The United States Space Force (USSF) prepares for an exhilarating launch in March 2024. USSF-62, an advanced satellite, stands poised to journey into orbit, armed with Boyd’s innovative k-Core® doubler technology. This mission involves the inaugural launch of a...
NASA’s PACE Mission is set to launch on Feb 8th with Boyd’s loop heat pipes on board. This mission is the latest highlight in Boyd’s extensive, decades long, aerospace heritage. Boyd is proud to collaborate with NASA engineers to assist in the latest space missions to...
Data Center Installations: In-Rack Cooling or In-Row Cooling? New artificial intelligence (AI) applications push rapid data center growth, leaving data center architects to quickly determine if in-rack cooling or in-row cooling is right for their installation....
Rise of Power: Increasing Power Demand for High-Performance Chips The semiconductor industry continues to drive Moore’s Law and push the boundaries of semiconductor chip power and performance. Higher performance, more powerful and complex chips generate more heat with...
Rising Energy Demand in Data Centers Growing demand for digital services, including cloud computing, artificial intelligence, and other data-intensive technologies is increasing global data center energy consumption. According to International Energy Agency (IEA),...
The Buzz Around Artificial Intelligence As Artificial Intelligence (AI) becomes increasingly powerful and sophisticated, organizations worldwide recognize the transformative potential of AI in driving market growth and gaining a competitive edge. Major advances in AI...
