3D Vapor Chamber Assemblies

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Maximize Usable Volume

Leverage total available vertical thermal management volume with effective, isothermal two-phase heat transport & cooling.

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Enable Longer Product Lifetimes

high-precision temperature control, rapid temperature recovery, and long life under demanding conditions

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Tight Temperature Control

Cool evenly across large device surfaces

Boyd has taken the concept of vapor chamber heat spreading to the next dimension with specialized air-cooled heat sinks that incorporate vapor chambers not only in the base, but in the fins as well. Attached to the vapor chamber extensions are high density stamped, zipper, or folded fins, resulting in a 3D Vapor Chamber Heat Sink Assembly. This compact fin structure paired with fast heat spreading of vapor chambers enable 3D Vapor Chamber Heat Sink Assemblies to provide isothermal, high-performance air cooled thermal management.

These compact, high performance air-cooled heat sinks are designed to meet the most demanding electronics cooling requirements in both commercial and military applications.

Boyd has two styles of 3D vapor chambers: one with vertical round tube extensions from the main vapor chamber region and one with flat tube extensions. 3D Vapor Chamber Heat Sink Assemblies are typically configured for 2U to 6U rack heights, but can be designed to fit and perform in your custom application. Boyd’s thermal engineers will balance your system airflow requirement with 3D Vapor Chamber Heat Sink dimension constraints and performance characteristics.

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Key Industries


  • High Performance GPU and CPU air cooling
  • Computer Server Microprocessors
  • Embedded Computing Applications
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  • ATX Chassis
  • Military Radars
  • Mobile Electronics
  • Microwave/RF Cooling
  • Telecommunication Electronics
  • Military Electronics Cooling
  • Vetronics in Ground and Surface Vehicles
  • Avionics in in Unmanned and Manned Aircraft
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  • Medical Equipment Electronics
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