Thermal Accessories

Complete or enhance your thermal management with additional components from Boyd. Thermal Accessories can help you mount your thermal solution with hardware, improve heat spreading, transfer or dissipation, or improve device safety with electrical insulation.

Thermal Interface Materials

Thermal Interface Materials are a critical component used to thermally join surfaces, like heat sources and cooling solutions.

Thermal Interface Materials

Heat Transfer Fins

Heat Transfer Fins, typically in the form of folded fin stacks, are an ideal component to quickly prototype new designs.

Heat Transfer Fins

Heat Pipes

Heat pipes are becoming more integral in thermal management solutions than ever before. Their ability to transfer heat quickly and effectively at a low cost make them ideal for a broad range of solutions and industries.

Heat Pipes

Mounting Hardware

Mounting kits are pre-packaged hardware kits for through hole mounting in heat-sealed plastic bags for use on assembly lines and are ideal for retrofit applications.

Mounting Hardware

Insulation Products & Hardware

Diallyl Phthalate thermally conductive hardware

Thermally Conductive Insulation Products and Hardware combine thermal properties with mechanical characteristics into a single electrically isolated product.

Insulation Products and Hardware

Thermal Accessories: Mounting Hardware Kits, Thermal Interface Materials, and other Hardware

A complete thermal management solution requires not only the main method of heat transfer like a liquid cold plate or a heat sink, but also additional components for installation and optimal performance. Thermal Accessories include items like hardware to mount the cooling solution and heat sources together, thermally conductive insulation, and thermal interface materials.

Thermal Grease and Phase Change Materials are gel-like and wax-like materials respectively that offer thin bond lines and are ideal for flat and smooth surfaces.

Thermally Conductive Gap Fillers are highly compliant gel-like materials, like thermal greases, but are less fluid-like and have much thicker material options available and are ideal for applications that have greater surface irregularity or space to fill between a heat source and its cooling solution.

Thermal Rubber Pads, Thermally Conductive Films, and Thermally Conductive Hardware & Ceramics are the least conforming of the non-adhesive thermal interface materials. Rubber pads are available with reinforcement that provides extra tear resistance. Thermally Conductive Films are thin, typically electrically isolating flexible films. Thermally Conductive Hardware and Ceramics are molded ceramics or polymers that double as electrical isolation for high voltage components. These TIM options are generally firmer, more rigid and more ruggedized, able to withstand greater wear and tear.

Thermal Epoxies and Thermally Conductive Adhesive Tapes serve as a mechanical joint in addition to their thermal properties. Epoxies offer a permanent bond between surfaces, where adhesives are more temporary or semi-permanent depending upon the specific materials.

Graphite Sheets can also be used as Thermal Interface Materials. Graphite TIMs are lightweight and exhibit high thermal spreading properties which is ideal for mobile applications with high heat density sources.

copper skived heat sink with shurlock pins

mica thermal interface material

Mounting Hardware and Raw Components

Shurlock Pins and Solder Anchors with Z-Springs help mount heat sinks to PCB assemblies and provide spring force to ensure good thermal contact with heat sources below. Shurlock Pins lock in place when installed in a PCB through hole. Solder Anchors are installed into the board themselves and heat sinks assembled with a Z-spring can mount and be removed repeatedly without harming the board.

Boyd’s Max Clip™ system used with our Max Clip Extruded Heat Sinks provide excellent and centralized mounting from semiconductor packages to the heat sink, which reduces thermal resistance and improves thermal performance. Spring clips, like Max Clips, are used in conjunction with extruded and stamped heat sinks to apply pressure into devices and ensure better thermal joints between a heat source and heat sink.

Card Ejectors and Card Pullers are designed to assist in the insertion and ejection of PCB board

Boyd also offers raw components like heat transfer fins and individual heat pipes for customers that want to prototype and test on their own.

Thermal Interface Materials

Thermal Interface Materials or TIMs, come in a variety of forms. The primary feature of TIMs is their high thermal conductivity and ability to remove air pockets that resist and impede heat transfer between surfaces. Many interface materials have the secondary function of electrical isolation, which is important for high voltage applications.

Heat Transfer Fins

Folded fin stacks can be used as heat sink fins or as inserts in complex liquid cold plates. Boyd’s ability to vary the material, configuration, thickness, and density of folded heat transfer fins make us an ideal supplier for folded fin stacks.

Mounting Hardware

Mounting Hardware helps complete thermal management solutions by ensuring the solutions are firmly mounted in an efficient process.

Heat Pipes

Beyond standard copper water heat pipes, Boyd’s expertise in two phase solutions enable us to design and produce heat pipes for use at cryogenic temperatures or high temperatures. We also fabricate Isothermal Furnace Liners to help even out temperatures within furnaces to improve quality and consistency in high temperature processes.

Insulation Products & Hardware

Bushings, washers and spacers are used to electrically insulate hardware such as screws, rivets or wires, reduce vibration and can be used as a guide for materials. Heat Shields and Thermal Insulation can help prevent heat transfer towards sensitive components.

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