Skived Fin Heat Sinks

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Wallet Friendly Solutions

Cost-effective and readily-available solutions

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Reduced Thermal Resistance

no joint between a base and fins

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Reliable Mounting and Easy Assembly

are available with Shurlock pin attachments

Two Phase Enhanced Air Cooling for Power Electronics

Skived Fin Heat Sinks offer highly optimized cooling as they allow for higher fin densities than what is manufacturable using extrusion methodologies, but do not have an interface joint that restricts heat flow like bonded or brazed fin heat sinks. Unlike bonded or brazed heat sinks, Skived Fin Heat Sinks are constructed from a single piece of material and offer reduced thermal resistance since there is no joint between a base and fins. These heat sinks are manufactured by precisely slicing the top of the base, called skiving, folding it back to where it is perpendicular to the base, and repeating at regular intervals to create fins.

The skiving process enables high fin density and thin fin heat sink geometries for optimal thermal performance. By packing as much fin surface area into a given volume, skived fin heat sinks have greater heat transfer than other single piece construction heat sinks such as extruded aluminum heat sinks. Compared to extruded aluminum, skived fin heat sink fabrication does not rely on expensive tooling, providing greater design flexibility and faster prototyping. Instead, each fin is cut separately using the same tool which allows for lower tooling costs. This enables Boyd Corporation to fully customize skived fin components for your product, which also includes liquid cooling applications.

Skived heat sinks can be constructed of aluminum or copper allowing for full, one-piece copper solutions for high performance cooling. Boyd's standard copper skived fin heat sinks are available with Shurlock pin attachments for reliable mounting and easy assembly.

For rapid thermal modeling and comparison of multiple heat sink constructions please try Genie our heat sink design tool.

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Part Number

Length (mm)

Width (mm)

Height (mm)

Primary Device Types

Device Attachment or Interface

Heat Sink Mounting Type

Materials

RoHS

Contact Us/Purchase

342940

37.58

38.5

14

BGA, FPGA

Phase Change Material

Brass Push Pins

Cu (AS3)

Compliant

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342941

40.5

40

13.5

BGA, FPGA

Phase Change Material

Brass Push Pins

Cu (AS3)

Compliant

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342942

44

45

22.5

BGA, FPGA

Phase Change Material

Brass Push Pins

Cu (AS3)

Compliant

Image

342943

50

50

14

BGA, FPGA

Phase Change Material

Brass Push Pins

Cu (AS3)

Compliant

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342947

59

57.9

11

BGA, FPGA

Phase Change Material

Brass Push Pins

Cu (AS3)

Compliant

Image

342945

60

60

14

BGA, FPGA

Phase Change Material

Brass Push Pins

Cu (AS3)

Compliant

Image

342946

60

60

22

BGA, FPGA

Phase Change Material

Brass Push Pins

Cu (AS3)

Compliant

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342948

69

70

14

BGA, FPGA

Phase Change Material

Brass Push Pins

Cu (AS3)

Compliant

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342949

80

80

12

BGA, FPGA

Phase Change Material

Brass Push Pins

Cu (AS3)

Compliant

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342950

90

90

10

BGA, FPGA

Phase Change Material

Brass Push Pins

Cu (AS3)

Compliant

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