Heat Spreader and Conductive Chassis
Heat spreaders and chassis rapidly spread heat away from heat sources and can also provide products with structural support or mechanical protection.
Increase Heat Distribution
Boost conduction to additional surface area like heat sinks or heat exchangers.
Optimize Heat Transfer
Rapidly and evenly distribute high density heat loads.
Lightweight
Replace metal conduction solutions with advanced, high conductivity graphite without sacrificing robustness.
Heat Spreader and Conductive Chassis
Heat spreaders and thermally conductive chassis offer more uniform, and efficient heat transfer without active components like pumps or fans. By combining our material and thermal management expertise, Boyd’s heat spreaders can act both as a thermal management solution and as structural support.
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What Are Heat Spreaders and Thermal Chassis?
Heat Spreaders or thermal doublers are specialized components that are designed to spread heat away from high heat flux components to reduce localized temperatures. Thermal chassis are components that act both as conductive thermal solution and a mechanical support structure for a product.
How Do Heat Spreaders and Chassis Work?
Heat spreaders and conductive chassis leverage high thermal conductivity materials to spread heat away from heat sources, decreasing localized temperatures. Heat spreaders and chassis may either dissipate heat directly from their surfaces or connect to additional cooling technologies like heat sinks, radiator panels, or liquid cooling systems.
Why Use Heat Spreader and Conductive Chassis?
Heat spreaders are an ideal solution for rapidly and evenly distributing high density heat loads. Heat spreaders are often used to increase heat distribution to additional surface area like heat sinks or heat exchangers, which improves the overall thermal performance of the assembly. As a passive solution, heat spreaders and conductive chassis don’t require moving components, meaning high reliability, less wear and tear, and low maintenance.
Boyd’s Advanced Conduction Solutions
Boyd is the world leader in creating advanced conduction solutions utilizing encapsulated graphite to combine lightweight, highly thermally conductive graphite into either machinable or flexible formats in our k-Core® product line.
Efficiently Spread and Transport Heat
Encapsulated graphite structures utilize the high thermal conductivity of annealed pyrolytic graphite (APG) to spread heat evenly and quickly away from sensitive components within a sealed mechanical envelope. Since graphite is brittle and flaky, this envelope prevents graphite particles from becoming foreign object debris within a device, negating the inherent potential of brittle graphite flakes causing a device to short or contamination of a clean environment. As graphite is a lightweight, high conductivity material, encapsulated graphite heat spreaders offer an innovative solution to drive weight savings or smaller formats without sacrificing performance.
k-Core®
Boyd utilizes our patented k-Core® technology to fabricate encapsulated graphite heat spreaders and chassis. Annealed pyrolytic graphite is first designed, shaped, and then inserted within an encapsulating structure. This incorporates the high strength of metals, ceramics, or composites and high thermal conductivity in a single component. The thermal conductivity of APG ranges between 1000 W/mK to >1500 W/mK with thickness down to 0.017mm, making it one of the best commercially available conductive materials.
Coefficient of Thermal Expansion (CTE) Matching
k-Core® solutions provide a lightweight, highly conductive graphite heat spreader or thermal ground plane that enables thermal engineers to tailor the coefficients of thermal expansion as needed. The encapsulating material sets the CTE and structural properties of the encapsulated graphite chassis or enclosure. This enables direct bonding or more robust solutions for challenging applications.
Aerospace
Satellite radiator panels and high performance avionics
Defense
Avionics and aircraft equipment thermal management systems
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