Ultra Thin Vapor Chamber


Enable Longer Product Lifetimes

high-precision temperature control, rapid temperature recovery, and long life under demanding conditions


High Heat Conduction

can effectively conduct 10 to 40 times more heat than copper

Ultra-Thin Vapor Chambers (UTVCs) utilize internal two-phase evaporation and condensation to passively transfer heat across a plane. Vapor chambers enable high heat transfer across its surfaces, even for high heat flux applications, without any moving components. Typically, vapor chambers can effectively conduct 10 to 40 times more heat than copper at the same temperature difference and possess higher through-plane conductivity than graphite for applications thicker than ~0.25 mm.

Passive Heat Spreading with Minimal Thickness and More Design Options

Ultra-Thin Vapor Chambers are efficient passive solutions for uniform heat spreading in low profile applications where height is at a premium. This compact thermal management solution leaves room for more battery space or added functionality with more electronics. Ultra-Thin Vapor Chambers can help reduce the overall thickness and weight of your product. Customers experience increased design flexibility and can better push the limits of their application by using Boyd’s Ultra-Thin Vapor Chambers.

Extra Functionality Stainless Steel Vapor Chamber

Stainless Steel Ultra-Thin Vapor Chambers have additional mechanical strength and can be used for structural applications such as internal chassis, like smart phone middle frames, external enclosures or housings. This effectively combines thermal and structural performance in one deliverable, reducing the number of components in your assembly. In addition to combining multiple components, the higher material yield strength enables thinner and lighter vapor chamber construction compared to copper. Thinner walls maximize the internal vapor space and in turn improves the effective thermal conductivity of the vapor chamber, regardless of metal’s thermal properties. Switching to Stainless Steel Vapor Chambers can help you decrease the thickness of your thermal management solution or maximize the power transferred from your heat source.

Designing and Prototyping Your Ultra-Thin Vapor Chamber Solution

Boyd Corporation is the only company in the world that can prototype and mass produce Ultra-Thin Vapor Chambers in either copper, copper alloys, stainless steel, enabling us to design and fabricate the vapor chamber best suited to your application. Our manufacturing processes produce copper vapor chambers as thin as 0.4 mm and stainless steel vapor chambers as thin as 0.3 mm.

Boyd’s High Volume Ultra-Thin Vapor Chamber Manufacturing

Boyd’s tightly controlled, disruptive manufacturing processes ensure negligible performance reduction with the elimination of Non-Condensable Gasses (NCGs) within all our Ultra-Thin Vapor Chambers to fully utilize the X-Y plane of the entire heat spreader. This lengthens the high-performance lifetime of the Vapor Chamber, maximizing reliable functionality of your product. We further reduce volume that cannot be used for product functionality or heat transfer by either minimizing or completely removing the fill tube based on our cutting-edge processes.

Integrating Ultra-Thin Vapor Chamber into Your Products

Like heat pipes, vapor chambers can be formed in a variety of non-planar geometries which make them adaptable into more 3D formats. Ultra-Thin Vapor Chambers can include various bends, structural flanges, and through holes to accommodate application specific geometries and hardware. Our broad manufacturing capabilities also enable us to add features like selective EMI shielding to your vapor chamber, making our stainless steel vapor chambers a thermal, mechanical, and EMI management solution. By partnering with Boyd, we integrate multiple functions into comprehensive and cost-effective solutions that help you reduce your total cost of ownership.

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Key Industries

Enterprise Electronics

  • Cooling Solutions for Optical Connector Modules such as QSFP-DD Devices
  • Heat Transport from PCBs to Back End of Rack for easier Air Cooling Access
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    Mobile Electronics

  • Handheld Mobile Devices
  • Multifunctional Vapor Chamber Middle Plates for Smart Phone
  • Notebook Computer CPU & GPU Microprocessors
  • Notebook Computer CPU & GPU microprocessors
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  • Battery Cell Cooling & Thermal Management
  • Infotainment Heat Spreading Vapor Chambers
  • Human Machine Interface Cooling Solutions
  • Lightweight Cooling for Sensor and Camera Systems
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