Thermally Conductive Epoxy


Easy Bonding

to metals, ceramics, silica, steatite, alumina, sapphire, glass and plastics


Improved Performance

improved thermal conductivity between joined surfaces



Mix and match heat sink bases and fins for customized epoxy bonded heat sinks

A thermal epoxy creates a strong mechanical bond between surfaces while offering high heat transfer and high voltage isolation. These specialized epoxies are mixed with thermally conductive fillers like ceramics or metallic particles that enable heat to easily transfer through the material. Thermal epoxy can act as both a thermal interface material and a mounting method to reduce the amount of mounting hardware utilized in a product or application.

Epoxy compounds offer low shrinkage and coefficients of thermal expansion comparable to copper or aluminum. They bond easily to metals, ceramics, most plastics and a wide variety of other materials.

Thermalbond™ provides exceptional adhesion to copper, aluminum, steel, glass, ceramics and most plastics while possessing a coefficient of thermal expansion that is extremely compatible with aluminum, copper and brass. Once cured, Thermalbond is exceptionally resistant to environmental hazards.

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Key Industries


  • Power Supplies
  • Power Inverters & Converters
  • Transistor Mounting
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    Agriculture & Construction

  • Traction Control Bonded Fin Heat Sinks
  • Enclosure Ruggedization
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  • Enclosure & Chassis Bonding
  • Thermocouple Embedding for Test Equipment
  • Power Supplies
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