Stamped Heat Sinks

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Improved Performance

Improve heat dissipation, device performance, and speed with the added surface area of Stamped Heat Sinks

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Hundreds of Options

Meet specific installation needs with our wide variety of mounting configurations

Fast & Wallet Friendly Solutions

Cost-effective and readily-available stamped device level solutions

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Longer Product Lifetimes

Increase device reliability and product lifetimes with passive air cooling

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Product Details Product Tables Related Products

Stamped Heat Sinks are a cost-effective solution to add surface area for increased heat transfer for board level products. These heat sinks are formed through progressive punching processes, where details and features are progressively added with each stamp of sheet metal going through the punching die.

Stamped Heat Sinks are designed for specific electronic package types to ensure optimized fit and function. These heat sinks come in a variety of mounting methods, including solder tabs and pins, interference fit with the device through integrated clips or slide-on features, or through-hole hardware like screws and nuts. Most Stamped Heat Sinks are available with a finish to improve heat radiation and thermal performance for natural convection applications.

Aavid, Thermal Division of Boyd Corporation’s engineering team is highly experienced in board level cooling applications. We can help you select a Stamped Heat Sink optimized for your application from our extensive portfolio of solutions.

For rapid thermal modeling and comparison of multiple heat sink constructions please try Aavid Genie our heat sink design tool.

View our Heat Sink solutions in the section below:


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Product Details

To learn more about Materials and Solutions please click the arrows below

Materials & Finishes:

Key

Base Material

Finish

Al

Aluminum

Black Anodize

Al (AS3)

Aluminum

AavSHIELD3

Al (D. Paint)

Aluminum

Dielectric Paint

Al (Green)

Aluminum

Green Anodize

Al (Hard)

Aluminum

Hard Anodize

Al (Paint)

Aluminum

Black Paint

Al (Pre-Black)

Aluminum

Pre-Black Anodize

Al (Red)

Aluminum

Red Anodize

Al (Tin)

Aluminum

Tin Plated

Al (U)

Aluminum

Unfinished

Cu (AS3)

Copper

AavSHIELD3

Cu (Paint)

Copper

Black Paint

Cu (PVF)

Copper

Polyvinylflouride

Cu (Tin)

Copper

Tin Plated

Cu (U)

Copper

Tin Plated

Stamped Heat Sink Solutions

  • Low Cost Solutions for Device-Specific Cooling
  • Passive Cooling Solutions means Improved Reliability as there are no moving parts
  • Add a fan to your board cooling solution for added heat transfer
  • Improve heat transfer from your device to Stamped Heat Sinks with thermal interface materials
  • Electrically Isolate your devices with thermally conductive films, Polymeric Films, or LectroShield Electrical Insulation