Boyd Scales Next-Gen AI Infrastructure with the NVIDIA GB200 NVL72 System
Large language models now surpass 1 trillion parameters, ushering in a new era of AI that demands next-generation technology. Meeting this scale requires powerful compute and innovative cooling solutions that maximize performance and efficiency. NVIDIA GB200 NVL72 liquid-cooled system delivers on this need, while Boyd’s complete liquid cooling systems streamline integration at scale. Boyd helps data centers achieve peak performance, energy efficiency, and uptime with precision-engineered cold plates, rack manifolds, and cooling distribution units (CDUs).
NVIDIA GB200 NVL72 featuring high-density compute modules with organized cabling for efficient data center performance.
Boosting AI Performance and Sustainability Through Cooling Innovation
NVIDIA GB200 NVL72 infrastructure processes data up to 30x faster than traditional CPUs, driving unprecedented demand for compute power in hyperscale data centers. Delivering this performance requires advanced thermal density management that goes beyond conventional air-cooling methods that enable data centers to minimize operational costs, maximize energy efficiency, and meet sustainability requirements.
To address these challenges, cooling solutions must combine high efficiency, low water usage, and a compact footprint to support rapid deployment and scaling. Boyd’s complete liquid cooling systems leverage precision-engineered cold plates, rack manifolds, and cooling distribution units (CDUs) to optimize thermal management, reducing energy consumption by up to 40% compared to air-cooling. Our technology enables data centers to meet growing compute demands while enhancing energy efficiency and minimizing environmental impact.
Simplifying GB200 NVL72 Deployment with Complete Liquid Cooling
Boyd’s complete liquid cooling systems support the performance and density of NVIDIA GB200 NVL72 platforms. Our systems integrate seamlessly with NVIDIA racks, enabling efficient rack-scale thermal management by extracting heat at the source and transferring it through closed-loop systems to external CDUs.
The GB200 compute tray liquid cooled by Boyd delivers efficient power and high-density performance for next-gen AI workloads
This architecture enables rapid integration and streamlined maintenance. Rack manifolds streamline fluid distribution, and modular cold plates enable rapid node replacement without system downtime. With plug-and-play integration and reduced power and water consumption, Boyd’s liquid cooling technology helps data centers scale efficiently while maximizing uptime, performance, and sustainability.
Boyd’s Liquid Cooled Loop system uses cold plates and manifolds to deliver efficient, scalable cooling for high-density electronics in data centers.
Boyd: Shaping the Future of AI Infrastructure with NVIDIA
Boyd’s innovative cooling technologies for NVIDIA GB200 NVL72 infrastructure, helps data centers optimize compute performance while reducing water usage and improving power usage effectiveness (PUE). By optimizing thermal management, Boyd enhances operational efficiency and accelerates sustainability goals. This enables AI factory data centers to deliver higher performance with a smaller environmental footprint, supporting the global push for responsible AI deployment.
Boyd and NVIDIA collaborate to deliver scalable AI systems that adapt to evolving demands. Boyd leverages extensive engineering expertise, decades of thermal heritage, and a global manufacturing footprint to deliver dependable, high-performance cooling solutions designed for AI workloads. Together, we enable innovation and shape the next generation of AI.
Powering AI Innovation: A Partnership in Thermal Solutions
Boyd collaborates with NVIDIA to provide scalable AI deployment through complete liquid cooling systems engineered for demanding AI workloads. Leveraging extensive engineering expertise, decades of thermal system heritage, and a global manufacturing footprint, Boyd delivers dependable, high-performance cooling that supports NVIDIA’s latest technologies. This collaboration accelerates innovation by driving efficiency, adaptability, and sustainability, building a strong foundation for the future of large-scale AI. Ready to optimize your AI infrastructure? Contact our experts to explore tailored thermal solutions that meet your evolving needs.
