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Heat Sinks

What is a Heat Sink?

Heat sinks help dissipate heat from heat sources to ambient air by using increased surface area to maximize heat transfer. Heat sinks come in a variety of constructions, but all include collecting heat into a base, conducting heat to the fins, and using the added surface to conduct heat to air.

Aluminum Extruded Heat Sinks

Hundreds of standard configurations including TIMs and mounting hardware available for common semiconductor devices.

Aluminum Extrusion Profiles

Available in raw bar, cut to length, or machined to specifications. Hundreds of optimized profiles.

Max Clip Heat Sink

Save assembly time and costs while improving thermal performance with this system utilizing specialized clips and highly engineered aluminum extruded heat sinks.

Stamped Heat Sink

Heat sinks designed for cooling semiconductor devices on printed circuit boards (PCBs). Includes a variety of geometries, mounting options, and attachment types.

Zipper Fin Heat Sink Assemblies

Zipper Fins allow for high fin aspect ratios and more design flexibility. Zipper fins are extremely cost efficient in larger volumes.

Skived Fin Heat Sink

Higher fin densities and fin aspect ratios typical of heat sink assemblies without the bonding interface resistance between base and fins. Available in copper and aluminum.

Die Cast Heat Sinks

Casting allows for near net parts in complex geometries to reduce post-processing and interface resistance in assemblies.

Bonded & Brazed Fin Heat Sink Assemblies

Fins are epoxied, soldered, or brazed into an extruded or cast base in order to achieve a higher fin aspect ratio and fin density, vastly improving thermal performance.

Folded Fin Heat Sinks

Folded Fins enable higher fin densities and increased heat transfer from a single stamped sheet assembled on a base. Folded fin stock is also found in Extended Liquid Cold Plates, Heat Exchangers, or available separately.

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Wallet Friendly Solutions

Cost-effective and readily-available solutions

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Broadest Heat Sink Offerings

From small stamped aluminum heat sinks for cooling discrete semiconductors at the board level to extremely large advanced fin types and unique geometries.

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Improve Performance

Increasing Surface Contact with Ambient Air for More Heat Transfer

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Two Phase Enhanced Air Cooling for Power Electronics

Standard and Customizable Heats Sinks

In addition to hundreds of standard part numbers with thousands of options, Boyd provides custom cut and machined extrusions, high heat transfer heat sink assemblies, and industry-specific heat sinks. Our advanced manufacturing methods enable us to fabricate optimized heat sinks to meet demanding application requirements.

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Fan Heat Sink Combinations

Improve heat sink performance with the addition of a fan or blower for increased airflow through fins.

Heat Spreading Heat Pipe Assemblies

Spread high density heat loads to optimize heat sink efficiency.

Transport Heat Pipe Assemblies

Transport heat to safer, remote dissipation regions.

Heat Spreading Vapor Chamber Assemblies

Spread high heat loads across the entire heat sink base.

3D Vapor Chambers & Assemblies

Maximize available volume with three-dimensional vapor chambers.

Encapsulated Graphite Heat Spreaders

Spread high heat loads using high conductivity graphite for lightweight applications.

Heat Sink Enhancement Solutions

With our expertise in wide variety of thermal management technologies, we’re able to design and manufacture heat sinks with other air-cooling, two-phase heat transfer, or liquid solutions to produce custom, more complete thermal management solutions specifically for your system. Two phase vapor chambers and heat pipes are common technologies paired with heat sinks to augment air cooling thermal performance.

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