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Boyd Validated for NVIDIA GB200 NVL72 Recommended Vendor List

Boyd and NVIDIA: Driving AI Cooling Innovation

The NVIDIA GB200 NVL72 platform sets new standards for AI and accelerated computing and demands robust, scalable thermal management. That is exactly what Boyd delivers.

As a Recommended Vendor for the GB200 NVL72 platform, Boyd provides dependable, production-ready cooling solutions for supporting architectures like NVIDIA MGX™ and the NVIDIA GB200 Grace Blackwell Superchip. Boyd enables reliable liquid cooling across the GB200 ecosystem, from liquid cold plates and blind mate quick disconnects to in-rack and in-row cooling distribution units (CDUs), helping customers scale efficiently and deploy with confidence.

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Recognition From NVIDIA

NVIDIA evaluated Boyd’s thermal solutions and recognized their performance, reliability, and platform compatibility by adding Boyd to its Recommended Vendor List (RVL). This recognition reinforces Boyd’s proven readiness, trusted innovation, and ability to seamlessly and efficiently integrate into clients’ data centers.

As an RVL supplier, Boyd supplies validated thermal components for the GB200 NVL72 architecture. Customers count on Boyd’s NVIDIA-validated, production-ready solutions to streamline qualifications, minimize deployment risks, and accelerate system integration.

A Complete Cooling Suite for NVIDIA GB200 NVL72

Boyd supplies a full range of liquid cooling technologies tailored for high-performance, dense computing environments that support the NVIDIA GB200 NVL72 platform. Each solution emphasizes reliability, thermal efficiency, and system integration.

In-Row and In-Rack CDUs for NVIDIA MGX

Boyd delivers 1.1kW to 2.3kW in-row liquid-to-liquid CDUs for NVIDIA MGX architecture installations. We also offer in-rack CDU configurations with liquid-to-liquid and liquid-to-air options to address diverse thermal and infrastructure demands. These solutions support efficient, scalable cooling while optimizing serviceability and space within high-density racks.

High-Performance Cold Plates for GB200 Grace Blackwell Superchip

Boyd builds brazed copper cold plate assemblies for the GB200 Grace Blackwell Superchip with both left and right orientations to support diverse system layouts. We apply aluminum mounting to lower thermal resistance and boost heat transfer efficiency. Our reliable brazing process delivers durable, leak-tight performance for mission-critical applications.

Integrated Manifolds for GB200 NVL72: Inner vs. Rack Manifolds

In high-density systems, efficient liquid distribution plays a critical role. On the GB200 NVL72 platform, Boyd supports both inner manifold and rack manifold architectures, enabling fast, leak-free connections with blind mate quick disconnects (QDs).

What Is an Inner Manifold?

Inner manifolds distribute coolant directly to liquid cold plates or other internal components within the server chassis.

What Is a Rack Manifold?

Rack manifolds use a centralized fluid interface to distribute coolant at the rack level, supporting multiple systems from a single connection point. Boyd designs blind mate QDs (quick disconnects) to work effortlessly with both types of manifolds. On NVIDIA’s Bianca platform, Boyd enables inner manifold connections with QDs that automatically couple without tools as servers slide into the chassis. On NVIDIA’s MGX platform, Boyd supports rack manifold connections with QDs that ensure fast and reliable engagement or disconnection during deployment and maintenance. In mission-critical cooling systems, these blind mate QDs ensure leak-free performance, simplify maintenance, and reduce downtime.

Boyd: Trusted Thermal Solutions Supporting NVIDIA

Boyd delivers production-ready thermal solutions verified for the NVIDIA GB200 NVL72 platform. Boyd enables efficient and scalable liquid cooling designed for the future of artificial intelligence and accelerated computing, including blind mate quick disconnects, precision cold plates, and in-row and in-rack CDUs.

As an NVIDIA Recommended Vendor, Boyd provides fully qualified, high-performance thermal systems that help customers deploy with confidence, reduce risk, and accelerate time to market. Collaborate with Boyd to maximize your NVIDIA GB200 deployment. Let’s design the future together.

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