Rise of Power: Increasing Power Demand for High-Performance Chips The semiconductor industry continues to drive Moore’s Law and push the boundaries of semiconductor chip power and performance. Higher performance, more powerful and complex chips generate more heat with...
A $5 Million grant from the U.S. Department of Energy (DOE) supports NVIDIA and seven partners, including Boyd, to build an advanced liquid cooling system that enables a future class of efficient power-dense data centers. The DOE program, called COOLERCHIPS, focuses...
The latest electrification trends drive products to contain more powerful and compact electrical components, which drives additional thermal management challenges to maintain or improve performance, reliability, and lifespan. Product designers and manufacturers need...
In the first of our Ask an Expert series on our LinkedIn, we asked people to submit questions about one of our most popular thermal technologies: Two-Phase Cooling. We received several questions, so we spoke with one of our thermal experts, David Miller, to answer...
In our previous blogs, we’ve gone over What Are Thermosiphons? and the various Thermosiphon Configurations and Applications. Here we’ll be answering one of the most commonly asked questions regarding Two-Phase Cooling: what is the difference between a...
In our previous blog, we went over the basics of Thermosiphons and how they work. While they’re all passive, two-phase systems that contain three basic parts (an evaporator, a fluid loop, and a condenser), the way that they’re constructed can be different...
