Technical Papers
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Highly Engineered Optical Films for Mobile Electronics
Learn how Boyd Corporation and 3M™ have partnered together to focus on highly engineered optical films for mobile electronics in this white paper.
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Bezel Bonding and Display Gaskets for Integrated Electronics
Cutting Edge Display Materials and Techniques from Boyd Corporation and 3M that will improve display performance, ease of assembly, and display quality for integrated electronics within all major industries.
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Advancements in Blower Technology
A reference guide to how heat sinks work and when to use different heat sink fabrication methods.
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Boyd Heat Sink Fabrications Guide
A reference guide to how heat sinks work and when to use different heat sink fabrication methods.
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Space Electronics Qualification for Heat Pipes and Encapsulated Graphite Technologies
Aavid, Thermal Division of Boyd Corporation developed a combined solution using copper-water mini-heat pipe and kCore encapsulated graphite heat spreader for direct thermal management of high performance ASIC (Flip-Chip and Microprocessors) and have successfully achieved qualification for space flight status.
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Additive Manufactured Titanium-Ammonia Heat Pipes for Space Electronic Devices
Increasing the ability to integrate components into chassis elements, directly cool electronics components, and improve the functionality against gravity.
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EMI/RFI Considerations & Choosing Your Solution
This article discusses the growth of potential EMI sources and how to characterize your EMI challenge.
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Liquid Cooling Solutions in Electric Vehicles
Creating Competitive Advantage in eMobility Applications
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Thermal Interface Materials for Next-Generation Electronics
Overheating is one of the leading causes of electronic product failure and to overcome thermal limitations of next-generation electronics, design engineers require advanced materials and highly customized solutions.
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Ultra-Thin Titanium Vapor Chambers
With the increasingly rapid evolution of high performing mobile electronics, Titanium solutions and ultra-thin vapor chambers may eventually be the new standard solutions for cooling these devices.
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How to Select A Heat Sink
White paper describing the basics of heat sink design and selection. Download Now.
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Air vs Liquid: Advancements in Thermal Management
As you consider the switch to liquid cooling in order to improve the performance of your power electronics devices and facilities, there are several key determining factors.
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A Guide to Designing Your Board to Avoid Thermal Mistakes
A guide to printed circuit board (PCB) design with thermal management in mind – save time, money, and frustration when you think ahead thermally. Download Now.
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A Guide to Thermal Management Considerations for Medical Devices
A guide to key considerations when developing thermal management solutions for the medical device industry. Download Now.
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EMI
Minimize negative impacts of electromagnetic interference (EMI) through impact analysis and effective component design featuring optimized materials for trusted compliance.
EMI White Paper (PDF)
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Optically Clear Adhesives
Optimize transmittance and improve the brightness and contrast of touch screens and display modules with optically clear adhesive (OCA). Learn more here!
OCA White Paper (PDF)
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SOLIMIDE®
Discover why our polyimide foam product, SOLIMIDE® Foams, was designed into some of the first NASA programs and why it is unique in the foam spectrum.
SOLIMIDE White Paper (PDF)
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Thermal Management
Thermal management is often the bottleneck to design innovation. Learn how to model thermal constraints and design passive thermal management systems to improve thermal thresholds.
Thermal White Paper Final (PDF)
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Noise, Vibration, and Harshness
Learn how to identify Noise, Vibration and Harshness (NVH) excitation forces, structural responses and acoustic and damping control methods.
NVH Technical Introduction (PDF)
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