Supercharge Your Data Center: Immerse in Efficiency Data centers must manage intense heat while still evolving to meet the growing demands of high-performance computing (HPC), next-generation AI, and increasing connectivity. Powerful processors and compact server...
Boyd’s Thermal Tech Powers Moonquake Mission NASA’s Farside Seismic Suite (FSS) mission will unlock new insights into the Moon’s far side, supported by Boyd’s advanced thermal management systems. Launching in 2026, the mission will deploy two of the most...
The Future of AI: Powered by Efficient Cooling Artificial intelligence large language models are now surpassing 1 trillion parameters, making next-generation technology essential. This new era of AI-driven computing prioritizes power efficiency, acceleration,...
ARPA-E COOLERCHIPS: Greening Data Centers The ARPA-E COOLERCHIPS program tackles the challenge of developing advanced cooling technologies to reduce the environmental impact and cost of data centers. The consortium includes industry and academic experts: Boyd, NVIDIA,...
NASA’s PACE Mission is set to launch on Feb 8th with Boyd’s loop heat pipes on board. This mission is the latest highlight in Boyd’s extensive, decades long, aerospace heritage. Boyd is proud to collaborate with NASA engineers to assist in the latest space missions to...
Rise of Power: Increasing Power Demand for High-Performance Chips The semiconductor industry continues to drive Moore’s Law and push the boundaries of semiconductor chip power and performance. Higher performance, more powerful and complex chips generate more heat with...
