Liquid Cooling Solutions: Innovative and High Performance Systems and Components

Electronic devices are ever more powerful and society is increasingly more connected with continual improvements in latency driving further compute and smart device functionality adoption into new and different applications. Liquid cooling systems are now prevalent across most advanced performance industries as the most compact, sustainable, and efficient method to cool high density heat loads to enable this continual increase in power density. These systems leverage the higher heat capacity of liquid, which absorbs and transports heat at a high rate very efficiently as compared to air cooling or solid conduction. Liquid cooling systems transfer and dissipate extreme heat at a high rate, enabling high compute performance and power density levels that cannot be solved by traditional air-cooled systems.

Resources and Downloads

How to Cool a Data Center? Liquid Cooling System Solutions

How to Cool a Data Center with an In-rack Liquid Cooling System

3D Rendering of Cloud Data Center Server
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High Reliability for Peak Performance with Sustainability in Mind

Boyd’s high reliability liquid cooling is applied at the system, enclosure, device, and component level with direct liquid cooling (DLC). Solutions range from complex liquid cooled server systems that integrate multiple technologies to cool the largest, most demanding hyperscale compute cloud data centers in the world to compact cold plates that bring liquid cooling performance direct to the silicon or power heat source with direct liquid cooling.

Increase performance efficiency, optimize energy use, maximize energy recovery, and increase reliability across all thermal system levels to minimize or remove waste, maintenance costs and downtime for a sustainable, lower total cost of cooling system ownership.

For those worried about introducing liquid into advanced electronic systems, Boyd’s liquid cooling systems have been installed in market for decades with 20+ years of reliability data that drives continuous improvement in system design and test procedures. Boyd is the only liquid cooling system manufacturer in the world to offer 100% in-line thermal testing for high reliability, worry-free, leak-free liquid solutions.

Learn about Boyd's solutions in the sections below:

Key Industries


Liquid cooled servers, data center cooling systems, and direct liquid cooled (DLC) GPUs and CPUs maximize compute density and maintain peak performance with minimal latency more sustainably with more reliable uptime. Boyd’s liquid cooling system design cycles accelerate time to market.


Lightweight, ruggedized, compact liquid cooling systems extend battery range and accelerate charge cycles to differentiate new EV models and boost consumer adoption. EV battery cold plates, power conversion liquid cooling, inverter cold plates, and low profile telematics cooling.


High reliability medical equipment cooling solutions. Boyd’s liquid cooling systems for medical products include CT scanner liquid cooling, MRI cooling, UV light and laser cooling solutions, x-ray thermal management, medical chillers, and ultrasound thermal systems.


High power density industrial equipment requires rugged, high performance liquid cooling systems. Power electronics cooling, IGBT liquid cooling, inverter cooling, IGBT direct liquid cold plates, semiconductor liquid cooling systems, battery storage liquid cooling.

Liquid Cooling Systems

Boyd’s Liquid Cooling Systems undergo extensive flow network analysis using our proprietary design software powered by decades of empirical data. Meaning our thermal design engineers and system architects achieve a validated, on-specification thermal design much faster than anyone else on the market. We test each liquid cooling system to ensure expected performance and system behavior. Our flexible development model ranges from a heavy to light touch depending on your support needs. We adapt these liquid cooling systems for new applications in high performance industries, that need to transition to the high-capacity thermal performance of liquid systems.

Boyd’s liquid cooled systems, like coolant distribution units and recirculating chillers, incorporate detailed system intelligence to and from individual sensors, pumps, joints, and operating software for complete intelligent system behavior that maximizes sustainability and reliability. Efficiency is planned throughout the entire product lifecycle including packaging, installation fixtures, and quick service features that assure product integrity through shipping, maximize assembly throughput and minimize service time with hot-swappable quick disconnects.

Liquid cooling system CDUs manage heat loads more efficiently than traditional data center air cooled systems. More compact, denser thermal systems are quieter and support higher power density for safer, more sustainable data centers. Intelligent systems with smart instrumentation minimize water and energy use and optimize service and maintenance speed for lowest total cost of operation.

Boyd chillers are designed for flexibility with a wide variety of available pumps, controllers, monitors, and additional safety features to cool high thermal loads while optimizing operating costs, resource utilization, and maintenance time and fees. Cool as low as -80°C or up to 50 kW cooling capacity with temperature stability as tight as ±0.5°C (±0.9°F) or ±1.0°C (±1.8°F).

Reservoir Pumping Unit (RPU)

The Reservoir Pumping Unit (RPU) is used in conjunction with a Rear Door Heat Exchanger, these function together as a liquid to air CDU. Leveraging this fluid moving system allows proper fluid control coupled with air flow management to provide the end customer with maximum energy efficiency while achieving the cooling requirement. With this base liquid system, Boyd's engineers can add additional controls and features that offer our customers improvement in serviceability, uptime, and performance with heat rejection.

Liquid Assisted Air Cooling (LAAC)

In some systems, a liquid cooling loop cannot be utilized directly and requires the loop exchanges the heat directly to the air stream. In these cases, the Liquid Assisted Air Cooling (LAAC) is used to remove high amounts of power from the chips while rejecting the heat immediately into the air stream. This liquid assisted cooling offers customers the ability to cool the latest chips available in the market.

Liquid Cooling System Service

We stand behind our liquid cooling systems and expect them to perform reliably for you over many years. Achieving this long tenured, reliable performance does require regular maintenance to assure peak performance.

We’re responsive to customer support needs ranging from spare parts fulfillment, system service, and repair solutions. Globally available service operations and factory-certified technicians provide rapid, effective, and affordable service to minimize system maintenance downtime.

Service Agreements

For those customers who do not want to manage service needs on-demand, Boyd offers worry-free service agreements custom-tailored to your needs that addresses all your Liquid Cooling System maintenance and support requirements, and can include:

On-site support for warranty and non-warranty repairs
Scheduled preventative maintenance
Service rotator warehousing
Spare parts stocking

Training and On-Site Support

Customer training and a variety of on-site services help you optimize management of your liquid cooling systems, including:

Equipment user training
Preventative maintenance training
OEM help desk training
On-site diagnosis and repair of equipment
Spare part installation training

Liquid System Components

Liquid Cooling Components are a part of a complete liquid cooling system. Liquid cold plates and liquid cooled chassis absorb heat into a liquid cooling system as the primary direct liquid cooling interface between the liquid system and heat sources, while heat exchangers and radiators reject heat into ambient air or a secondary liquid cooling loop. These components determine how much heat a liquid cooling system can absorb or reject as the first and last processes in a liquid cooling cycle. Direct liquid cooling interface and heat rejection significantly impacts liquid cooling system effectiveness, efficiency, and performance, so they require significant design consideration.

Boyd Engineering excels in cold plate and heat exchanger design optimization with accurate performance simulation that accelerates our design cycle.​ We’re experts at developing and manufacturing high quality, compact liquid cold plates and heat exchangers that meet your system requirements while reducing weight and complexity. With hundreds of liquid cold plate and heat exchanger options and configurations using a variety of fabrication methods, Boyd can quickly help you optimize how your liquid system interfaces with your heat sources.

Liquid cold plates strategically designed to optimize the interface between a heat source and the liquid cooling system maximize thermal system efficiency and reduce total operating costs. Creative direct liquid cooling designs optimize turbulent liquid flow and feature customized skylines to maximize heat source interface. 100% in line leak testing assure reliability for EV battery cooling, advanced compute chip cooling, radar cooling, and direct liquid cooling.

Heat exchangers (HeX) transfer heat out a liquid cooled system, either to another liquid cooling system (Liquid to Liquid) or to an air cooled system (Liquid to Air). Liquid heat exchangers improve complete liquid cooling system efficiency by providing high surface areas for liquid paths to reject or absorb heat.


Connect liquid loops to the liquid cooling system with quick disconnects that accelerate installation and service. Pressure relief valves and sensors assure the entire liquid system functions properly, monitors and controls for liquid particle size prevent clogging and leaks. Each manifold and liquid subsystem is fully flushed. Effluent is filtered and validated to eliminate all particles that could cause clogging. Each manifold is fully tested to provide equal flow to each quick disconnect connection to assure zero leaks over the full life of the product.
Turn structural enclosures and chassis into liquid cooling system components. Liquid flow paths within chassis and enclosure walls can be as simple as tubes bonded to the structure or have complex internal geometries that optimize liquid contact area, flow rate, and pressure drop. Popular fabrication methods include aluminum die casting, sheet metal bending, welding, dip brazing, and vacuum brazing.

Liquid Cooling Loops

Liquid Cooling Loops combine direct liquid cooling cold plates with fittings and tube to connect to pumped liquid systems to cool high-power electronics. Terminate loops with quick disconnect (QD) fluid couplings for full hot swap ability between electrical modules to maximize service efficiency. All materials used in each loop are validated based upon material chemical compatibility and the process coolant for maximum reliability.

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