Technical Papers
Boyd Additive Manufactured Heat Pipe Technology
This paper introduces additive manufactured (AM) heat pipes and other advanced thermal management technologies, previously presented as a Keynote Lecture at the 16th UK Heat Transfer Conference at the University of Nottingham.
Power Electronics High Performance Air-Cooled Heat Sinks Integrating Graphite Based Materials
This paper is conceived as a summary of the project developments and results at heat sink level, presenting the overall concept, the materials involved, and the experimental and numerical results obtained, which achieve the expected performances in terms of heat transfer, pressure drop and weight. The outcome of these results can suggest to reconsider the power electronics cooling design in other applications outside the aircraft sector, for example within Power Conversion applications or automotive field.
Medical Wearable Device Solutions Guide
Enable lighter, safer, more reliable, better performing medical wearable devices that maintain greater accuracy, connectivity, and lifetime by utilizing this Boyd Engineered Materials and Thermal Management Solutions Guide. This paper provides a solid knowledge base for the types of solutions necessary for Medical Wearable Device challenges such as light weighting, limited space, and cost efficiency.
Boyd CDUs Improve Cooling and Performance of Cloud, Enterprise & 5G Applications
Coolant Distribution Units (CDUs) for Enterprise, Cloud and 5G Applications, when designed correctly, significantly improve thermal efficiency, optimize cooling and application performance, and can decrease the size of your thermal solution. Download this article to better understand CDU design and considerations for improved data processing and storage.
Two Phase Thermal Solution Guide
Download this article on how and when to utilize two phase cooling technologies and their design considerations. This includes solutions such as heat pipes, vapor chambers, thermosiphons, immersion cooling and multi-function integrations that enable smaller volumes, less weight, and better performance.
EV Display Technology Solution Guide
This article covers technologies for advanced telematics and display innovation as well integrated solutions and manufacturing processes that help OEMs reduce weight, lower total landed cost, and streamline supply chain. It includes the full spectrum of solutions ideal for E-mobility advanced display applications.
Chillers & Sub-Ambient Cooling
This paper addresses current trends in liquid cooled systems and focuses on chiller use and applications. This includes chiller standards and design guidelines for utilizing chillers to increase efficiency, improve performance and better maintain strict temperature control for high heat load applications.
Highly Engineered Optical Films for Mobile Electronics
Learn how Boyd Corporation and 3M™ have partnered together to focus on highly engineered optical films for mobile electronics in this white paper.
Bezel Bonding and Display Gaskets for Integrated Electronics
Cutting Edge Display Materials and Techniques from Boyd Corporation and 3M that will improve display performance, ease of assembly, and display quality for integrated electronics within all major industries.
Advancements in Blower Technology
A reference guide to how heat sinks work and when to use different heat sink fabrication methods.
Boyd Heat Sink Fabrications Guide
A reference guide to how heat sinks work and when to use different heat sink fabrication methods.
Space Electronics Qualification for Heat Pipes and Encapsulated Graphite Technologies
Aavid, Thermal Division of Boyd Corporation developed a combined solution using copper-water mini-heat pipe and kCore encapsulated graphite heat spreader for direct thermal management of high performance ASIC (Flip-Chip and Microprocessors) and have successfully achieved qualification for space flight status.
Additive Manufactured Titanium-Ammonia Heat Pipes for Space Electronic Devices
Increasing the ability to integrate components into chassis elements, directly cool electronics components, and improve the functionality against gravity.
EMI/RFI Considerations & Choosing Your Solution
This article discusses the growth of potential EMI sources and how to characterize your EMI challenge.
Liquid Cooling Solutions in Electric Vehicles
Creating Competitive Advantage in eMobility Applications
Thermal Interface Materials for Next-Generation Electronics
Overheating is one of the leading causes of electronic product failure and to overcome thermal limitations of next-generation electronics, design engineers require advanced materials and highly customized solutions.
Ultra-Thin Titanium Vapor Chambers
With the increasingly rapid evolution of high performing mobile electronics, Titanium solutions and ultra-thin vapor chambers may eventually be the new standard solutions for cooling these devices.
How to Select A Heat Sink
White paper describing the basics of heat sink design and selection. Download Now.
Air vs Liquid: Advancements in Thermal Management
As you consider the switch to liquid cooling in order to improve the performance of your power electronics devices and facilities, there are several key determining factors.
A Guide to Designing Your Board to Avoid Thermal Mistakes
A guide to printed circuit board (PCB) design with thermal management in mind – save time, money, and frustration when you think ahead thermally. Download Now.
A Guide to Thermal Management Considerations for Medical Devices
A guide to key considerations when developing thermal management solutions for the medical device industry. Download Now.
EMI
Minimize negative impacts of electromagnetic interference (EMI) through impact analysis and effective component design featuring optimized materials for trusted compliance.
Noise, Vibration, and Harshness
Learn how to identify Noise, Vibration and Harshness (NVH) excitation forces, structural responses and acoustic and damping control methods.
Optically Clear Adhesives
Optimize transmittance and improve the brightness and contrast of touch screens and display modules with optically clear adhesive (OCA). Learn more here!
SOLIMIDE®
Discover why our polyimide foam product, SOLIMIDE® Foams, was designed into some of the first NASA programs and why it is unique in the foam spectrum.
Thermal Management
Thermal management is often the bottleneck to design innovation. Learn how to model thermal constraints and design passive thermal management systems to improve thermal thresholds.
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