Heat sinks will continue to be an integral part of thermal management systems and there are many more heat sink fabrication and design possibilities than most engineers realize. While heat sink basics are fairly standard, the number of options and customizations today go far beyond traditional heat sinks that have been used for decades. Many do not realize that by utilizing the optimal fabrication method with correct customization options, they could be saving time, money, space, and weight while vastly improving cooling and device performance.
Boyd Corporation has designed heat sinks for decades; since the first personal and enterprise electronics were introduced and well before the advent of the Internet as we know it. Heat sink technology has progressed significantly over that time with new constructions, technologies, and manufacturing capabilities. This trend will continue as thermal management needs evolve. New materials, higher performing constructions, and innovative technology integrations are entering the market as thermal solutions evolve.
Boyd Corporation’s decades of innovation expertise, experience, resources, and unique approach to integrating multiple functionalities into streamlined products will continue to keep the company on the forefront of thermal innovation and continually improved manufacturing methodologies. If you are ready to improve or retrofit your older model heat sinks or are looking to tackle new challenges for the next generation, start by contacting Boyd Corporation to learn more about heat sink constructions, customizations, and other possibilities for better optimized cooling.