Ultra Thin Vapor Chambers

Ultra-Thin Vapor Chambers (UTVCs) utilize internal two-phase evaporation and condensation to passively transfer heat across a plane.

Enable Longer Product Lifetimes

High-precision temperature control, rapid temperature recovery, and long life under demanding conditions.

High Heat Conduction

Effectively conduct 10 to 40 times more heat than copper

Passive Heat Spreading with Minimal Thickness and More Design Options

Ultra-Thin Vapor Chambers (UTVCs) utilize internal two-phase evaporation and condensation to passively transfer heat across a plane. Vapor chambers enable high heat transfer across its surfaces, even for high heat flux applications, without any moving components. Typically, vapor chambers can effectively conduct 10 to 40 times more heat than copper at the same temperature difference and possess higher through-plane conductivity than graphite for applications thicker than ~0.25 mm.

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What Are Ultra Thin Vapor Chambers?

Heat pipes utilize the high heat capacity of fluid phase change in a robust format, making them one of the most efficient and versatile thermal management technologies to reliably and quickly transport heat.

Heat pipes are made of three main components: a vacuum sealed shell or envelope, a working fluid, and a wick structure. The shell keeps the heat pipe working fluid vacuum sealed for decades of consistent heat transport. The working fluid changes phase in the application temperature range and must be compatible with the heat pipe shell and wick materials. The wick passively moves fluid through the heat pipe.

How Do Ultra Thin Vapor Chambers Work?

Ultra thin vapor chambers are two-phase heat spreading components. By leveraging the rapid heat transport of the evaporation-transport-condensation-wicking cycle in a compact format, ultra-thin vapor chambers absorb heat and spread it evenly across the vapor chamber surface. 

Why Use Ultra Thin Vapor Chambers?

Ultra-Thin Vapor Chambers are efficient passive solutions for uniform heat spreading in low profile applications where height is at a premium. This compact thermal management solution leaves room for more battery space or added functionality with more electronics. Ultra-Thin Vapor Chambers can help reduce the overall thickness and weight of your product. Customers experience increased design flexibility and can better push the limits of their application by using Boyd’s Ultra-Thin Vapor Chambers

Why Use Boyd’s Ultra Thin Vapor Chambers?

Boyd is one of the few companies in the world that can prototype and mass produce ultra-thin vapor chambers in either copper, copper alloys, stainless steel. Our capabilities enable us to design and fabricate the vapor chamber best suited to your application. Boyd can produce copper vapor chambers as thin as 0.4 mm and stainless steel vapor chambers as thin as 0.3 mm.

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Vapor-Chamber-Base-Illustration

Integrating Ultra-Thin Vapor Chamber into Your Products

Like heat pipes, vapor chambers can be formed in a variety of non-planar geometries which make them adaptable into more 3D formats. Ultra-thin vapor chambers can include various bends, structural flanges, and through holes to accommodate application specific geometries and hardware. Our broad manufacturing capabilities also enable us to add features like selective EMI shielding to your vapor chamber, making our stainless steel vapor chambers a thermal, mechanical, and EMI management solution. By partnering with Boyd, we integrate multiple functions into comprehensive and cost-effective solutions that help you reduce your total cost of ownership.

Ultra-Thin Vapor Chamber Technologies

Meet Application Challenges with the Right Ultra-Thin Vapor Chamber

Boyd’s ultra-thin vapor chamber portfolio with our deep two-phase expertise and heritage can help you maximize reliable thermal performance in any application.

Copper Ultra-Thin Vapor Chamber

Stainless steel ultra-thin vapor chambers have additional mechanical strength and can be used for structural applications such as internal chassis, like smart phone middle frames, external enclosures or housings. This effectively combines thermal and structural performance in one deliverable, reducing the number of components in your assembly. In addition to combining multiple components, the higher material yield strength enables thinner and lighter vapor chamber construction compared to copper. Thinner walls maximize the internal vapor space and in turn improves the effective thermal conductivity of the vapor chamber, regardless of metal’s thermal properties. Switching to stainless steel vapor chambers can help you decrease the thickness of your thermal management solution or maximize the power transferred from your heat source.

Bringing 50 Years of Two-Phase Heritage into Compact Formats

Copper Ultra-Thin Vapor Chambers are a natural progression of field-proven copper heat pipe technology. Boyd leverages five decades of design expertise, reliability testing and real-world applications of standard copper heat pipes to power the innovation and fabrication of copper ultra-thin vapor chambers. We have a broad range of capabilities and options to customize an optimized CuVC heat spreader, specialized for your application.

Stainless Steel Ultra-Thin Vapor Chamber

Stainless steel ultra-thin vapor chambers have additional mechanical strength and can be used for structural applications such as internal chassis, like smart phone middle frames, external enclosures or housings. This effectively combines thermal and structural performance in one deliverable, reducing the number of components in your assembly. In addition to combining multiple components, the higher material yield strength enables thinner and lighter vapor chamber construction compared to copper. Thinner walls maximize the internal vapor space and in turn improves the effective thermal conductivity of the vapor chamber, regardless of metal’s thermal properties. Switching to stainless steel vapor chambers can help you decrease the thickness of your thermal management solution or maximize the power transferred from your heat source.

Extra Mechanical Strength with a Stainless Steel Vapor Chamber

Stainless steel Ultra-Thin Vapor Chambers possess more mechanical strength as compared to copper versions, preventing warp and enabling less surrounding support material. Because of this additional strength, SSVCs can be larger than their copper counterparts and still resist plastic deformation. Stainless steel allows a higher level of reworkability compared to copper vapor chambers to accommodate repairs or enable fast design modifications to use existing stock for future products.

Our proprietary process allows us to eliminate the concern of Non-Condensable Gasses (NCGs), extending the life of Boyd’s stainless steel vapor chambers beyond competitive stainless steel solutions.

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