Beyond Liquid Cooling: Boyd Strengthens AI Cooling Innovation Capabilities with Durbin Group Acquisition

Boyd Acquires the Durbin Group to Enhance its Liquid Cooling System Technology Portfolio with Advanced Two-Phase Liquid Cooling Capabilities that Address Thermal Requirements of Next-Generation AI Processors

Boyd’s latest acquisition, the Durbin Group, strengthens Boyd’s innovation capabilities in liquid cooling system technologies critical for high-performance compute, artificial intelligence (AI), and advanced data centers. Boyd has solved thermal challenges in data centers since the advent of microprocessors. Boyd’s latest thermal innovations in liquid cooling have helped our customers accelerate their rapid transition from traditional air cooled to liquid cooled racks. Boyd has extensive liquid system design experience having shipped over 40 thousand liquid cooling systems to high-performance compute, hyperscaler, and semiconductor customers. Boyd also designs and manufactures liquid cold plates which cool processors and complement the liquid cooling system. To date, Boyd has shipped to key enterprise customers over 4 million liquid cold plates incorporated into 1 million liquid loops.

The Durbin Group has a long, trusted history designing advanced liquid cooling systems for enterprise, aerospace, and defense markets. These systems cool high-performance compute, power conversion, and directed energy applications. The latest AI, defense, and data center applications require single-phase liquid cooling technology, but next-generation designs require even more sophisticated two-phase liquid cooling technologies. The Durbin Group’s expertise and heritage in single and two-phase liquid cooling systems will enhance Boyd’s development efforts to address current and next-generation thermal management needs.

“We’re investing in strong engineering talent to expand Boyd’s liquid system design capacity and accelerate our liquid cooling system development. Significant market growth in high-performance data centers and artificial intelligence will continue for the foreseeable future, and this demand requires liquid cooling to scale,” said Boyd CEO Doug Britt. “We are a global leader in the design and manufacturing of liquid systems, cold plates and liquid cooling loops that directly cool high-power microprocessors. Our liquid cooling systems have cooled high-reliability semiconductor, defense, and medical applications for decades. We are well positioned to deliver complete, optimized, leak-free liquid cooling systems to AI customers at scale.”

Durbin Group Joins Boyd

We are excited to announce that we strengthened our liquid cooling system team and capability with the Durbin Group acquisition.

Boyd acquired the Durbin Group to further augment its liquid cooling system technology portfolio. Durbin’s single phase liquid cooling system knowledge and advanced two-phase liquid cooling capabilities strengthen Boyd’s solutions for aerospace and defense markets and address the thermal challenges of next-generation AI Processors. For more information on Boyd’s acquisition of Durbin Group, please see the press release here:

Press Release: Boyd Acquires Durbin Group