Ultra Thin Vapor Chambers

Product Details Key Industries Related Products

Ultra-Thin Vapor Chambers (UTVCs) utilize internal two-phase evaporation and condensation to passively transfer heat across a plane. Vapor chambers enable high heat transfer across its surfaces, even for high heat flux applications, without any moving components. Typically, vapor chambers can effectively conduct 10 to 40 times more heat than copper at the same temperature difference and possess higher through-plane conductivity than graphite for applications thicker than ~0.25 mm.

Ultra-Thin Vapor Chambers are efficient passive solutions for uniform heat spreading in low profile applications where height is at a premium. This compact thermal management solution leaves room for more battery space or added functionality with more electronics. Ultra-Thin Vapor Chambers can help reduce the overall thickness and weight of your product. Customers experience increased design flexibility and can better push the limits of their application by using Boyd’s Ultra-Thin Vapor Chambers.

Titanium and stainless steel ultra-thin vapor chambers have additional mechanical strength and can be used for structural applications such as internal chassis, like smart phone middle frames, external enclosures or housings. This effectively combines thermal and structural performance in one deliverable, reducing the number of components in your assembly. Aavid, Thermal Division of Boyd Corporation is the only company in the world that can prototype and mass produce Ultra-Thin Vapor Chambers in either copper, copper alloys, stainless steel, or titanium, enabling us to design and fabricate the vapor chamber best suited to your application. Our manufacturing processes produce copper vapor chambers as thin as 0.4 mm and titanium or stainless steel vapor chambers as thin as 0.3 mm.

Boyd’s tightly controlled, disruptive manufacturing processes ensure negligible performance reduction with the elimination of Non-Condensable Gasses (NCGs) within all our Ultra-Thin Vapor Chambers to fully utilize the X-Y plane of the entire heat spreader. This lengthens the high-performance lifetime of the Vapor Chamber, maximizing reliable functionality of your product. We further reduce volume that cannot be used for product functionality or heat transfer by either minimizing or completely removing the fill tube based on our cutting-edge processes.

Like heat pipes, vapor chambers can be formed in a variety of non-planar geometries which make them adaptable into more 3D formats. Ultra-Thin Vapor Chambers can include various bends, structural flanges, and through holes to accommodate application specific geometries and hardware. Our broad manufacturing capabilities also enable us to add features like selective EMI shielding to your vapor chamber, making our stainless steel and titanium vapor chambers a thermal, mechanical, and EMI management solution. By partnering with Boyd, we integrate multiple functions into comprehensive and cost-effective solutions that help you reduce your total cost of ownership.

Reduced Temperatures for Higher Performance
Decrease Product Thickness & Size
Increased Weight Savings

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Ultra-Thin Vapor Chamber Product Details

To learn more about Materials and Solutions please click the arrows below

Titanium Vapor Chambers (TiVCs)

The strength of titanium allows us to make Ultra-Thin Vapor Chamber walls much thinner than those made from traditional metals while still maintaining excellent mechanical integrity. Optimized wall thicknesses enable us to either increase vapor space to create higher heat transport capacity or maintain existing vapor space for an overall thinner solution. This allows us to design and fabricate high performance, high reliability thermal management solutions that are extremely lightweight, low profile and with greater thermal efficiency than all other passive heat spreading solutions on the market today.

Boyd’s proprietary manufacturing methods produce high quality Ultra-Thin Vapor Chambers that help customers reduce overall costs for themselves and their end consumers through integrated solutions, reduced supply chain complexity and reduced warranty and quality claims. Our knowhow and methodology enable us to customize the vapor chamber wick to fine tune its performance for your specific application.

Key Features:

  • Lightest Vapor Chambers on the Market: ~ 9X - 20X more efficient thermal conductivity per gram vs graphite
  • Suitable for Harsh Environments with Exceptional Material Compatibility

Ultra-Thin Vapor Chamber Dimensions
Sample Size :
100 mm x 50 mm

Total Weight (grams)

Maximum Thermal Conductivity
(W/mK)

0.3 mm
Stacked Graphene

2.8

1,300

0.4 mm Cu VC

8.1

6000

0.4 mm SS VC

8.2

5700

0.4 mm Ti VC

3.9

24,000

0.3 mm Ti VC

3.8

4500


Note: At higher temperatures, the effective thermal conductivities of the vapor chambers can be much higher than the values provided in the table.

At 60°C vapor chamber temperature in typical mobile phone applications

Stainless Steel Vapor Chambers (SSVCs)

Ultra-Thin Stainless Steel Vapor Chambers are a balanced blend of additional mechanical strength, consistent reliability, and cost effectiveness.

Stainless steel Ultra-Thin Vapor Chambers possess more mechanical strength as compared to copper versions, preventing warp and enabling less surrounding support material. Because of this additional strength, SSVCs can be larger than their copper counterparts and still resist plastic deformation. Stainless steel allows a higher level of reworkability compared to copper vapor chambers to accommodate repairs or enable fast design modifications to use existing stock for future products.

Our proprietary process allows us to eliminate the concern of Non-Condensable Gasses (NCGs), extending the life of Boyd’s stainless steel vapor chambers beyond competitive stainless steel solutions.

Copper Vapor Chambers (CuVCs)

Copper Ultra-Thin Vapor Chambers are a natural progression of field-proven copper heat pipe technology. Boyd leverages five decades of design expertise, reliability testing and real-world applications of standard copper heat pipes to power the innovation and fabrication of Copper Ultra-Thin Vapor Chambers. We have a broad range of capabilities and options to customize an optimized CuVC heat spreader, specialized for your application.

Vapor Chamber Parameters

Options

Wick Types

  • Sintered Powder
  • Wire Mesh
  • Chemically Etched (ideal for special wick geometries)

Overall Thickness

  • Minimum: 0.4 mm
  • Dependent on Power Requirement

Pedestal Forming

  • Stamping
  • Chemical Etching

Ultra Thin Vapor Chambers Solutions

  • Utilize Titanium or Stainless Steel Vapor Chamber options for added mechanical strength
  • Reduce middle plate or middle frame mechanical structure in mobile phone constructions
  • Over 10X-40X more thermally conductive than solid metal
  • High planar conductivity, ideal for uniform & efficient Heat Spreading in low profiles
  • Higher through conductivity (Z-axis) than graphite for thicker applications
  • Passive Heat Transfer Vapor Chambers don’t require power to function
  • Enable higher reliability and longer product lifetimes with vapor chambers
  • Can include pedestals for varying device heights
  • Through holes for device and vapor chamber mounting
  • Custom Vapor Chamber shapes for application-specific layouts and geometries
  • Apply EMI/RFI Absorption/Shielding Solutions to Vapor Chambers for Improved Signal Integrity
  • Combine Ultra-Thin Vapor Chambers with low profile blowers & heat sink fins for a complete ultra-thin thermal management solution
  • Add Conformable Thermal Shields to protect nearby Components
  • Use adhesives and thermal interface materials to thermally and mechanically join Ultra Thin Vapor Chambers to surrounding structures
  • Incorporate with Electrical Isolation or Shock Absorption

Key Industries

Mobile Electronics

  • Handheld Mobile Devices
  • Multifunctional Vapor Chamber Middle Plates for Smart Phone
  • Notebook Computer CPU & GPU Microprocessors
  • Notebook Computer CPU & GPU microprocessors
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    Consumer Electronics

  • Mobile Gaming Platforms & Handhelds
  • Thin & Lightweight Thermal Management for Augmented Reality & Virtual Reality (AR/VR) Head Sets & Wearable Equipment
  • Lightweight & Rugged Thermal Management for Wearables like Smart Watches
  • Vapor Chamber Screen & Display Cooling for Smart Home Devices
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    eMobility

  • Battery Cell Cooling & Thermal Management
  • Infotainment Heat Spreading Vapor Chambers
  • Human Machine Interface Cooling Solutions
  • Lightweight Cooling for Sensor and Camera Systems
  • Read More…

    Enterprise Electronics

  • Cooling Solutions for Optical Connector Modules such as QSFP-DD Devices
  • Heat Transport from PCBs to Back End of Rack for easier Air Cooling Access
  • Read More…

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