Thermally Conductive Gap Fillers

Ideal for multi-level, multi-device, heat transfer.

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Thermally Conductive Gap Fillers are soft, malleable interface materials with high thermal conductivity. Gap fillers are ideal for applications with significant distances between the heat source and cooling surface, varying component heights, high tolerance stack up variability, and uneven or rough surfaces. The number of available material options and formats make gap fillers a popular component to thermal management solutions.

Boyd’s Transtherm® Gap Fillers materials are gel-like materials composed of either a silicone or silicone-free compound, free of air gaps and pores The conformability of Transtherm® Gap Fillers eliminates air between surfaces with higher conductivity materials to reduce thermal resistance. The volume of the gap filler remains constant so it will thin and spread out with applied pressure. Smaller gap filler pads require less pressure to thin out compared to larger pads.

Transtherm® Gap Fillers are naturally tacky on at least one side, which improves handling during assembly. Some materials are available with tackiness on both sides. Softer materials tend to have higher tackiness.

Transtherm® Thermally Conductive Gap Fillers fall into three groups: Silicone Gap Fillers, Silicone-Free Gap Fillers, and Putty-type Gap Fillers. Silicone and Silicone-Free Gap fillers are easily converted for specific applications and can be laminated with other materials or pre-applied to other Boyd supplied components. Putty-type gap fillers have an extreme level of wettability and conformability, but do not rebound to original shape after pressure is removed from the material. Products with putty-type gap fillers pre-applied are shipped with protective shields to prevent smudging and accidental contact prior to assembly.

Boyd’s Transtherm® Thermally Conductive Gap Fillers conform with REACH and RoHS regulations.

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Product Details

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Thermally Conductive Gap Filler Materials

Thermal interface material ideal for rough surfaces and uneven heights. Available in a variety of Shore OO hardnesses and continuous use temperature ranges.

  • Highly compliant material with a broad range of options
  • Can offer low vibration and stress damping
  • Can provide electrical isolation for low to medium power applications
  • Silicone-Free
  • Highly compliant silicone alternative materials
  • Ideal for preventing silicone migration for more sensitive electronic and cosmetic assemblies
  • Can offer low vibration and stress damping
  • Can provide electrical isolation for low to medium power applications
  • Putty Type
  • Can be implemented in automated dispensing line for high volume applications
  • Material can deflect more than silicone or silicone sheet materials, eliminating small gaps and air pockets
  • Ideal for complex assemblies that require little to no maintenance or re-workability

Thermally Conductive Gap Filler Solutions

  • Accommodate tight tolerance stack up with highly compliant gap fillers
  • Utilize softer gap filler materials to prevent warping or added stress on delicate PCB assemblies
  • Reduce assembly complexity by utilizing a single gap pad for multiple heat sources
  • Thermally join heat sources across larger distances compared with that of other thermal interface materials than other thermal interface materials can.
  • Laminate gap fillers with other materials like adhesives to reduce assembly time and costs
  • Extend product life and reliability by combining sheet materials with other vibration damping solutions like grommets, bushings, and stamped dampers for comprehensive vibration mitigation and absorption solutions.

Key Industries

Hover over the Key Industries below to see popular applications for Heat Shields

Enterprise Electronics

  • Mass Data Storage Drives
  • DIMM Card Thermal Solutions
  • Memory and VRAM Chip Cooling Solutions
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  • Battery Pack Assemblies
  • Electronic Control Units
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    Consumer Electronics

  • Electronic Kitchen Appliances
  • Smart Home Devices
  • Smart Home Assistants
  • Home Entertainment Systems
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