Cooling AI & HPC: Unlocking Accelerated Computing Potential Next-generation higher density AI and high-performance computing (HPC) platforms demand powerful thermal management. Effective cooling unlocks the full potential of cutting-edge NVIDIA AI infrastructure,...
Boyd Scales Next-Gen AI Infrastructure with the NVIDIA GB200 NVL72 System Large language models now surpass 1 trillion parameters, ushering in a new era of AI that demands next-generation technology. Meeting this scale requires powerful compute and innovative cooling...
Boyd ROL2300: High-Density AI Cooling As Artificial Intelligence (AI) servers grow denser and thermal loads increase, liquid cooling plays a crucial role in high-performance data center infrastructure. Boyd’s ROL2300 Coolant Distribution Unit (CDU) meets modern data...
Spacecraft Technology: Cryogenic Cooling to Graphite Composites Boyd has advanced human accomplishment for over 50 years. We have advanced thermal design innovation and developed cutting-edge solutions for extreme environments in space. Our technology enables...
Scaling Data Center Cooling Optimizing thermal management from the chip level to the facility level becomes essential as data centers scale to support increasing AI, cloud computing, and hyperscale workload demands. Efficient cooling ensures maximum performance,...
Beyond Conventional Cooling: Immersion Technology Electric vehicles (EVs) and data centers demand advanced cooling solutions to maintain performance, safety, and longevity. EV batteries generate significant heat during charging and operation, which can shorten their...
