CPU Heat Sinks

Thermal solutions recommended for cooling Intel® Xeon® processor in a FCLGA3647 package*. Product family includes heat sinks engineered for 1U or 2U applications with either low impedance or high power dissipation. For use in the following processors:

  • Platinum 8xxxx processor
  • Gold 6xxxx processor
  • Gold 5xxxx processor
  • Silver 4xxxx processor
  • Bronze 3xxxx processor

  • Fabrication options include extruded and zipper fin types and integrated heat pipes and copper plates for high performance cooling in a smaller form factor. Heat sinks are ready to mount and come with thermal grease formulated for Intel® applications and grease shield.

    *Intel and Xeon are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other countries.

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    • Maximum Performance utilizing high density fin fabrication for increased surface area and reduced solution size.
    • Thin fin geometry lowers pressure drop, improves system airflow, and reduces fan costs.
    • Designed to meet all Intel standards and requirements, including mounting hardware, stiffness, and performance.
    • Specialized thermal grease formulated for high performance pre-applied to base and protected with individual grease shield.
    • Pre-assembled with captive mounting hardware and ready for installation with instruction label.
    • Precise surface flatness and high performance thermal grease ensure minimum interface resistance.