Boyd’s high reliability liquid cooling is applied at the system, enclosure, device, and component level with direct liquid cooling (DLC). Solutions range from complex liquid cooled server systems that integrate multiple technologies to cool the largest, most demanding hyperscale compute cloud data centers in the world to compact cold plates that bring liquid cooling performance direct to the silicon or power heat source with direct liquid cooling.
Increase performance efficiency, optimize energy use, maximize energy recovery, and increase reliability across all thermal system levels to minimize or remove waste, maintenance costs and downtime for a sustainable, lower total cost of cooling system ownership.
For those worried about introducing liquid into advanced electronic systems, Boyd’s liquid cooling systems have been installed in market for decades with 20+ years of reliability data that drives continuous improvement in system design and test procedures. Boyd is the only liquid cooling system manufacturer in the world to offer 100% in-line thermal testing for high reliability, worry-free, leak-free liquid solutions.
Learn about Boyd's solutions in the sections below: