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The Unsung Heroes of Data Center Efficiency: Rack Manifolds Liquid cooling provides a reliable way to manage rising heat loads as data centers expand for artificial intelligence, cloud, and high-performance computing. While liquid cold plates and CDUs (coolant...
Thermal
Boyd and NVIDIA: Driving AI Cooling Innovation The NVIDIA GB200 NVL72 platform sets new standards for AI and accelerated computing and demands robust, scalable thermal management. That is exactly what Boyd delivers. As a Recommended Vendor for the GB200 NVL72...
Thermal
Cooling AI & HPC: Unlocking Accelerated Computing Potential Next-generation higher density AI and high-performance computing (HPC) platforms demand powerful thermal management. Effective cooling unlocks the full potential of cutting-edge NVIDIA AI infrastructure,...
Thermal
Boyd Scales Next-Gen AI Infrastructure with the NVIDIA GB200 NVL72 System Large language models now surpass 1 trillion parameters, ushering in a new era of AI that demands next-generation technology. Meeting this scale requires powerful compute and innovative cooling...
Thermal
Boyd ROL2300: High-Density AI Cooling As Artificial Intelligence (AI) servers grow denser and thermal loads increase, liquid cooling plays a crucial role in high-performance data center infrastructure. Boyd’s ROL2300 Coolant Distribution Unit (CDU) meets modern data...
Thermal
Spacecraft Technology: Cryogenic Cooling to Graphite Composites Boyd has advanced human accomplishment for over 50 years. We have advanced thermal design innovation and developed cutting-edge solutions for extreme environments in space. Our technology enables...
