As electronics continue to become more powerful and require more functionality with greater reliability, excess heat remains a significant barrier to the development of better performing next generation applications and breakthrough innovation. Every industry, especially Mobile, Medical, Telecommunications, and IoT are developing new products and systems that must be lightweight, multi-functional, and able to manage high heat loads with high reliability. Engineers struggle to effectively handle the heat as consumers demand smaller, thinner, more powerful devices with more options, functionality, and capabilities.
Two phase cooling is rapidly evolving and gaining more popularity in solving these issues. Heat pipes are especially ideal to spread heat for faster dissipation, light weighting, higher reliability, and lifetime. But heat pipes most significant benefit is design flexibility and the ability to easily integrate them into thermal systems to vastly improve cooling efficiency and capacity.
For more information on the various two phase technologies, including heat pipes, vapor chambers, thermosiphons, and immersion cooling, view Boyd’s Guide to Two Phase Cooling.
The addition of heat pipes to your solution or system can vastly improve its thermal performance for more efficient thermal management without adding active components that may be detrimental to application lifetimes, reliability, or accuracy.
Active air cooling or liquid cooling can be large or cumbersome. Active air cooling comes with complications such as acoustics, weight, and vibration. Not all applications have infrastructure that supports liquid cooling systems. Two phase cooling is being leveraged to extend air cooling system performance, solves acoustic and vibration issues, and leverages existing cooling infrastructure.