Cold Plates for AI Server Cooling
Boyd’s high-performance liquid cold plates directly cool GPUs, TPUs, and AI accelerators at the chip level. Our cold plates maximize thermal transfer, enhance reliability, and support scalable system performance, making them ideal for high-density data center workloads and next-generation AI servers. Boyd engineers each cold plate for optimized performance with liquid cooling loops, manifolds, and coolant distribution units (CDUs), delivering dependable, high-efficiency thermal control for training and inference applications.
Direct-to-Chip Precision Cooling
Efficiently removes heat from GPUs, TPUs, and AI accelerators for consistent high-performance operation.
Scalable and Flexible Integration
Customizable designs fit dense rack layouts and integrate seamlessly with liquid cooling loops, CDUs, and manifolds for adaptable AI infrastructure.
Energy-Efficient Thermal Management
Optimized liquid flow and low thermal resistance reduce energy usage while maintaining peak cooling efficiency.
Reliable and Durable Design
Precision-engineered and manufactured for long-term stability under high-density workloads, minimizing downtime and performance loss.
Why Data Centers Choose Boyd Cold Plates
High-density clusters, AI servers, and GPUs generate excessive heat that challenges traditional cooling techniques. Boyd’s precisely designed liquid cold plates provide direct-to-chip thermal management, ensuring stable operation and efficient heat transfer for inference and training workloads. For hyperscale, edge, and cloud AI deployments, our cold plates effectively integrate with Boyd coolant distribution units and manifolds, enabling adaptable, scalable liquid cooling solutions. Boyd helps data centers maintain uptime, boost performance, and manage energy efficiently with robust designs, proven reliability, and materials engineered for high-power processors.Boyd Cold Plates: Custom, High-Performance, Reliable
Boyd prioritizes performance, scalability, and dependability when designing liquid cold plates. Our solutions maintain stable operation in dense server configurations by efficiently removing heat from high-power processors. Customized geometries, optimized materials, and tested performance enable streamlined integration with CDUs, manifolds, and liquid loops. Boyd helps data centers balance operational reliability, energy efficiency, and thermal performance from design through deployment.Have a Question?
Boyd’s liquid cooling technologies enhance AI deployment ease and speed with the NVIDIA GB200 NVL72
How Liquid Cold Plates Solve AI Server Cooling Challenges
Concentrated heat generated by high-density AI servers and compute clusters reduces performance and reliability. Boyd’s liquid cold plates deliver a direct-to-chip cooling pathway that rapidly removes processor heat and ensures steady performance for both training and inference workloads. Cold plates manage heat effectively across dense rack layouts without increasing the footprint by integrating seamlessly with liquid manifolds and Boyd CDUs. Operators can scale cooling solutions as workloads grow with our precisely engineered designs, which minimizes hotspots and ensures uniform heat transfer. Cold plates increase energy efficiency and create a more sustainable and quieter data center environment by reducing reliance on loud, high-speed air cooling. Using robust materials and modular designs, Boyd cold plates deliver consistent performance under demanding conditions, confidently supporting crucial AI infrastructure.Advanced Cold Plate Solutions for AI Servers
Boyd cold plates deliver targeted, high-performance cooling directly at the chip level, keeping AI servers and GPU clusters stable under demanding workloads. Efficient heat transfer reduces hotspots and supports continuous operation for both training and inference environments.
Built with optimized materials and proven reliability, Boyd cold plates integrate easily with CDUs, manifolds, and rack systems. The modular, adaptable design allows data centers to expand capacity, optimize layouts, and maintain consistent thermal performance across high-density infrastructure.
- Direct-to-chip cooling for AI processors
- Integration with CDUs, manifolds, and liquid loops
- Modular, scalable designs for dense racks
- High thermal efficiency with tested reliability
Liquid Cooling System (LCS) for AI and ML Data Centers
Efficient Thermal Management
Rapid heat transfer ensures stable operation for AI processors and GPUs.
Modular & Scalable
Flexible design supports edge, hyperscale, and cloud AI racks of any density.
Cold Plates for AI Server Cooling FAQs
Which cold plate is best for cooling high-density AI servers?
Boyd cold plates are modular and scalable, providing high-efficiency, direct-to-chip cooling for dense AI servers and GPU clusters. We customize solutions to match your rack layout and thermal requirements.What’s the cost of custom cold plates for AI GPUs like H100?
Costs vary based on server density, thermal load, and materials. Boyd collaborates with you to design a solution that balances performance, reliability, and budget. Request a custom quote to get precise pricing.Can cold plates be used for both inference and training workloads?
Yes. Boyd cold plates maintain stable temperatures across both training and inference systems, ensuring consistent performance and protecting high-density compute clusters.Are Boyd’s cold plates compatible with my existing cooling infrastructure?
Boyd cold plates integrate seamlessly with CDUs, manifolds, and liquid loops. We design each solution to fit your current system while supporting scalable future expansion.What are the thermal specs or performance metrics I should expect?
Boyd cold plates move heat quickly from processors to liquid loops, minimizing hotspots, lowering energy use, and keeping AI servers and GPU clusters stable under high-density workloads. Thermal specifications are dependent on the final design. Boyd engineers are experts at meeting demanding performance needs and help you reach your thermal goals.Have questions? We’re ready to help!