Boyd’s Max Clip™ System is a high performance, low cost thermal solution for discrete power semiconductors. This thermal system combines Boyd’s Max Clips with specialized extruded Max Clip Heat Sinks for optimized thermal contact. The system eliminates the need for mounting holes, screws or rivets while optimizing contact and thermal efficiency of the heat sink. Max Clips™ are quick, robust attachments that save on labor and hardware costs while increasing design flexibility.
Max Clips™, apply consistent, uniform pressure at the center of the semiconductor, improving contact with the heat sink for better thermal performance and maximum component reliability. Max Clips™ maintain constant assembly force, even as interface material deteriorates or shifts over time. As compared to conventional nuts, bolts, and rivets where mounting force is set at the time of assembly and can lessen over the product’s service life, Max Clips™ enable enhanced long term reliability.
Boyd offers more than 50 standard Max Clip extrusion profiles that feature specialized geometries and groove patterns optimized for use with over 20 different Max Clips to suit a wide range of applications. The Max Clip™ System is designed to accommodate a variety of semiconductor packages including TO-220, TO-218, TO-247, TO-3P, and packages without mounting holes like TO-262, TO-273, TO-274, and TO-251.
For rapid thermal modeling and comparison of multiple heat sink constructions please try Genie our heat sink design tool.