As market pressures demand higher product performance in smaller form factors power densities have increased exponentially. This has resulted in more complex thermal solutions to the point that current modeling software is no longer capable of accurately predicting product performance.
Boyd Corporation, has developed Boyd SmartCFD to bridge the gap between theoretical and real world thermal performance. Boyd SmartCFD has encrypted decades worth of manufacturing expertise, testing, and performance data into Smart Object models for improved thermal design and analysis. With increased accuracy for complex systems, assemblies and components, Boyd SmartCFD enables reduced design cycles, prototype testing, and project costs.
Boyd SmartCFD is a new simulation software that allows users to simulate the flow characteristics and thermal performance inside both simple and complex systems. It is optimized for detailed heat transfer and fluid flow simulations in electronic systems and offers streamlined use through automation tools, intuitive design interface and multiple solver options. These solver options range from an efficient, correlation-based System Solver and a detailed Computational Fluid Dynamics (CFD) Solver. Users like engineers and scientists can benefit from Boyd SmartCFD since it helps increase a product's quality, reduce its time-to-market, and cut design costs.