Boyd to Showcase Latest Innovations and Thought Leadership at NVIDIA GTC Washington, D.C.

The full technical and facility cooling systems are intelligently integrated for IT and power with communications between each thermal system element in an interconnected “liquid communication layer” to balance demand load and predictive load planning. Boyd’s Chip to Ambient™ thermal circuit aligns cooling performance with variable IT demand and maximizes energy efficiency and system reliability while minimizing capital cost and space.

“Boyd is honored to support NVIDIA and other AI development pioneers at NVIDIA GTC Washington, D.C. 2025,” said Shammy Khan, Boyd Chief Commercial Officer. “This is a valuable opportunity for industry innovators to accelerate next-generation AI compute system development. We’re helping AI leaders design liquid cooled solutions that enhance performance, uptime, and reliability for systems of today and tomorrow.”

Boyd experts will be on site to discuss and showcase the Project OMNICOOL liquid cooling demonstration, representing collaborative contribution to the ARPA-E Coolerchips Project, as well as how Boyd liquid cooling systems maximize the performance of NVIDIA-powered AI factories. Boyd’s coolant distribution units (CDUs), liquid cooling loops, and rack manifolds meet the quality, performance, and reliability requirements of the most demanding IT equipment. These solutions are backed by Boyd’s 40+ years of data center cooling experience, produced by high-capacity global manufacturing facilities, and supported by global service teams with regional availability in North America, Europe, and Asia Pacific.

Experts will also be available to discuss Boyd’s Rack Emulator, recently presented by experts from Boyd and NVIDIA on October 15th at the Open Compute Project Summit 2025. The Rack Emulator enables faster testing and validation of liquid systems prior to IT equipment installation and startup, safeguarding multimillion dollar investments.