Thermal

WSF-M Launch with k-Core® Thermal Doubler

WSF-M Launch with k-Core® Thermal Doubler

Thermal

The United States Space Force (USSF) prepares for an exhilarating launch in March 2024. USSF-62, an advanced satellite, stands poised to journey into orbit, armed with Boyd’s innovative k-Core® doubler technology. This mission involves the inaugural launch of a...
Boyd Loop Heat Pipes Set to Launch with NASA’s PACE Mission

Boyd Loop Heat Pipes Set to Launch with NASA’s PACE Mission

Thermal

NASA’s PACE Mission is set to launch on Feb 8th with Boyd’s loop heat pipes on board. This mission is the latest highlight in Boyd’s extensive, decades long, aerospace heritage. Boyd is proud to collaborate with NASA engineers to assist in the latest space missions to...
In-Rack Cooling vs In-Row Cooling

In-Rack Cooling vs In-Row Cooling

Thermal

Data Center Installations: In-Rack Cooling or In-Row Cooling? New artificial intelligence (AI) applications push rapid data center growth, leaving data center architects to quickly determine if in-rack cooling or in-row cooling is right for their installation....
UV Lithography and Semiconductor Industry

UV Lithography and Semiconductor Industry

Thermal

Rising Trend: Miniaturized Semiconductor Components As semiconductor geometries continue to shrink, advances in microelectronics are driving the development of powerful, smart, and sophisticated devices. This ongoing miniaturization trend propels semiconductor...
Cooling High-Power Electronics

Cooling High-Power Electronics

Thermal

Rise of Power: Increasing Power Demand for High-Performance Chips The semiconductor industry continues to drive Moore’s Law and push the boundaries of semiconductor chip power and performance. Higher performance, more powerful and complex chips generate more heat with...