5G Implementation

5G infrastructure upgrades and installations support the large influx of data and connectivity demands coming from both consumer and enterprise markets. Industries like autonomous vehicles, smart cities, robotics, augmented reality, virtual reality, and manufacturing automation rely on consistent and reliable network access, data transfer, and connectivity performance. The Internet of Everything (IOE) and associated digitization of all devices is enabled by 5G and network convergence innovation.

Radio enclosures installed on 5G towers are difficult to access and exposed to extraordinary weather and temperature extremes. High reliability solutions that seal, cool, and protect Active Antenna Systems (AAS) are critical to minimizing maintenance and assuring maximum uptime, even with increasing power density, tightening space, and limited weight requirements. Aluminum die cast enclosures modified with heat pipes or thermosiphons allow customers to add more frequency bands within the same site space while operating at higher power levels, especially in Macro Radio Units. With no moving parts, these thermal solutions are designed for long term reliability in a compact, weight efficient package in the coldest and hottest environments. Waterproof enclosure seals protect tower-mounted components from element degradation while EMI shielding and electrical insulation protect signal integrity.

Powerful 5G base stations direct individual radio frequency connections to every network user within range at a higher frequency than previous telecommunication technologies. Base stations are tightly packed with racks of equipment like Baseband Units (BBUs) or Split Centralized Unit - Distributed Unit (CU-DU) that operate high power densities at accelerated service speeds. Innovative cooling technologies with high thermal performance exceed 5G base station power demands, protecting signal integrity of the base station, and extending the lifetime of all components. Heat Pipe Assemblies, Zipper Fin Heat Sink Assemblies, Graphite Heat Spreaders, and Thermosiphons passively maintain optimal operation temperatures for 5G base station equipment. Exposure to extreme conditions and the need to minimize service requirements drive demand for passive cooling technologies and rugged material solutions that seal and protect base station units.

5G infrastructure installations are challenged by constrained space and increasing power density. All components must be optimized for efficiency and performance in compact configurations, ruggedized to withstand temperature extremes and harsh environmental conditions. Power amplifiers, converters, controllers, receivers, transmitters, transceivers, and ASICs require innovative thermal management solutions that cool growing power loads in smaller and smaller volumes to optimize reliable operation, maintain radio access networks, and sustain overall system uptime.

Some components, like converters, operate in a fully encapsulated environment where forced convection is not possible and operating temperatures can reach extreme highs. Thermal Chassis that leverage Encapsulated Graphite Heat Spreaders, Heat Spreading Vapor Chambers, and Heat Pipe Heat Exchangers passively transport and dissipate heat from enclosures to ambient environments. Next generation systems can also leverage Boyd’s liquid cooling systems or pumped two-phase solutions to push performance.

Packing complex and high-powered components in tight outdoor spaces presents electrical and mechanical challenges. Protect signal integrity with electromagnetic interference shields. Block spark voltage and flame with electrically insulating barriers. Seal and insulate against the elements and temperature extremes with robust, rugged enclosure gaskets.

5G network performance relies on advanced server, storage, and network systems. These interconnected systems depend on Boyd’s solutions in Cloud Compute, Data Center and Hyperscale Compute applications. Devices connected to 5G networks drive innovation in performance capabilities, intelligence, and speed. Development in eMobility and Mobile Compute applications also benefit from multifunctional solutions designed and manufactured by Boyd.