Air Cooled Chassis & Enclosures

Combine Mechanical Support and Protection with Thermal Management


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Integrated enclosures or chassis that include thermal management technologies help engineers reduce application size, weight and power (SWaP) consumption as their requirements become more stringent. Creative engineers are more frequently incorporating heat spreading, thermal joints, and other technologies into enclosure designs so that these enclosures and chassis act as both a structural and thermal solution to replace traditional, mechanical-only enclosures.

Additional surface area or improved heat spreading increases heat transfer away from thermal loads and to the chassis which dissipates heat to ambient air. Air Cooled Chassis and Enclosures can be designed for natural convection for rugged, high reliability requirements or benefit from the addition of a fan or blower for air cooling.

Popular fabrication methods include aluminum die casting, sheet metal bending, welding, dip brazing, and vacuum brazing as well as integrating two phase or graphite heat spreading technologies such as heat pipes and k-Core encapsulated graphite.

Dip Brazed Aluminum Enclosure and Chassis for Air Cooled Systems

Air Cooled Chassis & Enclosure Solutions:



Air-Cooled Chassis for PCB

Air Cooled Chassis & Enclosures

Designed or adapted for specific requirements and to balance size, weight, power dissipation, and cost (SWaP-C), Boyd offers a wide variety of options in materials, fin types, integrated technologies, and mounting to ensure that your air-cooled systems are reliable and durable.

Aluminum Die Cast and Sheet Metal Air Cooled Enclosure for Telecommunications Electronics

Modified Die Cast Enclosures

Extend the thermal performance of traditional die cast enclosures by embedding heat spreading components like heat pipes, encapsulated graphite, or vapor chambers.

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