k-Core® Graphite Technology

The patented k-Core® heat transfer system uses encapsulated graphite to help alleviate heat in high-power electronics for applications in aerospace, military, and commercial applications. The k-Core® material uses APG as an insert within an encapsulating structure. k-Core® can be fabricated by employing most conventional thermal management materials as the encapsulant like aluminum and copper alloys, ceramics, and composites, as needed by end application. Light in weight, the passive k-Core® system is highly conductive thermally and offers designers the ability to tailor coefficients of thermal expansion (CTE) if needed. The k-Core® heat transfer system is typically designed for a specific application by our experienced engineering team.

Because k-Core® can be encapsulated in a wide range of conventional thermal management metals and materials, k-Core® heat transfer products provide “drop-in” replacements for the solid metal conductors. As a result, thermal designers can significantly reduce their electronic component temperatures, thereby improving performance, reliability and greatly prolonging the life of your most valued electronics systems.

k-Core® products are used in aerospace satellites, avionics, and military aircraft such as the F-35, F-22 and F-16 fighter planes. k-Core® thermal management products also cool high power density electronic packaging, power electronics and other applications requiring high-performance heat transfer.

The k-Core® Product Line:

•Patented encapsulated APG material system has three times the conductivity (k) of copper with the mass of aluminum

•APG graphite provides a high k path

•Encapsulant sets the CTE and structural properties

•Encapsulant material is selected to satisfy requirements

•Drop-in replacement for conventional conduction solutions



Material

Thermal Conductivity (W/mK)

Density (g/cm3)



Coefficient of Thermal Expansion (CTE)  (ppm/K)



Specific Conductivity  (conductivity/ density)
(W/m·K/g/cm3)

w/o APG insert

with k-Core®

w/o APG insert

with k-Core®

w/o APG insert

with

k-Core®

Copper (OFHC)

390.0

1176.0

8.90

4.92

16.9

43.8

239.2

Beryllium

220.0

1108.0

1.80

2.08

13.5

122.2

533.7

Aluminum Beryllium (62% Be)

210.0

1104.0

2.10

2.20

13.9

100.0

502.7

Aluminum (6061)

180.0

1092.0

2.80

2.48

23.6

64.3`

441.0

AlSi (40% Si)

126.0

1070.4

2.53

2.37

15.0

49.8

452.0

Magnesium (AZM)

79.0

1051.6

1.80

2.08

27.3

43.9

506.6

Kovar

14.0

1025.6

8.40

4.72

5.9

1.7

217.5



Custom thermal management solutions are tailored to specific user needs. From one-of-a-kind spacecraft components that satisfy specific and demanding requirements to the production runs, Aavid has the expertise and experience to solve your thermal management challenges.



 

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