Technical Papers

Engineer’s Guide to Hyperscale Network Material Applications

Explore upcoming trends and evolving material science design challenges for Hyperscale and Cloud Networks as processing and IoT/IoE are increasing tied to societal and consumer needs.

Material Solutions in EV Batteries

Explore the EV battery safety, reliability, performance, and range challenges that engineered material solutions help resolve.

7 Most Common Myths About Heat Pipes

As electronics continue to become more powerful and require more functionality with greater reliability, excess heat remains a significant barrier to the development of better performing next generation applications and breakthrough innovation.

Two Phase Thermal Solution Guide

Download this article on how and when to utilize two phase cooling technologies and their design considerations. This includes solutions such as heat pipes, vapor chambers, thermosiphons, immersion cooling and multi-function integrations that enable smaller volumes, less weight, and better performance.

Power Electronics High Performance Air-Cooled Heat Sinks Integrating Graphite Based Materials

This paper is conceived as a summary of the project developments and results at heat sink level, presenting the overall concept, the materials involved, and the experimental and numerical results obtained, which achieve the expected performances in terms of heat transfer, pressure drop and weight. The outcome of these results can suggest to reconsider the power electronics cooling design in other applications outside the aircraft sector, for example within Power Conversion applications or automotive field.

Medical Wearable Device Solutions Guide

Enable lighter, safer, more reliable, better performing medical wearable devices that maintain greater accuracy, connectivity, and lifetime by utilizing this Boyd Engineered Materials and Thermal Management Solutions Guide. This paper provides a solid knowledge base for the types of solutions necessary for Medical Wearable Device challenges such as light weighting, limited space, and cost efficiency.

Boyd CDUs Improve Cooling and Performance of Cloud, Enterprise & 5G Applications

Coolant Distribution Units (CDUs) for Enterprise, Cloud and 5G Applications, when designed correctly, significantly improve thermal efficiency, optimize cooling and application performance, and can decrease the size of your thermal solution. Download this article to better understand CDU design and considerations for improved data processing and storage.

Highly Engineered Optical Films for Mobile Electronics

Learn how Boyd Corporation and 3M™ have partnered together to focus on highly engineered optical films for mobile electronics in this white paper.

EV Display Technology Solution Guide

This article covers technologies for advanced telematics and display innovation as well integrated solutions and manufacturing processes that help OEMs reduce weight, lower total landed cost, and streamline supply chain. It includes the full spectrum of solutions ideal for E-mobility advanced display applications.

Chillers & Sub-Ambient Cooling

This paper addresses current trends in liquid cooled systems and focuses on chiller use and applications. This includes chiller standards and design guidelines for utilizing chillers to increase efficiency, improve performance and better maintain strict temperature control for high heat load applications.

Boyd Heat Sink Fabrications Guide

A reference guide to how heat sinks work and when to use different heat sink fabrication methods.

Bezel Bonding and Display Gaskets for Integrated Electronics

Cutting Edge Display Materials and Techniques from Boyd Corporation and 3M that will improve display performance, ease of assembly, and display quality for integrated electronics within all major industries.

Advancements in Blower Technology

A reference guide to how heat sinks work and when to use different heat sink fabrication methods.

Liquid Cooling Solutions in Electric Vehicles

Creating Competitive Advantage in eMobility Applications

Space Electronics Qualification for Heat Pipes and Encapsulated Graphite Technologies

Boyd Corporation developed a combined solution using copper-water mini-heat pipe and kCore encapsulated graphite heat spreader for direct thermal management of high performance ASIC (Flip-Chip and Microprocessors) and have successfully achieved qualification for space flight status.

EMI/RFI Considerations & Choosing Your Solution

This article discusses the growth of potential EMI sources and how to characterize your EMI challenge.

Air vs Liquid: Advancements in Thermal Management

As you consider the switch to liquid cooling in order to improve the performance of your power electronics devices and facilities, there are several key determining factors.

How to Select A Heat Sink

White paper describing the basics of heat sink design and selection. Download Now.

Thermal Interface Materials for Next-Generation Electronics

Overheating is one of the leading causes of electronic product failure and to overcome thermal limitations of next-generation electronics, design engineers require advanced materials and highly customized solutions.

A Guide to Thermal Management Considerations for Medical Devices

A guide to key considerations when developing thermal management solutions for the medical device industry. Download Now.

A Guide to Designing Your Board to Avoid Thermal Mistakes

A guide to printed circuit board (PCB) design with thermal management in mind – save time, money, and frustration when you think ahead thermally. Download Now.

Thermal Management

Thermal management is often the bottleneck to design innovation. Learn how to model thermal constraints and design passive thermal management systems to improve thermal thresholds.

SOLIMIDE®

Discover why our polyimide foam product, SOLIMIDE® Foams, was designed into some of the first NASA programs and why it is unique in the foam spectrum.

Optically Clear Adhesives

Optimize transmittance and improve the brightness and contrast of touch screens and display modules with optically clear adhesive (OCA). Learn more here!

EMI

Minimize negative impacts of electromagnetic interference (EMI) through impact analysis and effective component design featuring optimized materials for trusted compliance.

Noise, Vibration, and Harshness

Learn how to identify Noise, Vibration and Harshness (NVH) excitation forces, structural responses and acoustic and damping control methods.

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