Cooling AI & HPC: Unlocking Accelerated Computing Potential
Next-generation higher density AI and high-performance computing (HPC) platforms demand powerful thermal management. Effective cooling unlocks the full potential of cutting-edge NVIDIA AI infrastructure, redefining compute performance. Boyd addresses this challenge by designing advanced liquid cooling systems to support customers deploying NVIDIA accelerated computing infrastructure . From cold plates to manifolds and coolant distribution units (CDUs), Boyd customizes each of its thermal solutions to meet the unique demands of every application, delivering the performance, scalability, and reliability required for today’s most complex data-driven workloads.
Precision Liquid Cooling
Every AI or HPC deployment has unique cooling needs. Boyd takes a highly customized approach to thermal management, designing each liquid cooling solution to match the system’s form factor, power density, and performance objectives. Whether optimizing cold plate internal geometry for high-wattage GPUs and DPUs or designing manifolds that efficiently route coolant through dense server layouts, Boyd ensures every component enhances thermal performance without compromising space or energy efficiency.
By collaborating closely with design teams and system integrators, Boyd fine-tunes every element of the thermal interface to align precisely with NVIDIA’s MGX rack architecture for high density accelerated computing. This engineering precision minimizes pressure drop, lowers thermal resistance, and improves reliability in the most demanding compute environments.
Optimized Liquid Cooling: From Cold Plate to CDU
Boyd’s thermal engineers design liquid cooling for NVIDIA MGX architecture systems with a holistic focus. We integrate cold plates, manifolds, and coolant distribution units (CDUs) into a unified solution to maximize thermal efficiency and simplify deployment.
Manifolds direct coolant precisely across devices to reduce flow variation, while cold plates feature optimized internal geometries and flow paths to boost heat transfer at the source. CDUs regulate fluid temperature, pressure, and flow based on system load and ambient conditions. This integrated design enables Boyd to deliver compact, high-performance cooling systems that scale with the demands of next-generation AI and HPC platforms.
Seamless Integration: Boyd’s Co-Engineered Cooling for NVIDIA MGX Architecture
Boyd collaborates closely with customers building NVIDIA platforms to engineer application-specific cooling that keeps pace with rapid innovation. Our co-engineering support enables rapid prototyping, thermal modeling, and validation aligned with customer design cycles to meet aggressive launch timelines.
We team with system architects and integrators to ensure seamless integration with NVIDIA infrastructure. From early design through high-volume production, Boyd delivers scalable thermal solutions that unlock the full performance and reliability of next-generation AI technology.
Boyd: Advanced Thermal Management for Next-Gen AI & HPC
NVIDIA’s most advanced MGX architecture systems demand thermal systems engineered for peak performance and energy efficiency. Boyd meets this challenge with custom liquid cooling solutions including cold plates, manifolds, and CDUs, designed as unified systems that scale with evolving compute needs.
As AI and HPC continue to advance, Boyd supports NVIDIA-accelerated innovation with application-specific engineering, accelerated development, and scalable manufacturing. Let’s build cooling systems that will power the future. Connect with our experts to start your next thermal innovation.
