Thermal epoxies create a strong mechanical bond between surfaces while offering high heat transfer and high voltage isolation. These specialized epoxies are mixed with thermally conductive fillers like ceramics or metallic particles that enable heat to easily transfer through the material. Thermal epoxy can act as both a thermal interface material and a mounting method to reduce the amount of mounting hardware utilized in a product or application.
Epoxy compounds offer low shrinkage and coefficients of thermal expansion comparable to copper or aluminum. They bond easily to metals, ceramics, most plastics and a wide variety of other materials.
Thermalbond™ provides exceptional adhesion to copper, aluminum, steel, glass, ceramics and most plastics while possessing a coefficient of thermal expansion that is extremely compatible with aluminum, copper and brass. Once cured, Thermalbond is exceptionally resistant to environmental hazards.
