Skived Fin Heat Sinks

High density, thin fins for increased thermal transfer

Skived Fin Heat Sinks

Product Details Key Industries Related Products

Skived Fin Heat Sinks offer highly optimized cooling as they allow for higher fin densities than what is manufacturable using extrusion methodologies, but do not have an interface joint that restricts heat flow like bonded or brazed fin heat sinks. Unlike bonded or brazed heat sinks, Skived Fin Heat Sinks are constructed from a single piece of material and offer reduced thermal resistance since there is no joint between a base and fins. These heat sinks are manufactured by precisely slicing the top of the base, called skiving, folding it back to where it is perpendicular to the base, and repeating at regular intervals to create fins.

The skiving process enables high fin density and thin fin heat sink geometries for optimal thermal performance. By packing as much fin surface area into a given volume, skived fin heat sinks have greater heat transfer than other single piece construction heat sinks such as extruded aluminum heat sinks. Compared to extruded aluminum, skived fin heat sink fabrication does not rely on expensive tooling, providing greater design flexibility and faster prototyping. Instead, each fin is cut separately using the same tool which allows for lower tooling costs. This enables Aavid, Thermal Division of Boyd Corporation to fully customize skived fin components for your product, which also includes liquid cooling applications.

Skived heat sinks can be constructed of aluminum or copper allowing for full, one-piece copper solutions for high performance cooling. Aavid standard copper skived fin heat sinks are available with Shurlock pin attachments for reliable mounting and easy assembly.


Product Details

Skived Fin Heat Sink Product Details:

    Skived Fin Heat Sink Materials:
  • Aluminum
  • Copper

  • Skiving Geometry Ranges and Design Guidelines:
  • Aluminum:
    • Fin Thicknesses: 0.3 – 1 mm (0.012 - 0.039 in.)
    • Max Flow Length: 200 mm (8.163 in.)
    • Max Height: 10 – 60 mm (0.408 - 2.449 in.)
    • Max Fin Gap: 0.4 - 0.5 mm (0.016 - .020 in.)
  • Copper:
    • Fin Thicknesses: 1.5 - 0.75 mm (0.006 - 0.030 in.)
    • Max Flow Length: 150 mm (5.906 in.)
    • Max Height: 10 – 40 mm (0.394 – 1.575 in.)
    • Max Fin Gap: 0.2 - 0.5 mm (0.008 - 0.020 in.)
    • Max Fin Density: 50+ fins per inch
  • General Design Guidelines:
    • Aluminum is better for higher aspect ratios
    • Airflow lengths limited by cutter and the force required to fold up fins
    • Most dimension variables have a tradeoff with other design variables due to the complexity of the manufacturing process. Contact us for assistance in optimizing your design for manufacturability and thermal performance.
    • We’re always improving our machinery and processes so dimensional ranges are not necessarily hard limits. Contact us for our latest capabilities.


Standard Skived Fin Heat Sinks:

Part Number

Length (mm)

Width (mm)

Height (mm)

Primary Device Types

Device Attachment or Interface

Heat Sink Mounting Type

Materials

RoHS

Purchase

342940

37.58

38.5

14

BGA, FPGA

Phase Change Material

Brass Push Pins

Cu (AS3)

Compliant

Contact Us

342941

40.5

40

13.5

BGA, FPGA

Phase Change Material

Brass Push Pins

Cu (AS3)

Compliant

Contact Us

342942

44

45

22.5

BGA, FPGA

Phase Change Material

Brass Push Pins

Cu (AS3)

Compliant

Contact Us

342943

50

50

14

BGA, FPGA

Phase Change Material

Brass Push Pins

Cu (AS3)

Compliant

Contact Us

342947

59

57.9

11

BGA, FPGA

Phase Change Material

Brass Push Pins

Cu (AS3)

Compliant

Contact Us

342945

60

60

14

BGA, FPGA

Phase Change Material

Brass Push Pins

Cu (AS3)

Compliant

Contact Us

342946

60

60

22

BGA, FPGA

Phase Change Material

Brass Push Pins

Cu (AS3)

Compliant

Contact Us

342948

69

70

14

BGA, FPGA

Phase Change Material

Brass Push Pins

Cu (AS3)

Compliant

Contact Us

342949

80

80

12

BGA, FPGA

Phase Change Material

Brass Push Pins

Cu (AS3)

Compliant

Contact Us

342950

90

90

10

BGA, FPGA

Phase Change Material

Brass Push Pins

Cu (AS3)

Compliant

Contact Us

Skived Fin Heat Sink Solutions

  • Using a cutting tool with skiving saves tooling costs
  • Skiving enables economical solid copper heat sink solutions not available in other processes
  • Fin geometries available with skived fin heat sinks offer more surface area, enable higher heat transfer, and overall better performance
  • Single piece construction means there is no interface material between the base and fin compared to advanced heat sink assemblies, so there’s better heat transfer from the base to the fins
  • Combine with a fan for increased airflow and more heat transfer
  • Add a thermal interface material to better connect with your heat source and complete your thermal solution

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