5G infrastructure installations are challenged by constrained space and increasing power density. All components must be optimized for efficiency and performance in compact configurations, ruggedized to withstand temperature extremes and harsh environmental conditions. Power amplifiers, converters, controllers, receivers, transmitters, transceivers, and ASICs require innovative thermal management solutions that cool growing power loads in smaller and smaller volumes to optimize reliable operation, maintain radio access networks, and sustain overall system uptime.
Some components, like converters, operate in a fully encapsulated environment where forced convection is not possible and operating temperatures can reach extreme highs. Thermal Chassis that leverage Encapsulated Graphite Heat Spreaders, Heat Spreading Vapor Chambers, and Heat Pipe Heat Exchangers passively transport and dissipate heat from enclosures to ambient environments. Next generation systems can also leverage Boyd’s liquid cooling systems or pumped two-phase solutions to push performance.
Packing complex and high-powered components in tight outdoor spaces presents electrical and mechanical challenges. Protect signal integrity with electromagnetic interference shields. Block spark voltage and flame with electrically insulating barriers. Seal and insulate against the elements and temperature extremes with robust, rugged enclosure gaskets.