Boyd’s Collaboration with NVIDIA
Beyond Limits: Boyd’s Thermal Management for NVIDIA GB200 NVL72 and Next-Gen AI
Artificial intelligence (AI) demands unprecedented thermal management as workloads grow more complex and powerful, driving thermal demands to new heights. Platforms like the NVIDIA GB200 NVL72 push compute density to new limits, so data centers need smarter, more efficient cooling architectures. Boyd is listed on NVIDIA’s recommended vendor list (RVL) for cold plates, manifolds, and coolant distribution units (CDUs), and delivers qualified thermal technologies recognized within NVIDIA’s RVL program. Our proven thermal solutions enable scalable, high-performance operations without compromising sustainability.
Deploy liquid cold plates, coolant distribution units (CDUs), and manifolds engineered to extract more heat and support higher compute loads efficiently.
Leverage Boyd’s rapid prototyping, scalable production, and onsite service to bring next-gen platforms online faster.
Design robust, scalable thermal solutions tailored to the NVIDIA GB200 NVL72 and future high-density AI platforms.
Implement eco-efficient cooling systems that reduce energy consumption, improve water reuse, and lower total environmental impact.
Future-Proofing AI: Scalable Liquid Cooling for GB200 and Beyond
The NVIDIA GB200 NVL72 architecture pushes the limits of AI-driven data centers, but it needs advanced thermal management for maximum performance. Boyd delivers precisely engineered liquid cooling solutions. From coolant distribution units, cold plates, manifolds, and blade-level loops, Boyd liquid systems integrate seamlessly with the NVIDIA GB200 NVL72. Our solutions lower thermal resistance, support high-bandwidth NVLink domains, and are designed to integrate efficiently with the NVIDIA GB200 NVL72. As AI workloads grow and new platforms emerge, Boyd’s modular cooling systems scale to meet higher compute densities and sustainability goals. We help future-proof your data center with efficient, easy-to-integrate liquid cooling that supports evolving chip architectures on and beyond the NVIDIA GB200 NVL72.Have a Question?
Integrated Liquid Cooling for the NVIDIA GB200 NVL72 and Beyond
Boyd delivers a liquid cooling system compatible with the NVIDIA GB200 NVL72 which is also scalable for future compute platforms. Our carefully engineered architecture features liquid loops, manifolds, cold plates, and coolant distribution units that work together to reduce thermal resistance and boost efficiency.
We streamline deployment with deep thermal expertise and globally scaled manufacturing. Boyd’s modular systems adapt to evolving chip densities and sustainability goals, supporting your roadmap from the NVIDIA GB200 NVL72 to next-generation platforms.
Integrated Solutions, Global Impact: Boyd’s Thermal Expertise
Boyd delivers high-performance cooling systems worldwide by combining decades of thermal expertise with globally scaled manufacturing. Our regionalized production and strong engineering support simplify integration, accelerate deployment, and support environmental goals. We partner closely with industry leaders to ensure infrastructure for NVIDIA’s most advanced architecture performs reliably, efficiently, and sustainably across the globe.
Boyd and NVIDIA Resources
Partnering for AI’s Future: Boyd’s Advanced Cooling Solutions
Boyd stands at the forefront of thermal innovation, enabling the performance and efficiency gains required by today’s most advanced AI systems. From NVIDIA’s GB200 NVL72 to future-generation architectures, our trusted cooling expertise scales with your roadmap. Let’s collaborate to design, scale, and deploy sustainable, high-performance cooling solutions that support your AI infrastructure with proven reliability and efficiency.
Have questions? We’re ready to help!