylines and pedestals to maximize heat source interface. 100% in-line thermal testing and decades of trusted market performance assure reliability across battery and inverter cooling for electric vehicles, chip cooling in advanced compute applications, radar module cooling in aerospace and defense applications, as well as many other highly specified applications in medical, semiconductor fabrication, test and measurement, hyperscale datacenters and 5G infrastructure installations that require extremely high reliability.

Reservoir Pumping Unit (RPU)
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The Reservoir Pumping Unit (RPU) is used in conjunction with a Rear Door Heat Exchanger, these function together as a liquid to air CDU. Leveraging this fluid moving system allows proper fluid control coupled with air flow management to provide the end customer with maximum energy efficiency while achieving the cooling requirement. With this base liquid system, Boyd's engineers can add additional controls and features that offer our customers improvement in serviceability, uptime, and performance with heat rejection.

Manifolds
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Manifolds are used to connect liquid cooling loops to the liquid system such as CDU’s and RPU’s. Each manifold is fully tested to provide equal flow to each of the QD’s connections without leaking, over the full life of the product. Using pressure relief valves and sensors, we make sure the entire liquid system is functioning properly. Especially critical in building high quality manifolds is the importance of particle size control as large particles could become lodged into the quick disconnect of the manifold and not seal properly when disengaged resulting in a serious leak. Each manifold and liquid subsystem is fully flushed, and the effluent is filtered and validated for elimination of all particles that could cause this issue.

Liquid Assisted Air Cooling (LAAC)
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In some systems, liquid cooling loops cannot be utilized directly and requires the loop exchanges the heat directly to the air stream. In these cases, the Liquid Assisted Air Cooling (LAAC) is used to remove high amounts of power from the chips while rejecting the heat immediately into the air stream. This liquid assisted cooling offers customers the ability to cool the latest chips available in the market.

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More products are moving towards integrated enclosures or chassis and thermal management solutions. By incorporating a liquid flow path within an enclosure or chassis and ensuring an adequate thermal connection to heat sources, enclosures and chassis can act both as a structural and thermal solution.

Liquid flow paths within chassis and enclosures can be as simple as tubes bonded to the structure or have complex internal geometries that optimize liquid contact area, flow rate, and pressure drop. Enclosures can utilize a broad range of capabilities and fabrication methods to enable Boyd engineers to provide our customers with the most effective liquid cooled solution for their product.

Popular fabrication methods include aluminum die casting, sheet metal bending, welding, dip brazing, and vacuum brazing.

  • Liquid Cooled Chassis & Enclosures

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