Encapsulated Graphite Heat Spreaders are lightweight heat spreading solutions with added mechanical strength. Heat Spreaders are critical to product success as electronics increase in power and density, generating more heat that requires effective management. Encapsulated Graphite Heat Spreaders utilize high thermal conductivity of Annealed Pyrolytic Graphite (APG) to spread heat evenly and quickly away from sensitive components within a sealed mechanical envelope. Since graphite is brittle and flaky, this envelope prevents graphite particles from becoming foreign object debris within a device, negating the inherent potential of brittle graphite flakes causing a device to short or contamination of a clean environment.
Boyd Corporation utilizes our patented k-Core® technology to fabricate Encapsulated Graphite Heat Spreaders. This process integrates high heat spreading APG cores with the strength of metals, ceramics, or composites in a single component. Or we can utilize thinner, more flexible materials such as polyimide films for ultra-thin graphite heat spreaders for low profile applications. Polyimide films are a cost-effective alternative to traditional metal or ceramic encapsulants, making it ideal for high volume applications. As graphite is a lightweight, high conductivity material, Encapsulated Graphite Heat Spreaders offers an innovative solution to drive weight savings or smaller formats without sacrificing performance. Encapsulated Graphite Heat Spreaders and Radiator Panels enable designers to passively and reliably leverage graphite’s performance in a safe and contained unit, improving the reliability, lifetime and efficiency of expensive electronics.
In addition to the heat spreading capacity of graphite, we further customize Encapsulated Graphite Heat Spreaders by integrating additional, complementary thermal management technologies. By adding finned regions to a Graphite Heat Spreader, engineers provide additional surface area and thermal performance in natural convection from ambient air or forced convection from fans or blowers for higher heat dissipation.
VPX-VME Heat Spreader Data Sheet
k-Core® Data Sheet
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Aavid’s patented k-Core® technology encapsulates graphite to enable passive thermal management for a variety of applications. Annealed Pyrolytic Graphite is first designed, shaped, and then inserted within an encapsulating structure. We use an array of thermally conductive materials such as aluminum or copper alloys, ceramics, or composites as the encapsulating material and dependent on specific application requirements. k-Core® solutions provide a light weight, highly conductive graphite heat spreader that enables thermal engineers to tailor the coefficients of thermal expansion (CTE) as needed. The encapsulating material sets the CTE and structural properties of the encapsulated graphite chassis or enclosure.
k-Core® Graphite Heat Spreader technology can easily replace traditional solid metal conductors or heat spreaders because it can be customized for a specific application. Pyrolitic graphite is derived from a carbonized polymer and calendared to extraordinarily thin sheets. The thermal conductivity of APG ranges between 1000 W/mK to >1500 W/mK with thickness down to 0.017mm, making it one of the best commercially available conductive materials. Pyrolytic Graphite offers ten times the thermal conductivity of stainless steel and as much as five times that of copper.
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