Enable lighter, safer, more reliable, better performing medical wearable devices that maintain greater accuracy, connectivity, and lifetime by utilizing this Boyd Engineered Materials and Thermal Management Solutions Guide. This paper provides a solid knowledge base for the types of solutions necessary for Medical Wearable Device challenges such as light weighting, limited space, and cost efficiency.
Coolant Distribution Units (CDUs) for Enterprise, Cloud and 5G Applications, when designed correctly, significantly improve thermal efficiency, optimize cooling and application performance, and can decrease the size of your thermal solution. Download this article to better understand CDU design and considerations for improved data processing and storage.
Download this article on how and when to utilize two phase cooling technologies and their design considerations. This includes solutions such as heat pipes, vapor chambers, thermosiphons, immersion cooling and multi-function integrations that enable smaller volumes, less weight, and better performance.
This article covers technologies for advanced telematics and display innovation as well integrated solutions and manufacturing processes that help OEMs reduce weight, lower total landed cost, and streamline supply chain. It includes the full spectrum of solutions ideal for E-mobility advanced display applications.
This paper addresses current trends in liquid cooled systems and focuses on chiller use and applications. This includes chiller standards and design guidelines for utilizing chillers to increase efficiency, improve performance and better maintain strict temperature control for high heat load applications.
Learn how Boyd Corporation and 3M™ have partnered together to focus on highly engineered optical films for mobile electronics in this white paper.
Cutting Edge Display Materials and Techniques from Boyd Corporation and 3M that will improve display performance, ease of assembly, and display quality for integrated electronics within all major industries.
Aavid, Thermal Division of Boyd Corporation developed a combined solution using copper-water mini-heat pipe and kCore encapsulated graphite heat spreader for direct thermal management of high performance ASIC (Flip-Chip and Microprocessors) and have successfully achieved qualification for space flight status.
Increasing the ability to integrate components into chassis elements, directly cool electronics components, and improve the functionality against gravity.
Overheating is one of the leading causes of electronic product failure and to overcome thermal limitations of next-generation electronics, design engineers require advanced materials and highly customized solutions.
A guide to printed circuit board (PCB) design with thermal management in mind – save time, money, and frustration when you think ahead thermally. Download Now.