ARPA-E COOLERCHIPS: Greening Data Centers The ARPA-E COOLERCHIPS program tackles the challenge of developing advanced cooling technologies to reduce the environmental impact and cost of data centers. The consortium includes industry and academic experts: Boyd, NVIDIA,...
NASA’s PACE Mission is set to launch on Feb 8th with Boyd’s loop heat pipes on board. This mission is the latest highlight in Boyd’s extensive, decades long, aerospace heritage. Boyd is proud to collaborate with NASA engineers to assist in the latest space missions to...
Rise of Power: Increasing Power Demand for High-Performance Chips The semiconductor industry continues to drive Moore’s Law and push the boundaries of semiconductor chip power and performance. Higher performance, more powerful and complex chips generate more heat with...
A $5 Million grant from the U.S. Department of Energy (DOE) supports NVIDIA and seven partners, including Boyd, to build an advanced liquid cooling system that enables a future class of efficient power-dense data centers. The DOE program, called COOLERCHIPS, focuses...
The latest electrification trends drive products to contain more powerful and compact electrical components, which drives additional thermal management challenges to maintain or improve performance, reliability, and lifespan. Product designers and manufacturers need...
Two-Phase Cooling encompasses several different cooling technologies, so we sat down with one of our thermal experts to answer some frequently asked questions. In the first of our Ask an Expert series on our LinkedIn, we asked people to submit questions about one of...
